JPS54113250A - Production of semiconductor device - Google Patents
Production of semiconductor deviceInfo
- Publication number
- JPS54113250A JPS54113250A JP1970378A JP1970378A JPS54113250A JP S54113250 A JPS54113250 A JP S54113250A JP 1970378 A JP1970378 A JP 1970378A JP 1970378 A JP1970378 A JP 1970378A JP S54113250 A JPS54113250 A JP S54113250A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- solder
- stem
- substrate
- pellet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/27—Manufacturing methods
- H01L2224/27011—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature
- H01L2224/27013—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature for holding or confining the layer connector, e.g. solder flow barrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1970378A JPS54113250A (en) | 1978-02-24 | 1978-02-24 | Production of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1970378A JPS54113250A (en) | 1978-02-24 | 1978-02-24 | Production of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS54113250A true JPS54113250A (en) | 1979-09-04 |
Family
ID=12006624
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1970378A Pending JPS54113250A (en) | 1978-02-24 | 1978-02-24 | Production of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54113250A (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015233132A (ja) * | 2014-05-12 | 2015-12-24 | ローム株式会社 | 半導体装置 |
JP2018157222A (ja) * | 2013-04-16 | 2018-10-04 | ローム株式会社 | 半導体装置 |
US10312171B2 (en) | 2013-04-16 | 2019-06-04 | Rohm Co., Ltd. | Semiconductor device |
-
1978
- 1978-02-24 JP JP1970378A patent/JPS54113250A/ja active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018157222A (ja) * | 2013-04-16 | 2018-10-04 | ローム株式会社 | 半導体装置 |
US10312171B2 (en) | 2013-04-16 | 2019-06-04 | Rohm Co., Ltd. | Semiconductor device |
JP2015233132A (ja) * | 2014-05-12 | 2015-12-24 | ローム株式会社 | 半導体装置 |
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