JPS5242370A - Process for production of semiconductor device - Google Patents

Process for production of semiconductor device

Info

Publication number
JPS5242370A
JPS5242370A JP50117693A JP11769375A JPS5242370A JP S5242370 A JPS5242370 A JP S5242370A JP 50117693 A JP50117693 A JP 50117693A JP 11769375 A JP11769375 A JP 11769375A JP S5242370 A JPS5242370 A JP S5242370A
Authority
JP
Japan
Prior art keywords
production
semiconductor device
resisting
solder
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50117693A
Other languages
English (en)
Inventor
Wataru Nozaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP50117693A priority Critical patent/JPS5242370A/ja
Publication of JPS5242370A publication Critical patent/JPS5242370A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
JP50117693A 1975-10-01 1975-10-01 Process for production of semiconductor device Pending JPS5242370A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50117693A JPS5242370A (en) 1975-10-01 1975-10-01 Process for production of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50117693A JPS5242370A (en) 1975-10-01 1975-10-01 Process for production of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5242370A true JPS5242370A (en) 1977-04-01

Family

ID=14717948

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50117693A Pending JPS5242370A (en) 1975-10-01 1975-10-01 Process for production of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5242370A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4818728A (en) * 1986-12-03 1989-04-04 Sharp Kabushiki Kaisha Method of making a hybrid semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4818728A (en) * 1986-12-03 1989-04-04 Sharp Kabushiki Kaisha Method of making a hybrid semiconductor device

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