JPS5337383A - Semiconductor integrated circuit - Google Patents
Semiconductor integrated circuitInfo
- Publication number
- JPS5337383A JPS5337383A JP11185376A JP11185376A JPS5337383A JP S5337383 A JPS5337383 A JP S5337383A JP 11185376 A JP11185376 A JP 11185376A JP 11185376 A JP11185376 A JP 11185376A JP S5337383 A JPS5337383 A JP S5337383A
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- semiconductor integrated
- facilitated
- later
- heat treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11185376A JPS5337383A (en) | 1976-09-20 | 1976-09-20 | Semiconductor integrated circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11185376A JPS5337383A (en) | 1976-09-20 | 1976-09-20 | Semiconductor integrated circuit |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5337383A true JPS5337383A (en) | 1978-04-06 |
Family
ID=14571789
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11185376A Pending JPS5337383A (en) | 1976-09-20 | 1976-09-20 | Semiconductor integrated circuit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5337383A (ja) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5892230A (ja) * | 1981-11-27 | 1983-06-01 | Mitsubishi Electric Corp | 半導体装置 |
JPS594064A (ja) * | 1982-06-18 | 1984-01-10 | エヌ・ベ−・フイリツプス・フル−イランペンフアブリケン | 高周波回路装置 |
JPS59229850A (ja) * | 1983-05-16 | 1984-12-24 | Rohm Co Ltd | 半導体装置 |
JPS6080232A (ja) * | 1983-10-11 | 1985-05-08 | Nippon Telegr & Teleph Corp <Ntt> | Lsiチツプ実装用カ−ド |
JPS60113978A (ja) * | 1983-11-25 | 1985-06-20 | Sumitomo Electric Ind Ltd | 光素子 |
JPS60124885A (ja) * | 1983-12-08 | 1985-07-03 | Sumitomo Electric Ind Ltd | 受光ダイオードの製造方法 |
JPS62103264U (ja) * | 1985-12-18 | 1987-07-01 | ||
JPH02252273A (ja) * | 1989-03-27 | 1990-10-11 | Furukawa Electric Co Ltd:The | Ledアレイチップとヒートシンク基板との接合方法 |
JP2002083925A (ja) * | 2000-09-11 | 2002-03-22 | Rohm Co Ltd | 集積回路装置 |
US6989605B2 (en) | 1997-03-10 | 2006-01-24 | Seiko Epson Corporation | Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board |
JP2011244008A (ja) * | 2011-08-05 | 2011-12-01 | Lapis Semiconductor Co Ltd | 半導体装置の製造方法 |
US8748229B2 (en) | 2008-06-11 | 2014-06-10 | Fujitsu Semiconductor Limited | Manufacturing method including deformation of supporting board to accommodate semiconductor device |
-
1976
- 1976-09-20 JP JP11185376A patent/JPS5337383A/ja active Pending
Cited By (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6347259B2 (ja) * | 1981-11-27 | 1988-09-21 | Mitsubishi Electric Corp | |
JPS5892230A (ja) * | 1981-11-27 | 1983-06-01 | Mitsubishi Electric Corp | 半導体装置 |
JPS594064A (ja) * | 1982-06-18 | 1984-01-10 | エヌ・ベ−・フイリツプス・フル−イランペンフアブリケン | 高周波回路装置 |
JPS59229850A (ja) * | 1983-05-16 | 1984-12-24 | Rohm Co Ltd | 半導体装置 |
JPS6080232A (ja) * | 1983-10-11 | 1985-05-08 | Nippon Telegr & Teleph Corp <Ntt> | Lsiチツプ実装用カ−ド |
JPS60113978A (ja) * | 1983-11-25 | 1985-06-20 | Sumitomo Electric Ind Ltd | 光素子 |
JPH0478031B2 (ja) * | 1983-12-08 | 1992-12-10 | Sumitomo Electric Industries | |
JPS60124885A (ja) * | 1983-12-08 | 1985-07-03 | Sumitomo Electric Ind Ltd | 受光ダイオードの製造方法 |
JPS62103264U (ja) * | 1985-12-18 | 1987-07-01 | ||
JPH02252273A (ja) * | 1989-03-27 | 1990-10-11 | Furukawa Electric Co Ltd:The | Ledアレイチップとヒートシンク基板との接合方法 |
US6989605B2 (en) | 1997-03-10 | 2006-01-24 | Seiko Epson Corporation | Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board |
US7119445B2 (en) | 1997-03-10 | 2006-10-10 | Seiko Epson Corporation | Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board |
US7436071B2 (en) | 1997-03-10 | 2008-10-14 | Seiko Epson Corporation | Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board |
US7598619B2 (en) | 1997-03-10 | 2009-10-06 | Seiko Epson Corporation | Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board |
US7932612B2 (en) | 1997-03-10 | 2011-04-26 | Seiko Epson Corporation | Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board |
US8134237B2 (en) | 1997-03-10 | 2012-03-13 | Seiko Epson Corporation | Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board |
JP2002083925A (ja) * | 2000-09-11 | 2002-03-22 | Rohm Co Ltd | 集積回路装置 |
US8748229B2 (en) | 2008-06-11 | 2014-06-10 | Fujitsu Semiconductor Limited | Manufacturing method including deformation of supporting board to accommodate semiconductor device |
JP2011244008A (ja) * | 2011-08-05 | 2011-12-01 | Lapis Semiconductor Co Ltd | 半導体装置の製造方法 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5337383A (en) | Semiconductor integrated circuit | |
JPS522277A (en) | Soldering device | |
JPS51112193A (en) | Processing method of semiconductor equipment | |
JPS5210032A (en) | Construction method of semiconductor memory unit | |
JPS5342659A (en) | Semiconductor integrated circuit | |
JPS5218173A (en) | Soldering method of semiconductor element | |
JPS5294073A (en) | Leading-in frame and process for preparing it | |
JPS5441666A (en) | Semiconductor integrated circuit element | |
JPS53115179A (en) | Cooling method of circuit parts | |
JPS52103983A (en) | Semiconductor integrated circuit | |
JPS5230163A (en) | Method for junction of semiconductor parts | |
JPS5432278A (en) | Semiconductor device | |
JPS544568A (en) | Semiconductor device and production of the same | |
JPS5379461A (en) | Semiconductor device and its manufacturing process | |
JPS51126762A (en) | Integrated circuit manufacturing process | |
JPS52143186A (en) | Taping device | |
JPS5349972A (en) | Manufacture of semiconductor device | |
JPS51112279A (en) | Semiconductor device | |
JPS51142978A (en) | Mounting method of circuit elements | |
JPS51113469A (en) | Manufacturing method of semiconductor device | |
JPS52144921A (en) | Clear circuit | |
JPS52179A (en) | Method of fabricating semiconductor | |
JPS5216965A (en) | Method of amalgam making in tube bulb | |
JPS5270772A (en) | Semiconductor rectifier | |
JPS5379317A (en) | Chrominance components processing unit |