JPS5348461A - Wire bonder - Google Patents

Wire bonder

Info

Publication number
JPS5348461A
JPS5348461A JP12278576A JP12278576A JPS5348461A JP S5348461 A JPS5348461 A JP S5348461A JP 12278576 A JP12278576 A JP 12278576A JP 12278576 A JP12278576 A JP 12278576A JP S5348461 A JPS5348461 A JP S5348461A
Authority
JP
Japan
Prior art keywords
wire bonder
bonding
linearly
bases
yield
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12278576A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6142417B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Yuzo Taniguchi
Michio Tanimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP12278576A priority Critical patent/JPS5348461A/ja
Publication of JPS5348461A publication Critical patent/JPS5348461A/ja
Publication of JPS6142417B2 publication Critical patent/JPS6142417B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP12278576A 1976-10-15 1976-10-15 Wire bonder Granted JPS5348461A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12278576A JPS5348461A (en) 1976-10-15 1976-10-15 Wire bonder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12278576A JPS5348461A (en) 1976-10-15 1976-10-15 Wire bonder

Publications (2)

Publication Number Publication Date
JPS5348461A true JPS5348461A (en) 1978-05-01
JPS6142417B2 JPS6142417B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1986-09-20

Family

ID=14844542

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12278576A Granted JPS5348461A (en) 1976-10-15 1976-10-15 Wire bonder

Country Status (1)

Country Link
JP (1) JPS5348461A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61226936A (ja) * 1985-03-30 1986-10-08 Toshiba Corp ワイヤボンデイング方法および装置
JPS61235714A (ja) * 1985-04-11 1986-10-21 Nippon Kogaku Kk <Nikon> ワ−ク座標系による駆動装置
JPS6269115A (ja) * 1985-09-24 1987-03-30 Nippon Kogaku Kk <Nikon> ワ−ク座標系による駆動装置
US6286749B1 (en) 1998-01-23 2001-09-11 Hyundai Electronics Industries Co., Ltd. Apparatus for moving a bonding head of a wire bonder in X, Y and Z axial directions

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61226936A (ja) * 1985-03-30 1986-10-08 Toshiba Corp ワイヤボンデイング方法および装置
JPS61235714A (ja) * 1985-04-11 1986-10-21 Nippon Kogaku Kk <Nikon> ワ−ク座標系による駆動装置
JPS6269115A (ja) * 1985-09-24 1987-03-30 Nippon Kogaku Kk <Nikon> ワ−ク座標系による駆動装置
US6286749B1 (en) 1998-01-23 2001-09-11 Hyundai Electronics Industries Co., Ltd. Apparatus for moving a bonding head of a wire bonder in X, Y and Z axial directions

Also Published As

Publication number Publication date
JPS6142417B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1986-09-20

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