AT308487B - Solution for sensitizing metallic and non-metallic surfaces as well as method for producing the solution - Google Patents
Solution for sensitizing metallic and non-metallic surfaces as well as method for producing the solutionInfo
- Publication number
- AT308487B AT308487B AT81871A AT81871A AT308487B AT 308487 B AT308487 B AT 308487B AT 81871 A AT81871 A AT 81871A AT 81871 A AT81871 A AT 81871A AT 308487 B AT308487 B AT 308487B
- Authority
- AT
- Austria
- Prior art keywords
- solution
- metallic
- sensitizing
- producing
- well
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/208—Multistep pretreatment with use of metal first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/285—Sensitising or activating with tin based compound or composition
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Catalysts (AREA)
- Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
- Electrolytic Production Of Metals (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US906070A | 1970-02-05 | 1970-02-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
AT308487B true AT308487B (en) | 1973-07-10 |
Family
ID=21735359
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT81871A AT308487B (en) | 1970-02-05 | 1971-02-01 | Solution for sensitizing metallic and non-metallic surfaces as well as method for producing the solution |
Country Status (12)
Country | Link |
---|---|
US (1) | US3682671A (en) |
JP (3) | JPS5237971B1 (en) |
AT (1) | AT308487B (en) |
CA (1) | CA931301A (en) |
CH (1) | CH564094A5 (en) |
DE (1) | DE2105898C3 (en) |
DK (1) | DK144919C (en) |
ES (1) | ES387979A1 (en) |
FR (1) | FR2078132A5 (en) |
GB (1) | GB1306201A (en) |
NL (1) | NL165790C (en) |
SE (1) | SE427189B (en) |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4662944A (en) * | 1972-07-11 | 1987-05-05 | Kollmorgen Technologies Corporation | Process and composition for sensitizing articles for metallization |
US3960573A (en) * | 1972-08-07 | 1976-06-01 | Photocircuits Division Of Kollmorgan Corporation | Novel precious metal sensitizing solutions |
CA1005808A (en) * | 1973-06-27 | 1977-02-22 | Shipley Company Inc. | Catalyst solution for electroless metal deposition on a substrate |
CA1021761A (en) * | 1973-08-01 | 1977-11-29 | Kollmorgen Corporation | Sensitizers for electroless metal deposition |
US3961109A (en) * | 1973-08-01 | 1976-06-01 | Photocircuits Division Of Kollmorgen Corporation | Sensitizers and process for electroless metal deposition |
US3993491A (en) * | 1973-12-07 | 1976-11-23 | Surface Technology, Inc. | Electroless plating |
US4004051A (en) * | 1974-02-15 | 1977-01-18 | Crown City Plating Company | Aqueous noble metal suspensions for one stage activation of nonconductors for electroless plating |
US3963841A (en) * | 1975-01-06 | 1976-06-15 | International Business Machines Corporation | Catalytic surface preparation for electroless plating |
US4239538A (en) * | 1976-03-30 | 1980-12-16 | Surface Technology, Inc. | Catalytic primer |
ZA77897B (en) * | 1976-04-13 | 1977-12-28 | Kollmorgen Corp | Liquid seeders and catalyzation processes for electroless metal deposition |
US4259113A (en) * | 1976-05-26 | 1981-03-31 | Kollmorgen Technologies Corporation | Composition for sensitizing articles for metallization |
US4066809A (en) * | 1976-06-28 | 1978-01-03 | International Business Machines Corporation | Method for preparing substrate surfaces for electroless deposition |
ZA774561B (en) * | 1976-09-20 | 1978-06-28 | Kollmorgen Tech Corp | Preparation of solid precious metal sensitizing compositions |
DE2659680C2 (en) * | 1976-12-30 | 1985-01-31 | Ibm Deutschland Gmbh, 7000 Stuttgart | Procedure for activating surfaces |
IT1107840B (en) * | 1978-07-25 | 1985-12-02 | Alfachimici Spa | CATALYTIC SOLUTION FOR ANELECTRIC METAL DEPOSITION |
DE3376852D1 (en) * | 1982-05-26 | 1988-07-07 | Macdermid Inc | Catalyst solutions for activating non-conductive substrates and electroless plating process |
DE3323476A1 (en) * | 1982-07-01 | 1984-01-05 | Kollmorgen Technologies Corp., 75201 Dallas, Tex. | IMPROVED METHOD FOR GALVANIC METAL DEPOSITION ON NON-METALLIC SURFACES |
US4610895A (en) * | 1984-02-01 | 1986-09-09 | Shipley Company Inc. | Process for metallizing plastics |
US4592929A (en) * | 1984-02-01 | 1986-06-03 | Shipley Company Inc. | Process for metallizing plastics |
