JPS54100261A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS54100261A JPS54100261A JP699878A JP699878A JPS54100261A JP S54100261 A JPS54100261 A JP S54100261A JP 699878 A JP699878 A JP 699878A JP 699878 A JP699878 A JP 699878A JP S54100261 A JPS54100261 A JP S54100261A
- Authority
- JP
- Japan
- Prior art keywords
- solution
- soaked
- junction
- eliminate
- several
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Led Devices (AREA)
- Weting (AREA)
- Led Device Packages (AREA)
Abstract
PURPOSE: To avoid the lowering of the output and to increase the reliability by giving etching of several mμ to the fractionated and exposed pn junction to eliminate the damage at the periphery.
CONSTITUTION: The GaAs pellet is soaked about 10 seconds into the solution of 25°C temperature obtained by dissolving Br of about 5% into CH3OH, and then soaked about two minuted into the solution of H2SO4:H2O:H2O2 = 1:10;1 at 20°C. After this, about 20-second etching is given via the solution of HF:ZHN3:H2O = 1:3:2 at 30°C. As a result, the exposed surface of the pn junction is etched away about several mμ to eliminate the damaged part caused at the pellet formation time, thus obtaining a highly reliable semiconductor device. With this method, the III-V group compound semiconductor and the mixed crystal compound semiconductor devices can secure the high reliability.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP699878A JPS54100261A (en) | 1978-01-24 | 1978-01-24 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP699878A JPS54100261A (en) | 1978-01-24 | 1978-01-24 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS54100261A true JPS54100261A (en) | 1979-08-07 |
Family
ID=11653773
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP699878A Pending JPS54100261A (en) | 1978-01-24 | 1978-01-24 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54100261A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05124699A (en) * | 1992-04-30 | 1993-05-21 | Tokico Ltd | Constant volume shipping device |
CN108485668A (en) * | 2018-04-08 | 2018-09-04 | 宜特(上海)检测技术有限公司 | Knot staining solution and its knot colouring method for gallium arsenide semiconductor |
-
1978
- 1978-01-24 JP JP699878A patent/JPS54100261A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05124699A (en) * | 1992-04-30 | 1993-05-21 | Tokico Ltd | Constant volume shipping device |
CN108485668A (en) * | 2018-04-08 | 2018-09-04 | 宜特(上海)检测技术有限公司 | Knot staining solution and its knot colouring method for gallium arsenide semiconductor |
CN108485668B (en) * | 2018-04-08 | 2021-01-22 | 苏试宜特(上海)检测技术有限公司 | Junction dyeing solution for gallium arsenide semiconductor and junction dyeing method thereof |
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