JPS5422788A - Semiconductor light emittsing device - Google Patents

Semiconductor light emittsing device

Info

Publication number
JPS5422788A
JPS5422788A JP8818977A JP8818977A JPS5422788A JP S5422788 A JPS5422788 A JP S5422788A JP 8818977 A JP8818977 A JP 8818977A JP 8818977 A JP8818977 A JP 8818977A JP S5422788 A JPS5422788 A JP S5422788A
Authority
JP
Japan
Prior art keywords
emittsing
semiconductor light
light emitting
molding
pellet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8818977A
Other languages
Japanese (ja)
Inventor
Yoshiyuki Hayakawa
Osamu Iwashima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP8818977A priority Critical patent/JPS5422788A/en
Publication of JPS5422788A publication Critical patent/JPS5422788A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Abstract

PURPOSE: To expand the light emitting surface and thus to increase the luminous output by molding the space ranging from the main light emitting surface through the light emitting diode pellet with the transparent resin and molding the space from the back of the opposite side through the pellet with the scattering agent or the reflective agent respectively.
COPYRIGHT: (C)1979,JPO&Japio
JP8818977A 1977-07-21 1977-07-21 Semiconductor light emittsing device Pending JPS5422788A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8818977A JPS5422788A (en) 1977-07-21 1977-07-21 Semiconductor light emittsing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8818977A JPS5422788A (en) 1977-07-21 1977-07-21 Semiconductor light emittsing device

Publications (1)

Publication Number Publication Date
JPS5422788A true JPS5422788A (en) 1979-02-20

Family

ID=13935944

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8818977A Pending JPS5422788A (en) 1977-07-21 1977-07-21 Semiconductor light emittsing device

Country Status (1)

Country Link
JP (1) JPS5422788A (en)

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