US4717421A (en) * | 1986-04-28 | 1988-01-05 | Mcgean-Rohco, Inc. | Solid tin-palladium catalyst for electroless deposition incorporating stannous salts of organic acids |
DE3843903C1 (en) * | 1988-12-24 | 1990-06-28 | Deutsche Automobilgesellschaft Mbh, 3000 Hannover, De | Activation solution for electrically non-conductive plastic substrate surfaces and process for the preparation thereof and the use thereof |
DE3928500A1 (en) * | 1989-08-29 | 1991-03-14 | Deutsche Automobilgesellsch | METHOD FOR WASHING AND RINSING CHEMICALLY METALLIZED SUBSTRATE RAILS |
US5418064A (en) * | 1992-11-16 | 1995-05-23 | Allied Signal Inc. | Electroless plating of substrates |
US5292557A (en) * | 1992-11-16 | 1994-03-08 | Allied-Signal Inc. | Electroless plating of substrates |
DE69434619T2 (en) * | 1993-03-18 | 2006-08-17 | Atotech Deutschland Gmbh | Self-accelerating and self-refreshing process for dip coating without formaldehyde, as well as the corresponding composition |
US6261637B1 (en) * | 1995-12-15 | 2001-07-17 | Enthone-Omi, Inc. | Use of palladium immersion deposition to selectively initiate electroless plating on Ti and W alloys for wafer fabrication |
US5753304A (en) * | 1997-06-23 | 1998-05-19 | The Metal Arts Company, Inc. | Activation bath for electroless nickel plating |
ES2395736T3 (en) * | 2007-05-03 | 2013-02-14 | Atotech Deutschland Gmbh | Procedure for applying a metallic coating to a non-conductive substrate |
JP5458758B2 (en) * | 2009-09-11 | 2014-04-02 | 上村工業株式会社 | Catalyst application solution and electroless plating method and direct plating method using the same |
EP2305856A1 (en) | 2009-09-28 | 2011-04-06 | ATOTECH Deutschland GmbH | Process for applying a metal coating to a non-conductive substrate |
EP2767614A1 (en) | 2013-02-13 | 2014-08-20 | ATOTECH Deutschland GmbH | Method for depositing a first metallic layer onto non-conductive polymers |
JP5649150B1 (en) * | 2014-07-17 | 2015-01-07 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | Pretreatment liquid for electroless plating and electroless plating method |
CZ202251A3 (en) * | 2022-02-02 | 2023-04-12 | Ego 93 S.R.O. | Sensitizing solution and preparing it |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3011920A (en) * | 1959-06-08 | 1961-12-05 | Shipley Co | Method of electroless deposition on a substrate and catalyst solution therefor |
DE1446224B2 (en) * | 1960-09-01 | 1971-09-16 | Photocircuits Corp , Glen Cove, NY (V St A ) | ACID, Aqueous SOLUTION FOR SENSITIZING SURFACES FOR THE SUBSEQUENT ELECTRIC METAL DEPOSITION |
GB1174851A (en) * | 1967-07-05 | 1969-12-17 | Technograph Ltd | Sensitization Process for Electroless Plating |
-
1970
- 1970-02-05 US US3682671D patent/US3682671A/en not_active Expired - Lifetime
- 1970-09-02 CA CA092191A patent/CA931301A/en not_active Expired
- 1970-09-25 JP JP8458070A patent/JPS5237971B1/ja active Pending
-
1971
- 1971-01-18 GB GB232771A patent/GB1306201A/en not_active Expired
- 1971-02-01 CH CH142671A patent/CH564094A5/xx not_active IP Right Cessation
- 1971-02-01 AT AT81871A patent/AT308487B/en active
- 1971-02-01 SE SE119871A patent/SE427189B/en unknown
- 1971-02-03 FR FR7103580A patent/FR2078132A5/fr not_active Expired
- 1971-02-04 DK DK48471A patent/DK144919C/en not_active IP Right Cessation
- 1971-02-04 DE DE2105898A patent/DE2105898C3/en not_active Expired
- 1971-02-05 NL NL7101596A patent/NL165790C/en not_active IP Right Cessation
- 1971-02-05 ES ES387979A patent/ES387979A1/en not_active Expired
-
1974
- 1974-01-11 JP JP696174A patent/JPS5373429A/en active Pending
- 1974-01-11 JP JP696074A patent/JPS5426495B1/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
JPS5426495B1 (en) | 1979-09-04 |
FR2078132A5 (en) | 1971-11-05 |
DK144919B (en) | 1982-07-05 |
DE2105898A1 (en) | 1971-09-02 |
CA931301A (en) | 1973-08-07 |
DE2105898B2 (en) | 1975-07-31 |
JPS5237971B1 (en) | 1977-09-26 |
SE427189B (en) | 1983-03-14 |
US3682671A (en) | 1972-08-08 |
NL165790C (en) | 1981-05-15 |
NL165790B (en) | 1980-12-15 |
JPS5373429A (en) | 1978-06-29 |
DK144919C (en) | 1982-11-22 |
NL7101596A (en) | 1971-08-09 |
ES387979A1 (en) | 1973-06-01 |
GB1306201A (en) | 1973-02-07 |
CH564094A5 (en) | 1975-07-15 |
DE2105898C3 (en) | 1982-08-19 |
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