JPS53148968A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS53148968A
JPS53148968A JP6441077A JP6441077A JPS53148968A JP S53148968 A JPS53148968 A JP S53148968A JP 6441077 A JP6441077 A JP 6441077A JP 6441077 A JP6441077 A JP 6441077A JP S53148968 A JPS53148968 A JP S53148968A
Authority
JP
Japan
Prior art keywords
manufacture
semiconductor device
metal film
projection electrodes
resist
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6441077A
Other languages
Japanese (ja)
Inventor
Kenzo Hatada
Kosei Kajiwara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP6441077A priority Critical patent/JPS53148968A/en
Publication of JPS53148968A publication Critical patent/JPS53148968A/en
Priority to US06/082,426 priority patent/US4293637A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01024—Chromium [Cr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]

Landscapes

  • Electrodes Of Semiconductors (AREA)

Abstract

PURPOSE: To form the projection electrodes featuring a high adhesive force and with a uniform height by providing a connection opening to the insulator film on the external lead-out wiring layer, coating a metal film, installing the projection electrodes via the mask, and then removing the metal film via the resist.
COPYRIGHT: (C)1978,JPO&Japio
JP6441077A 1977-05-31 1977-05-31 Manufacture of semiconductor device Pending JPS53148968A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP6441077A JPS53148968A (en) 1977-05-31 1977-05-31 Manufacture of semiconductor device
US06/082,426 US4293637A (en) 1977-05-31 1979-10-05 Method of making metal electrode of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6441077A JPS53148968A (en) 1977-05-31 1977-05-31 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS53148968A true JPS53148968A (en) 1978-12-26

Family

ID=13257493

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6441077A Pending JPS53148968A (en) 1977-05-31 1977-05-31 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS53148968A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56100450A (en) * 1980-01-11 1981-08-12 Seiko Instr & Electronics Ltd Manufacture of projected electrode of semiconductor device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS504312U (en) * 1973-05-08 1975-01-17
JPS52670A (en) * 1975-06-13 1977-01-06 Fumio Ozawa Sonar

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS504312U (en) * 1973-05-08 1975-01-17
JPS52670A (en) * 1975-06-13 1977-01-06 Fumio Ozawa Sonar

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56100450A (en) * 1980-01-11 1981-08-12 Seiko Instr & Electronics Ltd Manufacture of projected electrode of semiconductor device

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