JPS54109771A - Stabilizing method for surface protective film of semiconductor - Google Patents
Stabilizing method for surface protective film of semiconductorInfo
- Publication number
- JPS54109771A JPS54109771A JP1720078A JP1720078A JPS54109771A JP S54109771 A JPS54109771 A JP S54109771A JP 1720078 A JP1720078 A JP 1720078A JP 1720078 A JP1720078 A JP 1720078A JP S54109771 A JPS54109771 A JP S54109771A
- Authority
- JP
- Japan
- Prior art keywords
- film
- substrate
- surface protective
- heater
- protective film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To obtain a surface protective film which is stabilized with 1-digit lower interface level than that obtained through oxidation in the dried O2, by coating the Si3N4 film on the semicnductor substrate and then oxidizing the film in the O2 gas atmosphere containing the vapor.
CONSTITUTION: SiO2 film 2 is formed about 1000Å thickness on the surface of Si substrate 1, and then Si3N4 film is coated about 500Å thick on film 2 for a purpose of the alkali ion block. Substrate 24 of such lamination is put into diffusion furnace 25, and the O2 gas which passed through demineralized evaporator 21 kept at about 90°C by heater 22 is sent there furthermore being heated up by heater 23. In this case, substrate 24 is heated previously up to about 1050°C, and about 30- minute heat treatment is given to form silicon nitride oxide film 4. As a result, a reaction is produced between O2 in the water molecule and Si in film 3 to oxidize part of film 3, and the produced H2 molecule is accumulated in film 3 and the Si3N4 film. Thus, the interface level density is lowered for the substrate.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1720078A JPS54109771A (en) | 1978-02-16 | 1978-02-16 | Stabilizing method for surface protective film of semiconductor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1720078A JPS54109771A (en) | 1978-02-16 | 1978-02-16 | Stabilizing method for surface protective film of semiconductor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS54109771A true JPS54109771A (en) | 1979-08-28 |
Family
ID=11937289
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1720078A Pending JPS54109771A (en) | 1978-02-16 | 1978-02-16 | Stabilizing method for surface protective film of semiconductor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54109771A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5814537A (en) * | 1981-07-17 | 1983-01-27 | Nec Corp | Manufacture of semiconductor device |
JP2007045455A (en) * | 2005-08-09 | 2007-02-22 | Nippon Muki Co Ltd | Packing structure, packing method, and unpacking method for air filter |
-
1978
- 1978-02-16 JP JP1720078A patent/JPS54109771A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5814537A (en) * | 1981-07-17 | 1983-01-27 | Nec Corp | Manufacture of semiconductor device |
JPS6351375B2 (en) * | 1981-07-17 | 1988-10-13 | Nippon Electric Co | |
JP2007045455A (en) * | 2005-08-09 | 2007-02-22 | Nippon Muki Co Ltd | Packing structure, packing method, and unpacking method for air filter |
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