GB1306201A - - Google Patents
Info
- Publication number
- GB1306201A GB1306201A GB232771A GB232771A GB1306201A GB 1306201 A GB1306201 A GB 1306201A GB 232771 A GB232771 A GB 232771A GB 232771 A GB232771 A GB 232771A GB 1306201 A GB1306201 A GB 1306201A
- Authority
- GB
- United Kingdom
- Prior art keywords
- metal
- group
- solution
- contain
- electroless plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/208—Multistep pretreatment with use of metal first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/285—Sensitising or activating with tin based compound or composition
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Catalysts (AREA)
- Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
- Electrolytic Production Of Metals (AREA)
Abstract
1306201 Electroless plating KOLLMORGEN CORP 18 Jan 1971 [5 Feb 1970] 2327/71 Heading C7F A sensitizing solution for applying to or incorporating in a substrate prior to the electroless plating of e.g. Cu comprises a complex formed from (a) a precious metal selected from the fifth and sixth periods of Groups VIII and 1B, (b) a Group IV metal capable of two valence states, and (c) an anion capable of forming a stable moiety with both valence states, of the Group IV metal, the molar ratio of components (a), (b), (c) being 1:1:3 to 1:6:24, the complex being formed by heating, at e. g 80‹C to boiling point, an aqueous mixture of the components. The precious metal may be Pd, Pt, Au, Rh, Os, Ir, and the Group IV metal stannous tin, Ti, Ge. The anion may be chloride, bromide, fluoride, fluoborate, iodide, nitrate, sulphate, acetate. The solution may contain an organic solvent, e.g. cyclohexanone, dimelthylformamide, hexane, and dimethyl sulphoxide. The solution may also contain a stabilizer, e.g. methanol, ethanol, i-propanol, ethylene glycol, propylene glycol, 1, 4-butane diol, glycerol, glucose, sucrose, cyclohexanol, cyclohexanediol, inositol, phenol, #-naphthol, resorcinol, catechol hydroquinone, pyrogallol, phloroglucinol or naphthoresorcinol.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US906070A | 1970-02-05 | 1970-02-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1306201A true GB1306201A (en) | 1973-02-07 |
Family
ID=21735359
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB232771A Expired GB1306201A (en) | 1970-02-05 | 1971-01-18 |
Country Status (12)
Country | Link |
---|---|
US (1) | US3682671A (en) |
JP (3) | JPS5237971B1 (en) |
AT (1) | AT308487B (en) |
CA (1) | CA931301A (en) |
CH (1) | CH564094A5 (en) |
DE (1) | DE2105898C3 (en) |
DK (1) | DK144919C (en) |
ES (1) | ES387979A1 (en) |
FR (1) | FR2078132A5 (en) |
GB (1) | GB1306201A (en) |
NL (1) | NL165790C (en) |
SE (1) | SE427189B (en) |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4662944A (en) * | 1972-07-11 | 1987-05-05 | Kollmorgen Technologies Corporation | Process and composition for sensitizing articles for metallization |
US3960573A (en) * | 1972-08-07 | 1976-06-01 | Photocircuits Division Of Kollmorgan Corporation | Novel precious metal sensitizing solutions |
CA1005808A (en) * | 1973-06-27 | 1977-02-22 | Shipley Company Inc. | Catalyst solution for electroless metal deposition on a substrate |
US3961109A (en) * | 1973-08-01 | 1976-06-01 | Photocircuits Division Of Kollmorgen Corporation | Sensitizers and process for electroless metal deposition |
CA1021761A (en) * | 1973-08-01 | 1977-11-29 | Kollmorgen Corporation | Sensitizers for electroless metal deposition |
US3993491A (en) * | 1973-12-07 | 1976-11-23 | Surface Technology, Inc. | Electroless plating |
US4004051A (en) * | 1974-02-15 | 1977-01-18 | Crown City Plating Company | Aqueous noble metal suspensions for one stage activation of nonconductors for electroless plating |
US3963841A (en) * | 1975-01-06 | 1976-06-15 | International Business Machines Corporation | Catalytic surface preparation for electroless plating |
US4239538A (en) * | 1976-03-30 | 1980-12-16 | Surface Technology, Inc. | Catalytic primer |
ZA77897B (en) * | 1976-04-13 | 1977-12-28 | Kollmorgen Corp | Liquid seeders and catalyzation processes for electroless metal deposition |
US4259113A (en) * | 1976-05-26 | 1981-03-31 | Kollmorgen Technologies Corporation | Composition for sensitizing articles for metallization |
US4066809A (en) * | 1976-06-28 | 1978-01-03 | International Business Machines Corporation | Method for preparing substrate surfaces for electroless deposition |
ZA774561B (en) * | 1976-09-20 | 1978-06-28 | Kollmorgen Tech Corp | Preparation of solid precious metal sensitizing compositions |
DE2659680C2 (en) * | 1976-12-30 | 1985-01-31 | Ibm Deutschland Gmbh, 7000 Stuttgart | Procedure for activating surfaces |
IT1107840B (en) * | 1978-07-25 | 1985-12-02 | Alfachimici Spa | CATALYTIC SOLUTION FOR ANELECTRIC METAL DEPOSITION |
