JPS54159877A - Detection method for semiconductor substrate position and break - Google Patents

Detection method for semiconductor substrate position and break

Info

Publication number
JPS54159877A
JPS54159877A JP6936678A JP6936678A JPS54159877A JP S54159877 A JPS54159877 A JP S54159877A JP 6936678 A JP6936678 A JP 6936678A JP 6936678 A JP6936678 A JP 6936678A JP S54159877 A JPS54159877 A JP S54159877A
Authority
JP
Japan
Prior art keywords
photo sensors
break
semiconductor substrate
projected
photo
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6936678A
Other languages
Japanese (ja)
Other versions
JPS5746213B2 (en
Inventor
Yuzo Fujii
Masaaki Koga
Makoto Kojima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP6936678A priority Critical patent/JPS54159877A/en
Publication of JPS54159877A publication Critical patent/JPS54159877A/en
Publication of JPS5746213B2 publication Critical patent/JPS5746213B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE: To make a bonding state accurate by detecting the X and Y-direction position and the break of a semiconductor substrate by the light irradiation state to photo sensors, which are arranged adjacentaly on respective sides, and a break detecting photo sensor respectively.
CONSTITUTION: Oppositely to projection plate 8 where extended projections of square semiconductor substrates, which are stuck to light transmission sheet 1 having a thermal expansion property and are provided with a prescribed interval, are projected, a pair of photo sensors A and B and a pair of photo sensors C and D are arranged in respective outside parts of two sides, which are orthogonal to the X direction of a projected pattern when the extended projection is correctly projected, while contacting with the sides above. Photo sensor G is arranged in the outside part of each side orthogonal to the Y direction, and semiconductor substrate position conforming photo sensors L and M are arranged in the center of the projected pattern, and break detecting photo sensors H, I, J and K arranged at four corners of the projected pattern respectively.
COPYRIGHT: (C)1979,JPO&Japio
JP6936678A 1978-06-07 1978-06-07 Detection method for semiconductor substrate position and break Granted JPS54159877A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6936678A JPS54159877A (en) 1978-06-07 1978-06-07 Detection method for semiconductor substrate position and break

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6936678A JPS54159877A (en) 1978-06-07 1978-06-07 Detection method for semiconductor substrate position and break

Publications (2)

Publication Number Publication Date
JPS54159877A true JPS54159877A (en) 1979-12-18
JPS5746213B2 JPS5746213B2 (en) 1982-10-01

Family

ID=13400478

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6936678A Granted JPS54159877A (en) 1978-06-07 1978-06-07 Detection method for semiconductor substrate position and break

Country Status (1)

Country Link
JP (1) JPS54159877A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5025578A (en) * 1973-07-06 1975-03-18
JPS52138873A (en) * 1976-05-14 1977-11-19 Nec Corp Automatic positioning method of semiconductor pellets

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5025578A (en) * 1973-07-06 1975-03-18
JPS52138873A (en) * 1976-05-14 1977-11-19 Nec Corp Automatic positioning method of semiconductor pellets

Also Published As

Publication number Publication date
JPS5746213B2 (en) 1982-10-01

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