JPS53100787A - Semiconductor light emitting display device - Google Patents

Semiconductor light emitting display device

Info

Publication number
JPS53100787A
JPS53100787A JP1465877A JP1465877A JPS53100787A JP S53100787 A JPS53100787 A JP S53100787A JP 1465877 A JP1465877 A JP 1465877A JP 1465877 A JP1465877 A JP 1465877A JP S53100787 A JPS53100787 A JP S53100787A
Authority
JP
Japan
Prior art keywords
light emitting
display device
emitting display
semiconductor light
enclosing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1465877A
Other languages
Japanese (ja)
Inventor
Toru Nomura
Takeo Senda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP1465877A priority Critical patent/JPS53100787A/en
Publication of JPS53100787A publication Critical patent/JPS53100787A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Illuminated Signs And Luminous Advertising (AREA)
  • Led Device Packages (AREA)

Abstract

PURPOSE: To improve the quality of a light emitting display device and enhance its yield by enclosing the light emitting portion with a transparent case and sealing the same with the resin comprising mixing coloring agent and light scattering agent.
COPYRIGHT: (C)1978,JPO&Japio
JP1465877A 1977-02-15 1977-02-15 Semiconductor light emitting display device Pending JPS53100787A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1465877A JPS53100787A (en) 1977-02-15 1977-02-15 Semiconductor light emitting display device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1465877A JPS53100787A (en) 1977-02-15 1977-02-15 Semiconductor light emitting display device

Publications (1)

Publication Number Publication Date
JPS53100787A true JPS53100787A (en) 1978-09-02

Family

ID=11867301

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1465877A Pending JPS53100787A (en) 1977-02-15 1977-02-15 Semiconductor light emitting display device

Country Status (1)

Country Link
JP (1) JPS53100787A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1441396A3 (en) * 1996-06-26 2005-07-06 Osram Opto Semiconductors GmbH Light-emitting semiconductor device with luminescence conversion element
JP2006325785A (en) * 2005-05-25 2006-12-07 Takashi Toyonaga High-frequency treatment instrument and method of releasing mucous membrane by using high-frequency treatment instrument
JP2007275625A (en) * 2007-07-24 2007-10-25 Takashi Toyonaga High frequency treatment instrument
JP2007313345A (en) * 2007-07-24 2007-12-06 Takashi Toyonaga High-frequency treatment instrument

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1441396A3 (en) * 1996-06-26 2005-07-06 Osram Opto Semiconductors GmbH Light-emitting semiconductor device with luminescence conversion element
EP1441395A3 (en) * 1996-06-26 2005-07-06 Osram Opto Semiconductors GmbH Light-emitting semiconductor device with luminescence conversion element
JP2006325785A (en) * 2005-05-25 2006-12-07 Takashi Toyonaga High-frequency treatment instrument and method of releasing mucous membrane by using high-frequency treatment instrument
JP2007275625A (en) * 2007-07-24 2007-10-25 Takashi Toyonaga High frequency treatment instrument
JP2007313345A (en) * 2007-07-24 2007-12-06 Takashi Toyonaga High-frequency treatment instrument

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