Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi LtdfiledCriticalHitachi Ltd
Priority to JP7663375ApriorityCriticalpatent/JPS522175A/en
Publication of JPS522175ApublicationCriticalpatent/JPS522175A/en
PURPOSE: To form etching hole of high accuracy on (110) surface as etching mask hole in arcuate contacting tangentially inside the etched hole surrounded by monocrystal semiconductor in (112) direction.
COPYRIGHT: (C)1977,JPO&Japio
JP7663375A1975-06-241975-06-24Etching process
PendingJPS522175A
(en)