JPS52108340A - Copper oxide electroplating bath* additive composition therefor and method for forming levelled copper coat - Google Patents

Copper oxide electroplating bath* additive composition therefor and method for forming levelled copper coat

Info

Publication number
JPS52108340A
JPS52108340A JP2227577A JP2227577A JPS52108340A JP S52108340 A JPS52108340 A JP S52108340A JP 2227577 A JP2227577 A JP 2227577A JP 2227577 A JP2227577 A JP 2227577A JP S52108340 A JPS52108340 A JP S52108340A
Authority
JP
Japan
Prior art keywords
copper
forming
additive composition
levelled
electroplating bath
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2227577A
Other languages
English (en)
Inventor
Edowaado Ekuresu Uiriamu
Uorutaa Sutarinsaku Toomasu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hull & Co R O
Original Assignee
Hull & Co R O
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hull & Co R O filed Critical Hull & Co R O
Publication of JPS52108340A publication Critical patent/JPS52108340A/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Pyridine Compounds (AREA)
JP2227577A 1976-03-05 1977-03-03 Copper oxide electroplating bath* additive composition therefor and method for forming levelled copper coat Pending JPS52108340A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/664,278 US4038161A (en) 1976-03-05 1976-03-05 Acid copper plating and additive composition therefor

Publications (1)

Publication Number Publication Date
JPS52108340A true JPS52108340A (en) 1977-09-10

Family

ID=24665359

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2227577A Pending JPS52108340A (en) 1976-03-05 1977-03-03 Copper oxide electroplating bath* additive composition therefor and method for forming levelled copper coat

Country Status (7)

Country Link
US (1) US4038161A (ja)
JP (1) JPS52108340A (ja)
AU (1) AU2225477A (ja)
CA (1) CA1078323A (ja)
DE (1) DE2706521A1 (ja)
FR (1) FR2343061A1 (ja)
GB (1) GB1513709A (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011213717A (ja) * 2010-03-15 2011-10-27 Rohm & Haas Electronic Materials Llc めっき浴および方法
JP2013091850A (ja) * 2011-10-24 2013-05-16 Rohm & Haas Electronic Materials Llc めっき浴および方法
JP2019052374A (ja) * 2010-03-15 2019-04-04 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ めっき浴および方法

