JPS6142417B2 - - Google Patents
Info
- Publication number
- JPS6142417B2 JPS6142417B2 JP51122785A JP12278576A JPS6142417B2 JP S6142417 B2 JPS6142417 B2 JP S6142417B2 JP 51122785 A JP51122785 A JP 51122785A JP 12278576 A JP12278576 A JP 12278576A JP S6142417 B2 JPS6142417 B2 JP S6142417B2
- Authority
- JP
- Japan
- Prior art keywords
- speed
- ratio
- bonding wire
- movement
- distance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000001133 acceleration Effects 0.000 claims description 8
- 238000010586 diagram Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12278576A JPS5348461A (en) | 1976-10-15 | 1976-10-15 | Wire bonder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12278576A JPS5348461A (en) | 1976-10-15 | 1976-10-15 | Wire bonder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5348461A JPS5348461A (en) | 1978-05-01 |
| JPS6142417B2 true JPS6142417B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1986-09-20 |
Family
ID=14844542
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12278576A Granted JPS5348461A (en) | 1976-10-15 | 1976-10-15 | Wire bonder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5348461A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61226936A (ja) * | 1985-03-30 | 1986-10-08 | Toshiba Corp | ワイヤボンデイング方法および装置 |
| JPS61235714A (ja) * | 1985-04-11 | 1986-10-21 | Nippon Kogaku Kk <Nikon> | ワ−ク座標系による駆動装置 |
| JPH07104142B2 (ja) * | 1985-09-24 | 1995-11-13 | 株式会社ニコン | ワ−ク座標系による駆動装置 |
| US6286749B1 (en) | 1998-01-23 | 2001-09-11 | Hyundai Electronics Industries Co., Ltd. | Apparatus for moving a bonding head of a wire bonder in X, Y and Z axial directions |
-
1976
- 1976-10-15 JP JP12278576A patent/JPS5348461A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5348461A (en) | 1978-05-01 |