JPS53117969A - Regeneration of semiconductor device - Google Patents

Regeneration of semiconductor device

Info

Publication number
JPS53117969A
JPS53117969A JP3267477A JP3267477A JPS53117969A JP S53117969 A JPS53117969 A JP S53117969A JP 3267477 A JP3267477 A JP 3267477A JP 3267477 A JP3267477 A JP 3267477A JP S53117969 A JPS53117969 A JP S53117969A
Authority
JP
Japan
Prior art keywords
regeneration
semiconductor device
defective
beam leads
remote
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3267477A
Other languages
Japanese (ja)
Other versions
JPS5917849B2 (en
Inventor
Koji Serizawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP52032674A priority Critical patent/JPS5917849B2/en
Publication of JPS53117969A publication Critical patent/JPS53117969A/en
Publication of JPS5917849B2 publication Critical patent/JPS5917849B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To remote a defective IC from a common substrate by cutting beam leads and mounting a non-defective IC to the place where the remaining lead part is removed from conductive pattern by beam leads bonding.
COPYRIGHT: (C)1978,JPO&Japio
JP52032674A 1977-03-24 1977-03-24 How to recycle semiconductor devices Expired JPS5917849B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP52032674A JPS5917849B2 (en) 1977-03-24 1977-03-24 How to recycle semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP52032674A JPS5917849B2 (en) 1977-03-24 1977-03-24 How to recycle semiconductor devices

Publications (2)

Publication Number Publication Date
JPS53117969A true JPS53117969A (en) 1978-10-14
JPS5917849B2 JPS5917849B2 (en) 1984-04-24

Family

ID=12365410

Family Applications (1)

Application Number Title Priority Date Filing Date
JP52032674A Expired JPS5917849B2 (en) 1977-03-24 1977-03-24 How to recycle semiconductor devices

Country Status (1)

Country Link
JP (1) JPS5917849B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4567643A (en) * 1983-10-24 1986-02-04 Sintra-Alcatel Method of replacing an electronic component connected to conducting tracks on a support substrate
US4954453A (en) * 1989-02-24 1990-09-04 At&T Bell Laboratories Method of producing an article comprising a multichip assembly

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4567643A (en) * 1983-10-24 1986-02-04 Sintra-Alcatel Method of replacing an electronic component connected to conducting tracks on a support substrate
US4954453A (en) * 1989-02-24 1990-09-04 At&T Bell Laboratories Method of producing an article comprising a multichip assembly

Also Published As

Publication number Publication date
JPS5917849B2 (en) 1984-04-24

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