Families Citing this family (60)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4134803A (en) * 1977-12-21 1979-01-16 R. O. Hull & Company, Inc. Nitrogen and sulfur compositions and acid copper plating baths
US4316778A (en) * 1980-09-24 1982-02-23 Rca Corporation Method for the manufacture of recording substrates for capacitance electronic discs
DE3114131A1 (de) * 1981-04-08 1982-11-04 Teldec Telefunken-Decca-Schallplatten Gmbh, 2000 Hamburg Verfahren zur herstellung einer schneidtraegers
US4376685A (en) * 1981-06-24 1983-03-15 M&T Chemicals Inc. Acid copper electroplating baths containing brightening and leveling additives
FR2510145B1 (fr) * 1981-07-24 1986-02-07 Rhone Poulenc Spec Chim Additif pour bain de cuivrage electrolytique acide, son procede de preparation et son application au cuivrage des circuits imprimes
US4521282A (en) * 1984-07-11 1985-06-04 Omi International Corporation Cyanide-free copper electrolyte and process
GB8612361D0 (en) * 1986-05-21 1986-06-25 Engelhard Corp Gold electroplating bath
US4730022A (en) * 1987-03-06 1988-03-08 Mcgean-Rohco, Inc. Polymer compositions and alkaline zinc electroplating baths
US4786746A (en) * 1987-09-18 1988-11-22 Pennsylvania Research Corporation Copper electroplating solutions and methods of making and using them
US4948474A (en) * 1987-09-18 1990-08-14 Pennsylvania Research Corporation Copper electroplating solutions and methods
US5385661A (en) * 1993-09-17 1995-01-31 International Business Machines Corporation Acid electrolyte solution and process for the electrodeposition of copper-rich alloys exploiting the phenomenon of underpotential deposition
US5607570A (en) * 1994-10-31 1997-03-04 Rohbani; Elias Electroplating solution
DE19758121C2 (de) * 1997-12-17 2000-04-06 Atotech Deutschland Gmbh Wäßriges Bad und Verfahren zum elektrolytischen Abscheiden von Kupferschichten
KR100659544B1 (ko) * 1999-11-12 2006-12-19 에바라 유지라이토 코포레이션 리미티드 비아 필링 방법
KR100852636B1 (ko) * 2000-10-13 2008-08-18 롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨 시드 보충 및 전기도금조
EP1203950B1 (en) * 2000-11-02 2005-09-07 Shipley Company LLC Plating bath analysis
US6610192B1 (en) * 2000-11-02 2003-08-26 Shipley Company, L.L.C. Copper electroplating
US6776893B1 (en) 2000-11-20 2004-08-17 Enthone Inc. Electroplating chemistry for the CU filling of submicron features of VLSI/ULSI interconnect
US8002962B2 (en) * 2002-03-05 2011-08-23 Enthone Inc. Copper electrodeposition in microelectronics
TW200401848A (en) * 2002-06-03 2004-02-01 Shipley Co Llc Leveler compounds
US6709568B2 (en) * 2002-06-13 2004-03-23 Advanced Technology Materials, Inc. Method for determining concentrations of additives in acid copper electrochemical deposition baths
EP1475463B2 (en) * 2002-12-20 2017-03-01 Shipley Company, L.L.C. Reverse pulse plating method
JP2004323971A (ja) * 2003-04-25 2004-11-18 Rohm & Haas Electronic Materials Llc 改良された浴分析
JP2004325441A (ja) * 2003-04-25 2004-11-18 Rohm & Haas Electronic Materials Llc 分析方法
US7128822B2 (en) * 2003-06-04 2006-10-31 Shipley Company, L.L.C. Leveler compounds
US20050067304A1 (en) * 2003-09-26 2005-03-31 King Mackenzie E. Electrode assembly for analysis of metal electroplating solution, comprising self-cleaning mechanism, plating optimization mechanism, and/or voltage limiting mechanism
US20050109624A1 (en) * 2003-11-25 2005-05-26 Mackenzie King On-wafer electrochemical deposition plating metrology process and apparatus
US20050224370A1 (en) * 2004-04-07 2005-10-13 Jun Liu Electrochemical deposition analysis system including high-stability electrode
US20050230262A1 (en) * 2004-04-20 2005-10-20 Semitool, Inc. Electrochemical methods for the formation of protective features on metallized features
