JPS5426495B1 - - Google Patents

Info

Publication number
JPS5426495B1
JPS5426495B1 JP696074A JP696074A JPS5426495B1 JP S5426495 B1 JPS5426495 B1 JP S5426495B1 JP 696074 A JP696074 A JP 696074A JP 696074 A JP696074 A JP 696074A JP S5426495 B1 JPS5426495 B1 JP S5426495B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP696074A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5426495B1 publication Critical patent/JPS5426495B1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/208—Multistep pretreatment with use of metal first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/285—Sensitising or activating with tin based compound or composition

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Catalysts (AREA)
  • Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
  • Electrolytic Production Of Metals (AREA)
JP696074A 1970-02-05 1974-01-11 Pending JPS5426495B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US906070A 1970-02-05 1970-02-05

Publications (1)

Publication Number Publication Date
JPS5426495B1 true JPS5426495B1 (fr) 1979-09-04

Family

ID=21735359

Family Applications (3)

Application Number Title Priority Date Filing Date
JP8458070A Pending JPS5237971B1 (fr) 1970-02-05 1970-09-25
JP696074A Pending JPS5426495B1 (fr) 1970-02-05 1974-01-11
JP696174A Pending JPS5373429A (en) 1970-02-05 1974-01-11 Method of sensitizing nonnelectric plating base material

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP8458070A Pending JPS5237971B1 (fr) 1970-02-05 1970-09-25

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP696174A Pending JPS5373429A (en) 1970-02-05 1974-01-11 Method of sensitizing nonnelectric plating base material

Country Status (12)

