JPS54133073A - Semiconductor device of resin seal type - Google Patents
Semiconductor device of resin seal typeInfo
- Publication number
- JPS54133073A JPS54133073A JP4098378A JP4098378A JPS54133073A JP S54133073 A JPS54133073 A JP S54133073A JP 4098378 A JP4098378 A JP 4098378A JP 4098378 A JP4098378 A JP 4098378A JP S54133073 A JPS54133073 A JP S54133073A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- seal type
- resin seal
- resin
- constitution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE: To completely shut the external light, by providing the flow stop at the straight part of the lead frame.
CONSTITUTION: The straight line part covered with the opaque resin 1 of the lead frame 4 is partly curved to form the flow stop 8 for transparent resin 2. With this constitution, since the transparent resin can completely be covered with opaque resin, malfunction due to external light can be avoided.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4098378A JPS54133073A (en) | 1978-04-06 | 1978-04-06 | Semiconductor device of resin seal type |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4098378A JPS54133073A (en) | 1978-04-06 | 1978-04-06 | Semiconductor device of resin seal type |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS54133073A true JPS54133073A (en) | 1979-10-16 |
Family
ID=12595656
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4098378A Pending JPS54133073A (en) | 1978-04-06 | 1978-04-06 | Semiconductor device of resin seal type |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54133073A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5047834A (en) * | 1989-06-20 | 1991-09-10 | International Business Machines Corporation | High strength low stress encapsulation of interconnected semiconductor devices |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4815399U (en) * | 1971-06-29 | 1973-02-21 |
-
1978
- 1978-04-06 JP JP4098378A patent/JPS54133073A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4815399U (en) * | 1971-06-29 | 1973-02-21 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5047834A (en) * | 1989-06-20 | 1991-09-10 | International Business Machines Corporation | High strength low stress encapsulation of interconnected semiconductor devices |
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