Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Hitachi Ltd
Original Assignee
Hitachi Ltd
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Publication date
Application filed by Hitachi LtdfiledCriticalHitachi Ltd
Priority to JP7430276ApriorityCriticalpatent/JPS53982A/en
Publication of JPS53982ApublicationCriticalpatent/JPS53982A/en
PURPOSE: To reduce the assembly time and prevent deformation of a chipping or soldering ball by leaving behind a trace of a groove for separating a dielectric which is formed on the surface of polycrystal silicon of a semiconductor chip.
COPYRIGHT: (C)1978,JPO&Japio
JP7430276A1976-06-251976-06-25Preparation of substrate for semiconductor integrated circuit
PendingJPS53982A
(en)