JPS5461470A - Lead frame for semiconductor device - Google Patents

Lead frame for semiconductor device

Info

Publication number
JPS5461470A
JPS5461470A JP12846777A JP12846777A JPS5461470A JP S5461470 A JPS5461470 A JP S5461470A JP 12846777 A JP12846777 A JP 12846777A JP 12846777 A JP12846777 A JP 12846777A JP S5461470 A JPS5461470 A JP S5461470A
Authority
JP
Japan
Prior art keywords
pellet
lead frame
external lead
semiconductor device
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12846777A
Other languages
Japanese (ja)
Inventor
Itsuro Adachi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP12846777A priority Critical patent/JPS5461470A/en
Publication of JPS5461470A publication Critical patent/JPS5461470A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Abstract

PURPOSE: To increase the yield rate in the stage of manufacture, by projecting upward the bonding part of the external lead surrounding the island mounting the semiconductor pellet.
CONSTITUTION: The convex part 12' is placed at the tip of the external lead 12 at the circumference of the pellet mounting part 11 in the lead frame and if the bonding wire 14 connecting the pellet 13 and te external lead bonding part 12' is folded with any mechanical exernal force, the peril of contacting with the edge of the pellet mounting part 11 and the pellet 13 can be reduced
COPYRIGHT: (C)1979,JPO&Japio
JP12846777A 1977-10-25 1977-10-25 Lead frame for semiconductor device Pending JPS5461470A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12846777A JPS5461470A (en) 1977-10-25 1977-10-25 Lead frame for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12846777A JPS5461470A (en) 1977-10-25 1977-10-25 Lead frame for semiconductor device

Publications (1)

Publication Number Publication Date
JPS5461470A true JPS5461470A (en) 1979-05-17

Family

ID=14985438

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12846777A Pending JPS5461470A (en) 1977-10-25 1977-10-25 Lead frame for semiconductor device

Country Status (1)

Country Link
JP (1) JPS5461470A (en)

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