Country Link
US (1) US3682671A (fr)
JP (3) JPS5237971B1 (fr)
AT (1) AT308487B (fr)
CA (1) CA931301A (fr)
CH (1) CH564094A5 (fr)
DE (1) DE2105898C3 (fr)
DK (1) DK144919C (fr)
ES (1) ES387979A1 (fr)
FR (1) FR2078132A5 (fr)
GB (1) GB1306201A (fr)
NL (1) NL165790C (fr)
SE (1) SE427189B (fr)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4662944A (en) * 1972-07-11 1987-05-05 Kollmorgen Technologies Corporation Process and composition for sensitizing articles for metallization
US3960573A (en) * 1972-08-07 1976-06-01 Photocircuits Division Of Kollmorgan Corporation Novel precious metal sensitizing solutions
CA1005808A (en) * 1973-06-27 1977-02-22 Shipley Company Inc. Catalyst solution for electroless metal deposition on a substrate
CA1021761A (fr) * 1973-08-01 1977-11-29 Kollmorgen Corporation Sensibilisateurs pour depot chimique des metaux
US3961109A (en) * 1973-08-01 1976-06-01 Photocircuits Division Of Kollmorgen Corporation Sensitizers and process for electroless metal deposition
US3993491A (en) * 1973-12-07 1976-11-23 Surface Technology, Inc. Electroless plating
US4004051A (en) * 1974-02-15 1977-01-18 Crown City Plating Company Aqueous noble metal suspensions for one stage activation of nonconductors for electroless plating
US3963841A (en) * 1975-01-06 1976-06-15 International Business Machines Corporation Catalytic surface preparation for electroless plating
US4239538A (en) * 1976-03-30 1980-12-16 Surface Technology, Inc. Catalytic primer
ZA77897B (en) * 1976-04-13 1977-12-28 Kollmorgen Corp Liquid seeders and catalyzation processes for electroless metal deposition
US4259113A (en) * 1976-05-26 1981-03-31 Kollmorgen Technologies Corporation Composition for sensitizing articles for metallization
US4066809A (en) * 1976-06-28 1978-01-03 International Business Machines Corporation Method for preparing substrate surfaces for electroless deposition
ZA774561B (en) * 1976-09-20 1978-06-28 Kollmorgen Tech Corp Preparation of solid precious metal sensitizing compositions
DE2659680C2 (de) * 1976-12-30 1985-01-31 Ibm Deutschland Gmbh, 7000 Stuttgart Verfahren zum Aktivieren von Oberflächen
IT1107840B (it) * 1978-07-25 1985-12-02 Alfachimici Spa Soluzione catalitica per la deposizione anelettrica di metalli
WO1983004268A1 (fr) * 1982-05-26 1983-12-08 Macdermid Incorporated Solutions catalytiques permettant d'activer des substrats non conducteurs et procede de placage sans passage de courant electrique
DE3323476A1 (de) * 1982-07-01 1984-01-05 Kollmorgen Technologies Corp., 75201 Dallas, Tex. Verbessertes verfahren zur galvanischen metallabscheidung auf nichtmetallischen oberflaechen
US4610895A (en) * 1984-02-01 1986-09-09 Shipley Company Inc. Process for metallizing plastics
US4592929A (en) * 1984-02-01 1986-06-03 Shipley Company Inc. Process for metallizing plastics
US4717421A (en) * 1986-04-28 1988-01-05 Mcgean-Rohco, Inc. Solid tin-palladium catalyst for electroless deposition incorporating stannous salts of organic acids
DE3843903C1 (en) * 1988-12-24 1990-06-28 Deutsche Automobilgesellschaft Mbh, 3000 Hannover, De Activation solution for electrically non-conductive plastic substrate surfaces and process for the preparation thereof and the use thereof
DE3928500A1 (de) * 1989-08-29 1991-03-14 Deutsche Automobilgesellsch Verfahren zum waschen und spuelen chemisch metallisierter substratbahnen
US5418064A (en) * 1992-11-16 1995-05-23 Allied Signal Inc. Electroless plating of substrates
US5292557A (en) * 1992-11-16 1994-03-08 Allied-Signal Inc. Electroless plating of substrates
CA2222158C (fr) * 1993-03-18 2001-01-30 Nayan Harsukhrai Joshi Composition et methode de revetement par immersion auto-acceleree et regeneree sans formaldehyde
US6261637B1 (en) * 1995-12-15 2001-07-17 Enthone-Omi, Inc. Use of palladium immersion deposition to selectively initiate electroless plating on Ti and W alloys for wafer fabrication
US5753304A (en) * 1997-06-23 1998-05-19 The Metal Arts Company, Inc. Activation bath for electroless nickel plating
PT1988192E (pt) 2007-05-03 2013-01-24 Atotech Deutschland Gmbh Processo para aplicação de um revestimento metálico a um substrato não condutor
JP5458758B2 (ja) * 2009-09-11 2014-04-02 上村工業株式会社 触媒付与溶液並びにこれを用いた無電解めっき方法及びダイレクトプレーティング方法
EP2305856A1 (fr) 2009-09-28 2011-04-06 ATOTECH Deutschland GmbH Processus d'application d'un revêtement métallique sur un substrat non conducteur
EP2767614A1 (fr) 2013-02-13 2014-08-20 ATOTECH Deutschland GmbH Procédé pour déposer une première couche métallique sur des polymères non conducteurs
JP5649150B1 (ja) * 2014-07-17 2015-01-07 日本エレクトロプレイテイング・エンジニヤース株式会社 無電解メッキ用前処理液および無電解メッキ方法
CZ309565B6 (cs) * 2022-02-02 2023-04-12 EGO 93 s.r.o Senzibilační roztok a způsob jeho přípravy

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3011920A (en) * 1959-06-08 1961-12-05 Shipley Co Method of electroless deposition on a substrate and catalyst solution therefor
DE1446224B2 (de) * 1960-09-01 1971-09-16 Photocircuits Corp , Glen Cove, NY (V St A ) Saure waessrige loesung zum sensibilisieren von oberflaechen zur anschliessenden stromlosen metallabscheidung
GB1174851A (en) * 1967-07-05 1969-12-17 Technograph Ltd Sensitization Process for Electroless Plating

Also Published As

Publication number Publication date
JPS5373429A (en) 1978-06-29
GB1306201A (fr) 1973-02-07
NL165790C (nl) 1981-05-15
DE2105898A1 (de) 1971-09-02
JPS5237971B1 (fr) 1977-09-26
DK144919C (da) 1982-11-22
AT308487B (de) 1973-07-10
CH564094A5 (fr) 1975-07-15
FR2078132A5 (fr) 1971-11-05
NL165790B (nl) 1980-12-15
ES387979A1 (es) 1973-06-01
DE2105898B2 (de) 1975-07-31
CA931301A (en) 1973-08-07
US3682671A (en) 1972-08-08
DE2105898C3 (de) 1982-08-19
DK144919B (da) 1982-07-05
SE427189B (sv) 1983-03-14
NL7101596A (fr) 1971-08-09

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