JPS5354970A - Production of semiconductor device - Google Patents

Production of semiconductor device

Info

Publication number
JPS5354970A
JPS5354970A JP13027676A JP13027676A JPS5354970A JP S5354970 A JPS5354970 A JP S5354970A JP 13027676 A JP13027676 A JP 13027676A JP 13027676 A JP13027676 A JP 13027676A JP S5354970 A JPS5354970 A JP S5354970A
Authority
JP
Japan
Prior art keywords
production
semiconductor device
bonding
satusfactory
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13027676A
Other languages
Japanese (ja)
Inventor
Michihiro Kobiki
Shigeru Mitsui
Michio Kotani
Saburo Takamiya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP13027676A priority Critical patent/JPS5354970A/en
Publication of JPS5354970A publication Critical patent/JPS5354970A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE: To perform satusfactory bonding by removing the oxide film on the surface of eutectic alloy and cooling an element while compression bonding to a package.
COPYRIGHT: (C)1978,JPO&Japio
JP13027676A 1976-10-28 1976-10-28 Production of semiconductor device Pending JPS5354970A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13027676A JPS5354970A (en) 1976-10-28 1976-10-28 Production of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13027676A JPS5354970A (en) 1976-10-28 1976-10-28 Production of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5354970A true JPS5354970A (en) 1978-05-18

Family

ID=15030422

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13027676A Pending JPS5354970A (en) 1976-10-28 1976-10-28 Production of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5354970A (en)

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