JPS5268393A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS5268393A JPS5268393A JP50145481A JP14548175A JPS5268393A JP S5268393 A JPS5268393 A JP S5268393A JP 50145481 A JP50145481 A JP 50145481A JP 14548175 A JP14548175 A JP 14548175A JP S5268393 A JPS5268393 A JP S5268393A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- base electrode
- transistor
- electrode
- connects
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Light Receiving Elements (AREA)
Abstract
PURPOSE:To prevent malfunction in use of semiconductor device under open state of base electrode by forming conduction film which connects to earth electrode surrounding base electrode of transistor.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP50145481A JPS6019673B2 (en) | 1975-12-05 | 1975-12-05 | semiconductor equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP50145481A JPS6019673B2 (en) | 1975-12-05 | 1975-12-05 | semiconductor equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5268393A true JPS5268393A (en) | 1977-06-07 |
JPS6019673B2 JPS6019673B2 (en) | 1985-05-17 |
Family
ID=15386241
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP50145481A Expired JPS6019673B2 (en) | 1975-12-05 | 1975-12-05 | semiconductor equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6019673B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54125585U (en) * | 1978-01-11 | 1979-09-01 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02210179A (en) * | 1989-02-09 | 1990-08-21 | Hideo Otake | Window frame of building |
-
1975
- 1975-12-05 JP JP50145481A patent/JPS6019673B2/en not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54125585U (en) * | 1978-01-11 | 1979-09-01 |
Also Published As
Publication number | Publication date |
---|---|
JPS6019673B2 (en) | 1985-05-17 |
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