JPS5632462U - - Google Patents
Info
- Publication number
- JPS5632462U JPS5632462U JP11414579U JP11414579U JPS5632462U JP S5632462 U JPS5632462 U JP S5632462U JP 11414579 U JP11414579 U JP 11414579U JP 11414579 U JP11414579 U JP 11414579U JP S5632462 U JPS5632462 U JP S5632462U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11414579U JPS5632462U (enExample) | 1979-08-20 | 1979-08-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11414579U JPS5632462U (enExample) | 1979-08-20 | 1979-08-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5632462U true JPS5632462U (enExample) | 1981-03-30 |
Family
ID=29346405
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11414579U Pending JPS5632462U (enExample) | 1979-08-20 | 1979-08-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5632462U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6298759A (ja) * | 1985-10-25 | 1987-05-08 | Mitsubishi Electric Corp | 電子デバイス |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5381073A (en) * | 1976-12-27 | 1978-07-18 | Hitachi Ltd | Oroduction of resin seal type semiconductor device and lead frame used the same |
-
1979
- 1979-08-20 JP JP11414579U patent/JPS5632462U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5381073A (en) * | 1976-12-27 | 1978-07-18 | Hitachi Ltd | Oroduction of resin seal type semiconductor device and lead frame used the same |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6298759A (ja) * | 1985-10-25 | 1987-05-08 | Mitsubishi Electric Corp | 電子デバイス |