JPS54890A - Light-coupled semiconductor device - Google Patents

Light-coupled semiconductor device

Info

Publication number
JPS54890A
JPS54890A JP6598377A JP6598377A JPS54890A JP S54890 A JPS54890 A JP S54890A JP 6598377 A JP6598377 A JP 6598377A JP 6598377 A JP6598377 A JP 6598377A JP S54890 A JPS54890 A JP S54890A
Authority
JP
Japan
Prior art keywords
light
semiconductor device
coupled semiconductor
semiconductor light
concavity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6598377A
Other languages
Japanese (ja)
Other versions
JPS5858825B2 (en
Inventor
Shoichi Kakimoto
Susumu Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP52065983A priority Critical patent/JPS5858825B2/en
Publication of JPS54890A publication Critical patent/JPS54890A/en
Publication of JPS5858825B2 publication Critical patent/JPS5858825B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)

Abstract

PURPOSE: To ensure an effective transmission of the optical signal as well as to facilitate an easy assembly of the device, by distributing both the semiconductor light emitting element and the semiconductor light receiving element on the same plane at the concavity's bottom surface.
COPYRIGHT: (C)1979,JPO&Japio
JP52065983A 1977-06-03 1977-06-03 Optical coupling semiconductor device Expired JPS5858825B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP52065983A JPS5858825B2 (en) 1977-06-03 1977-06-03 Optical coupling semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP52065983A JPS5858825B2 (en) 1977-06-03 1977-06-03 Optical coupling semiconductor device

Publications (2)

Publication Number Publication Date
JPS54890A true JPS54890A (en) 1979-01-06
JPS5858825B2 JPS5858825B2 (en) 1983-12-27

Family

ID=13302740

Family Applications (1)

Application Number Title Priority Date Filing Date
JP52065983A Expired JPS5858825B2 (en) 1977-06-03 1977-06-03 Optical coupling semiconductor device

Country Status (1)

Country Link
JP (1) JPS5858825B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5831594A (en) * 1981-08-20 1983-02-24 Oki Electric Ind Co Ltd Photo semiconductor device
JPS5840040U (en) * 1981-09-14 1983-03-16 研器工業株式会社 Structure of the handle

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5831594A (en) * 1981-08-20 1983-02-24 Oki Electric Ind Co Ltd Photo semiconductor device
JPS6244871B2 (en) * 1981-08-20 1987-09-22 Oki Electric Ind Co Ltd
JPS5840040U (en) * 1981-09-14 1983-03-16 研器工業株式会社 Structure of the handle
JPS608769Y2 (en) * 1981-09-14 1985-03-28 研器工業株式会社 Structure of the handle

Also Published As

Publication number Publication date
JPS5858825B2 (en) 1983-12-27

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