JPS5385162A - Production of semiconductor device - Google Patents

Production of semiconductor device

Info

Publication number
JPS5385162A
JPS5385162A JP15805776A JP15805776A JPS5385162A JP S5385162 A JPS5385162 A JP S5385162A JP 15805776 A JP15805776 A JP 15805776A JP 15805776 A JP15805776 A JP 15805776A JP S5385162 A JPS5385162 A JP S5385162A
Authority
JP
Japan
Prior art keywords
production
semiconductor device
semiconductor package
beforehand
preheating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15805776A
Other languages
Japanese (ja)
Other versions
JPS5634091B2 (en
Inventor
Norishige Hisatsugu
Eiji Yamamura
Shigeru Yokogawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP15805776A priority Critical patent/JPS5385162A/en
Publication of JPS5385162A publication Critical patent/JPS5385162A/en
Publication of JPS5634091B2 publication Critical patent/JPS5634091B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/83009—Pre-treatment of the layer connector or the bonding area
    • H01L2224/83048—Thermal treatments, e.g. annealing, controlled pre-heating or pre-cooling

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE: To perform bonding at a low temperature and within a short time by locally heating the semiconductor package portion while applying pressure to a semiconductor chip after beforehand preheating the semiconductor package.
COPYRIGHT: (C)1978,JPO&Japio
JP15805776A 1976-12-31 1976-12-31 Production of semiconductor device Granted JPS5385162A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15805776A JPS5385162A (en) 1976-12-31 1976-12-31 Production of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15805776A JPS5385162A (en) 1976-12-31 1976-12-31 Production of semiconductor device

Publications (2)

Publication Number Publication Date
JPS5385162A true JPS5385162A (en) 1978-07-27
JPS5634091B2 JPS5634091B2 (en) 1981-08-07

Family

ID=15663343

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15805776A Granted JPS5385162A (en) 1976-12-31 1976-12-31 Production of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5385162A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4840807A (en) * 1971-09-25 1973-06-15

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4840807A (en) * 1971-09-25 1973-06-15

Also Published As

Publication number Publication date
JPS5634091B2 (en) 1981-08-07

Similar Documents

Publication Publication Date Title
JPS5385162A (en) Production of semiconductor device
JPS5385160A (en) Production of semiconductor device
JPS5211866A (en) Resin sealing method in a semiconductor device
JPS5230167A (en) Method for production of semiconductor device
JPS51147255A (en) Semiconductor device
JPS51151069A (en) Electrode forming method of a semiconductor element
JPS544568A (en) Semiconductor device and production of the same
JPS547869A (en) Lead bending method of semiconductor device
JPS526091A (en) Production method of semiconductor device
JPS54578A (en) Resin seal semiconductor device
JPS52143767A (en) Production of semiconductor device
JPS5258369A (en) Production of semiconductor device
JPS5339868A (en) Packaging method of semiconductor device
JPS5230163A (en) Method for junction of semiconductor parts
JPS51144179A (en) Element fixing method in semiconductor unit
JPS5397367A (en) Semiconductor device and its manufacture
JPS5287981A (en) Semiconductor device
JPS5242369A (en) Process for production of semiconductor device
JPS5333057A (en) Bump type semiconductor device
JPS526092A (en) Production method of semiconductor device
JPS5237771A (en) Process for production of semiconductor
JPS5240064A (en) Process for production of semiconductor device
JPS5360172A (en) Production of semiconductor device
JPS5370671A (en) Production of semiconductor device
JPS51144577A (en) Semiconductor device