JPS5393780A - Production of semiconductor device - Google Patents

Production of semiconductor device

Info

Publication number
JPS5393780A
JPS5393780A JP833677A JP833677A JPS5393780A JP S5393780 A JPS5393780 A JP S5393780A JP 833677 A JP833677 A JP 833677A JP 833677 A JP833677 A JP 833677A JP S5393780 A JPS5393780 A JP S5393780A
Authority
JP
Japan
Prior art keywords
production
elements
semiconductor device
solder
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP833677A
Other languages
English (en)
Japanese (ja)
Other versions
JPS575055B2 (enrdf_load_stackoverflow
Inventor
Taku Aoki
Shigeo Mizogami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP833677A priority Critical patent/JPS5393780A/ja
Publication of JPS5393780A publication Critical patent/JPS5393780A/ja
Publication of JPS575055B2 publication Critical patent/JPS575055B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
    • H01L2224/9222—Sequential connecting processes
    • H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector

Landscapes

  • Die Bonding (AREA)
JP833677A 1977-01-27 1977-01-27 Production of semiconductor device Granted JPS5393780A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP833677A JPS5393780A (en) 1977-01-27 1977-01-27 Production of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP833677A JPS5393780A (en) 1977-01-27 1977-01-27 Production of semiconductor device

Publications (2)

Publication Number Publication Date
JPS5393780A true JPS5393780A (en) 1978-08-17
JPS575055B2 JPS575055B2 (enrdf_load_stackoverflow) 1982-01-28

Family

ID=11690341

Family Applications (1)

Application Number Title Priority Date Filing Date
JP833677A Granted JPS5393780A (en) 1977-01-27 1977-01-27 Production of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5393780A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02244732A (ja) * 1989-03-17 1990-09-28 Sanken Electric Co Ltd 電子素子の固着方法
JPH02244731A (ja) * 1989-03-17 1990-09-28 Sanken Electric Co Ltd 電子素子の固着方法
US5601493A (en) * 1992-10-22 1997-02-11 Sumitomo Chemical Company Limited Drive shaft made of fiber reinforced plastics, and method for connecting pipe made of fire-reinforced plastics

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS622652U (enrdf_load_stackoverflow) * 1985-06-20 1987-01-09

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02244732A (ja) * 1989-03-17 1990-09-28 Sanken Electric Co Ltd 電子素子の固着方法
JPH02244731A (ja) * 1989-03-17 1990-09-28 Sanken Electric Co Ltd 電子素子の固着方法
US5601493A (en) * 1992-10-22 1997-02-11 Sumitomo Chemical Company Limited Drive shaft made of fiber reinforced plastics, and method for connecting pipe made of fire-reinforced plastics

Also Published As

Publication number Publication date
JPS575055B2 (enrdf_load_stackoverflow) 1982-01-28

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