JPS54133073A - Semiconductor device of resin seal type - Google Patents

Semiconductor device of resin seal type

Info

Publication number
JPS54133073A
JPS54133073A JP4098378A JP4098378A JPS54133073A JP S54133073 A JPS54133073 A JP S54133073A JP 4098378 A JP4098378 A JP 4098378A JP 4098378 A JP4098378 A JP 4098378A JP S54133073 A JPS54133073 A JP S54133073A
Authority
JP
Japan
Prior art keywords
semiconductor device
seal type
resin seal
resin
constitution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4098378A
Other languages
Japanese (ja)
Inventor
Atsushi Mori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP4098378A priority Critical patent/JPS54133073A/en
Publication of JPS54133073A publication Critical patent/JPS54133073A/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To completely shut the external light, by providing the flow stop at the straight part of the lead frame.
CONSTITUTION: The straight line part covered with the opaque resin 1 of the lead frame 4 is partly curved to form the flow stop 8 for transparent resin 2. With this constitution, since the transparent resin can completely be covered with opaque resin, malfunction due to external light can be avoided.
COPYRIGHT: (C)1979,JPO&Japio
JP4098378A 1978-04-06 1978-04-06 Semiconductor device of resin seal type Pending JPS54133073A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4098378A JPS54133073A (en) 1978-04-06 1978-04-06 Semiconductor device of resin seal type

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4098378A JPS54133073A (en) 1978-04-06 1978-04-06 Semiconductor device of resin seal type

Publications (1)

Publication Number Publication Date
JPS54133073A true JPS54133073A (en) 1979-10-16

Family

ID=12595656

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4098378A Pending JPS54133073A (en) 1978-04-06 1978-04-06 Semiconductor device of resin seal type

Country Status (1)

Country Link
JP (1) JPS54133073A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5047834A (en) * 1989-06-20 1991-09-10 International Business Machines Corporation High strength low stress encapsulation of interconnected semiconductor devices

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4815399U (en) * 1971-06-29 1973-02-21

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4815399U (en) * 1971-06-29 1973-02-21

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5047834A (en) * 1989-06-20 1991-09-10 International Business Machines Corporation High strength low stress encapsulation of interconnected semiconductor devices

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