DE3376852D1 (en) * | 1982-05-26 | 1988-07-07 | Macdermid Inc | Catalyst solutions for activating non-conductive substrates and electroless plating process |
DE3323476A1 (en) * | 1982-07-01 | 1984-01-05 | Kollmorgen Technologies Corp., 75201 Dallas, Tex. | IMPROVED METHOD FOR GALVANIC METAL DEPOSITION ON NON-METALLIC SURFACES |
US4610895A (en) * | 1984-02-01 | 1986-09-09 | Shipley Company Inc. | Process for metallizing plastics |
US4592929A (en) * | 1984-02-01 | 1986-06-03 | Shipley Company Inc. | Process for metallizing plastics |
US4717421A (en) * | 1986-04-28 | 1988-01-05 | Mcgean-Rohco, Inc. | Solid tin-palladium catalyst for electroless deposition incorporating stannous salts of organic acids |
DE3843903C1 (en) * | 1988-12-24 | 1990-06-28 | Deutsche Automobilgesellschaft Mbh, 3000 Hannover, De | Activation solution for electrically non-conductive plastic substrate surfaces and process for the preparation thereof and the use thereof |
DE3928500A1 (en) * | 1989-08-29 | 1991-03-14 | Deutsche Automobilgesellsch | METHOD FOR WASHING AND RINSING CHEMICALLY METALLIZED SUBSTRATE RAILS |
US5292557A (en) * | 1992-11-16 | 1994-03-08 | Allied-Signal Inc. | Electroless plating of substrates |
US5418064A (en) * | 1992-11-16 | 1995-05-23 | Allied Signal Inc. | Electroless plating of substrates |
EP0616053B9 (en) * | 1993-03-18 | 2010-09-15 | ATOTECH Deutschland GmbH | Self accelerating and replenishing non-formaldehyde immersion coating method |
US6261637B1 (en) * | 1995-12-15 | 2001-07-17 | Enthone-Omi, Inc. | Use of palladium immersion deposition to selectively initiate electroless plating on Ti and W alloys for wafer fabrication |
US5753304A (en) * | 1997-06-23 | 1998-05-19 | The Metal Arts Company, Inc. | Activation bath for electroless nickel plating |
ES2395736T3 (en) | 2007-05-03 | 2013-02-14 | Atotech Deutschland Gmbh | Procedure for applying a metallic coating to a non-conductive substrate |
JP5458758B2 (en) * | 2009-09-11 | 2014-04-02 | 上村工業株式会社 | Catalyst application solution and electroless plating method and direct plating method using the same |
EP2305856A1 (en) | 2009-09-28 | 2011-04-06 | ATOTECH Deutschland GmbH | Process for applying a metal coating to a non-conductive substrate |
EP2767614A1 (en) | 2013-02-13 | 2014-08-20 | ATOTECH Deutschland GmbH | Method for depositing a first metallic layer onto non-conductive polymers |
JP5649150B1 (en) * | 2014-07-17 | 2015-01-07 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | Pretreatment liquid for electroless plating and electroless plating method |
CZ309565B6 (en) * | 2022-02-02 | 2023-04-12 | EGO 93 s.r.o | Sensitizing solution and preparing it |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3011920A (en) * | 1959-06-08 | 1961-12-05 | Shipley Co | Method of electroless deposition on a substrate and catalyst solution therefor |
DE1446224B2 (en) * | 1960-09-01 | 1971-09-16 | Photocircuits Corp , Glen Cove, NY (V St A ) | ACID, Aqueous SOLUTION FOR SENSITIZING SURFACES FOR THE SUBSEQUENT ELECTRIC METAL DEPOSITION |
GB1174851A (en) * | 1967-07-05 | 1969-12-17 | Technograph Ltd | Sensitization Process for Electroless Plating |
-
1970
- 1970-02-05 US US3682671D patent/US3682671A/en not_active Expired - Lifetime
- 1970-09-02 CA CA092191A patent/CA931301A/en not_active Expired
- 1970-09-25 JP JP8458070A patent/JPS5237971B1/ja active Pending
-
1971
- 1971-01-18 GB GB232771A patent/GB1306201A/en not_active Expired
- 1971-02-01 SE SE119871A patent/SE427189B/en unknown
- 1971-02-01 CH CH142671A patent/CH564094A5/xx not_active IP Right Cessation
- 1971-02-01 AT AT81871A patent/AT308487B/en active
- 1971-02-03 FR FR7103580A patent/FR2078132A5/fr not_active Expired
- 1971-02-04 DE DE2105898A patent/DE2105898C3/en not_active Expired
- 1971-02-04 DK DK48471A patent/DK144919C/en not_active IP Right Cessation
- 1971-02-05 ES ES387979A patent/ES387979A1/en not_active Expired
- 1971-02-05 NL NL7101596A patent/NL165790C/en not_active IP Right Cessation
-
1974
- 1974-01-11 JP JP696074A patent/JPS5426495B1/ja active Pending
- 1974-01-11 JP JP696174A patent/JPS5373429A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
NL7101596A (en) | 1971-08-09 |
JPS5373429A (en) | 1978-06-29 |
NL165790C (en) | 1981-05-15 |
DK144919C (en) | 1982-11-22 |
SE427189B (en) | 1983-03-14 |
JPS5237971B1 (en) | 1977-09-26 |
CA931301A (en) | 1973-08-07 |
FR2078132A5 (en) | 1971-11-05 |
DE2105898B2 (en) | 1975-07-31 |
AT308487B (en) | 1973-07-10 |
CH564094A5 (en) | 1975-07-15 |
NL165790B (en) | 1980-12-15 |
JPS5426495B1 (en) | 1979-09-04 |
DE2105898A1 (en) | 1971-09-02 |
US3682671A (en) | 1972-08-08 |
ES387979A1 (en) | 1973-06-01 |
DK144919B (en) | 1982-07-05 |
DE2105898C3 (en) | 1982-08-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed [section 19, patents act 1949] | ||
PE20 | Patent expired after termination of 20 years |