JPS5381073A - Oroduction of resin seal type semiconductor device and lead frame used the same - Google Patents

Oroduction of resin seal type semiconductor device and lead frame used the same

Info

Publication number
JPS5381073A
JPS5381073A JP15653176A JP15653176A JPS5381073A JP S5381073 A JPS5381073 A JP S5381073A JP 15653176 A JP15653176 A JP 15653176A JP 15653176 A JP15653176 A JP 15653176A JP S5381073 A JPS5381073 A JP S5381073A
Authority
JP
Japan
Prior art keywords
lead frame
oroduction
semiconductor device
same
type semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15653176A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5730307B2 (enExample
Inventor
Akira Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP15653176A priority Critical patent/JPS5381073A/ja
Publication of JPS5381073A publication Critical patent/JPS5381073A/ja
Publication of JPS5730307B2 publication Critical patent/JPS5730307B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP15653176A 1976-12-27 1976-12-27 Oroduction of resin seal type semiconductor device and lead frame used the same Granted JPS5381073A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15653176A JPS5381073A (en) 1976-12-27 1976-12-27 Oroduction of resin seal type semiconductor device and lead frame used the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15653176A JPS5381073A (en) 1976-12-27 1976-12-27 Oroduction of resin seal type semiconductor device and lead frame used the same

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP56161012A Division JPS57132345A (en) 1981-10-12 1981-10-12 Lead frame

Publications (2)

Publication Number Publication Date
JPS5381073A true JPS5381073A (en) 1978-07-18
JPS5730307B2 JPS5730307B2 (enExample) 1982-06-28

Family

ID=15629818

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15653176A Granted JPS5381073A (en) 1976-12-27 1976-12-27 Oroduction of resin seal type semiconductor device and lead frame used the same

Country Status (1)

Country Link
JP (1) JPS5381073A (enExample)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5521124A (en) * 1978-08-02 1980-02-15 Hitachi Ltd Lead frame
JPS5587469A (en) * 1978-12-25 1980-07-02 Fujitsu Ltd Semiconductor device and its manufacture
JPS5632462U (enExample) * 1979-08-20 1981-03-30
JPS59136956A (ja) * 1983-01-25 1984-08-06 Rohm Co Ltd 半導体装置
JPS59143334A (ja) * 1983-02-03 1984-08-16 Rohm Co Ltd 半導体装置の製造方法
JPS59148354A (ja) * 1983-02-15 1984-08-25 Internatl Rectifier Corp Japan Ltd 半導体装置用リ−ドフレ−ム
JPS60121751A (ja) * 1984-07-25 1985-06-29 Hitachi Ltd 半導体装置の製法
JPS6271253A (ja) * 1985-07-23 1987-04-01 フエアチヤイルド　セミコンダクタ　コ−ポレ−シヨン 半導体チツプパツケ−ジ構成及びそのテスト及び基板上への装着の容易化方法
JPS63205941A (ja) * 1987-02-23 1988-08-25 Sony Corp 半導体装置
JPS6489354A (en) * 1987-09-29 1989-04-03 Nec Corp Flat package
JPH0334358A (ja) * 1989-06-29 1991-02-14 Nec Corp 樹脂封止型半導体装置の製造方法
JPH04127459A (ja) * 1990-09-18 1992-04-28 Nec Kyushu Ltd 半導体装置の製造方法

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5521124A (en) * 1978-08-02 1980-02-15 Hitachi Ltd Lead frame
JPS5587469A (en) * 1978-12-25 1980-07-02 Fujitsu Ltd Semiconductor device and its manufacture
JPS5632462U (enExample) * 1979-08-20 1981-03-30
JPS59136956A (ja) * 1983-01-25 1984-08-06 Rohm Co Ltd 半導体装置
JPS59143334A (ja) * 1983-02-03 1984-08-16 Rohm Co Ltd 半導体装置の製造方法
JPS59148354A (ja) * 1983-02-15 1984-08-25 Internatl Rectifier Corp Japan Ltd 半導体装置用リ−ドフレ−ム
JPS60121751A (ja) * 1984-07-25 1985-06-29 Hitachi Ltd 半導体装置の製法
JPS6271253A (ja) * 1985-07-23 1987-04-01 フエアチヤイルド　セミコンダクタ　コ−ポレ−シヨン 半導体チツプパツケ−ジ構成及びそのテスト及び基板上への装着の容易化方法
JPS63205941A (ja) * 1987-02-23 1988-08-25 Sony Corp 半導体装置
JPS6489354A (en) * 1987-09-29 1989-04-03 Nec Corp Flat package
JPH0334358A (ja) * 1989-06-29 1991-02-14 Nec Corp 樹脂封止型半導体装置の製造方法
JPH04127459A (ja) * 1990-09-18 1992-04-28 Nec Kyushu Ltd 半導体装置の製造方法

Also Published As

Publication number Publication date
JPS5730307B2 (enExample) 1982-06-28

Similar Documents

Publication Publication Date Title
JPS5381073A (en) Oroduction of resin seal type semiconductor device and lead frame used the same
JPS5240062A (en) Process for production of semiconductor devices
JPS5294074A (en) Leading-in frame
JPS5381076A (en) Lroduction of resin seal semiconductor device
JPS5231673A (en) Resin sealing method of semiconductor device
JPS5366170A (en) Lead frame with prodjection
JPS51112273A (en) Lead frame for resin mold type semiconductor device
JPS536193A (en) Means for packing washing machine
JPS5325360A (en) Production of semiconductor device
JPS5287982A (en) Resin molding method of semiconductor elements
JPS5242074A (en) Detecting method of position
JPS53104171A (en) Mold for semiconductor device
JPS5285474A (en) Semiconductor device
JPS5252370A (en) Fabrication of glass-sealed semiconductor device
JPS5387173A (en) Molding mold
JPS51148594A (en) Thermo-shrink packaging method with improved seal-brakability
JPS5338974A (en) Manufacture of semiconductor device
JPS53108368A (en) Manufacture for resin seal type semiconductor device and its lead frame for its manufacture
JPS51120354A (en) Axis sealer device
JPS5339870A (en) Semiconductor device
JPS5366677A (en) Product conveyer
JPS52179A (en) Method of fabricating semiconductor
JPS5336546A (en) Stabilized rubber composition
JPS53124073A (en) Sealing unit for glass sealing type semiconductor device
JPS5237357A (en) Device for positioning suspenser