JPS5466777A - Manufacture for semiconductor device - Google Patents
Manufacture for semiconductor deviceInfo
- Publication number
- JPS5466777A JPS5466777A JP13379577A JP13379577A JPS5466777A JP S5466777 A JPS5466777 A JP S5466777A JP 13379577 A JP13379577 A JP 13379577A JP 13379577 A JP13379577 A JP 13379577A JP S5466777 A JPS5466777 A JP S5466777A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- grooves
- circumference
- chuck
- scaling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
PURPOSE: To make easy the wafer removal after exposure, by placing the glass mask having the pattern overlaid from the area of wafer on the Si wafer coating photo resist and by poviding grooves at the external circumference of wafer chuck provided at the rear surface.
CONSTITUTION: The pattern 5 of the glass mask 4 placed on the Si wafer is extended from the size of the wafer 1. Further, the wafer chuck 6 fixed with vacuum adsorption from the back of the wafer 1 is formed for the grooves 7 at the external circumference newly. With this constitution, when the mask 4 is placed on the photo resist film 3 coated via the SiO2 film on the wafer 1, air is immersed easily from the circumference of the wafer 1 at the end of exposure and scaling is made easy. Further, the absorbing force of the chuck 6 at the circumference is weakened due to the presence of the grooves 7 and scaling is progressed by this.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13379577A JPS5466777A (en) | 1977-11-07 | 1977-11-07 | Manufacture for semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13379577A JPS5466777A (en) | 1977-11-07 | 1977-11-07 | Manufacture for semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5466777A true JPS5466777A (en) | 1979-05-29 |
Family
ID=15113189
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13379577A Pending JPS5466777A (en) | 1977-11-07 | 1977-11-07 | Manufacture for semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5466777A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5661333A (en) * | 1994-01-26 | 1997-08-26 | Commissariat A L'energie Atomique | Substrate for integrated components comprising a thin film and an intermediate film |
-
1977
- 1977-11-07 JP JP13379577A patent/JPS5466777A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5661333A (en) * | 1994-01-26 | 1997-08-26 | Commissariat A L'energie Atomique | Substrate for integrated components comprising a thin film and an intermediate film |
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