JPS54150988A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS54150988A
JPS54150988A JP5873978A JP5873978A JPS54150988A JP S54150988 A JPS54150988 A JP S54150988A JP 5873978 A JP5873978 A JP 5873978A JP 5873978 A JP5873978 A JP 5873978A JP S54150988 A JPS54150988 A JP S54150988A
Authority
JP
Japan
Prior art keywords
layer
eutectic
heat sink
pressure
manufacture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5873978A
Other languages
Japanese (ja)
Inventor
Seiji Iida
Haruki Kurihara
Motoyuki Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP5873978A priority Critical patent/JPS54150988A/en
Publication of JPS54150988A publication Critical patent/JPS54150988A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Semiconductor Lasers (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE: To secure the highly reliable mounting by providing the Au layer on the heat sink and then pressure-bonding the semiconductor element via the In layer.
CONSTITUTION: Au layer 32 forming the eutectic with In is provided on heat sink 31 of Cu, and In layer 33 is formed on layer 32. Then element 34 and ceramic terminal 35 are mounted to be pressure-bonded. After the pressure bonding, both Au and In are heated up in the reducing atmosphere to obtain the eutectic of Au-In. With this eutectic, element 34 and terminal 35 can be sealed firmly to heat sink 31 at a high fusing point.
COPYRIGHT: (C)1979,JPO&Japio
JP5873978A 1978-05-19 1978-05-19 Manufacture of semiconductor device Pending JPS54150988A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5873978A JPS54150988A (en) 1978-05-19 1978-05-19 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5873978A JPS54150988A (en) 1978-05-19 1978-05-19 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS54150988A true JPS54150988A (en) 1979-11-27

Family

ID=13092878

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5873978A Pending JPS54150988A (en) 1978-05-19 1978-05-19 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS54150988A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60176244A (en) * 1984-02-22 1985-09-10 Sumitomo Electric Ind Ltd Adhesive part of semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60176244A (en) * 1984-02-22 1985-09-10 Sumitomo Electric Ind Ltd Adhesive part of semiconductor device

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