US6984299B2 (en) * 2004-04-27 2006-01-10 Advanced Technology Material, Inc. Methods for determining organic component concentrations in an electrolytic solution
US7435320B2 (en) 2004-04-30 2008-10-14 Advanced Technology Materials, Inc. Methods and apparatuses for monitoring organic additives in electrochemical deposition solutions
US7427346B2 (en) * 2004-05-04 2008-09-23 Advanced Technology Materials, Inc. Electrochemical drive circuitry and method
TW200613586A (en) 2004-07-22 2006-05-01 Rohm & Haas Elect Mat Leveler compounds
CN1946879B (zh) * 2005-01-25 2010-05-05 日矿金属株式会社 作为添加剂含有具有特定骨架化合物的铜电解液以及由该铜电解液制造的电解铜箔
DE102005011708B3 (de) 2005-03-11 2007-03-01 Atotech Deutschland Gmbh Polyvinylammoniumverbindung und Verfahren zu deren Herstellung sowie diese Verbindung enthaltende saure Lösung und Verfahren zum elektrolytischen Abscheiden eines Kupferniederschlages
US20080096044A1 (en) * 2005-06-03 2008-04-24 Jun Matsumoto Plating Method, Electrically Conductive Film And Light-Transmitting Electromagnetic Wave Shielding Film
US7662981B2 (en) * 2005-07-16 2010-02-16 Rohm And Haas Electronic Materials Llc Leveler compounds
TWI328622B (en) * 2005-09-30 2010-08-11 Rohm & Haas Elect Mat Leveler compounds
JP5497261B2 (ja) * 2006-12-15 2014-05-21 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． インジウム組成物
EP2123799B1 (en) * 2008-04-22 2015-04-22 Rohm and Haas Electronic Materials LLC Method of replenishing indium ions in indium electroplating compositions
WO2009151124A1 (ja) * 2008-06-12 2009-12-17 古河電気工業株式会社 電解銅皮膜、その製造方法及び銅電解皮膜製造用の銅電解液
US8388824B2 (en) * 2008-11-26 2013-03-05 Enthone Inc. Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers
TWI572750B (zh) 2010-05-24 2017-03-01 安頌股份有限公司 直通矽穿孔之銅充填
JP5731802B2 (ja) 2010-11-25 2015-06-10 ローム・アンド・ハース電子材料株式会社 金めっき液
JP2012127003A (ja) 2010-12-15 2012-07-05 Rohm & Haas Electronic Materials Llc 銅層を均一にする電気めっき方法
GB201100447D0 (en) * 2011-01-12 2011-02-23 Johnson Matthey Plc Improvements in coating technology
CN103060860B (zh) * 2013-01-22 2016-01-20 中南大学 一种印制线路板酸性镀铜电镀液及其制备和应用方法
CN103074657B (zh) * 2013-02-26 2015-07-29 灵宝华鑫铜箔有限责任公司 一种电解铜箔用添加剂及7μm双光锂离子电池用电解铜箔生产工艺
US9809891B2 (en) 2014-06-30 2017-11-07 Rohm And Haas Electronic Materials Llc Plating method
US9611560B2 (en) 2014-12-30 2017-04-04 Rohm And Haas Electronic Materials Llc Sulfonamide based polymers for copper electroplating
US9783905B2 (en) 2014-12-30 2017-10-10 Rohm and Haas Electronic Mateirals LLC Reaction products of amino acids and epoxies
US9725816B2 (en) 2014-12-30 2017-08-08 Rohm And Haas Electronic Materials Llc Amino sulfonic acid based polymers for copper electroplating
CN104764777A (zh) * 2015-03-31 2015-07-08 深圳崇达多层线路板有限公司 一种电镀填孔工艺用的电镀液的检测方法
CN105018979A (zh) * 2015-08-24 2015-11-04 苏州昕皓新材料科技有限公司 一种山梨醇酐棕榈酸酯的应用
US10988852B2 (en) 2015-10-27 2021-04-27 Rohm And Haas Electronic Materials Llc Method of electroplating copper into a via on a substrate from an acid copper electroplating bath
US10519557B2 (en) 2016-02-12 2019-12-31 Macdermid Enthone Inc. Leveler compositions for use in copper deposition in manufacture of microelectronics
CN106119913B (zh) * 2016-06-30 2018-07-03 深圳市励高表面处理材料有限公司 铜电镀液及其使用方法和其中的整平剂的合成方法
US11512406B2 (en) 2019-10-17 2022-11-29 Rohm And Haas Electronic Materials Llc Method of enhancing copper electroplating
CN112030199B (zh) * 2020-08-27 2021-11-12 江苏艾森半导体材料股份有限公司 一种用于先进封装的高速电镀铜添加剂及电镀液
CN112593262A (zh) * 2020-12-07 2021-04-02 博敏电子股份有限公司 一种含有吡咯烷二硫代甲酸铵盐的电镀液添加剂及其应用

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE82858C (ja) *
US3655534A (en) * 1970-02-24 1972-04-11 Enthone Alkaline bright zinc electroplating
US3725220A (en) * 1972-04-27 1973-04-03 Lea Ronal Inc Electrodeposition of copper from acidic baths
US3972789A (en) * 1975-02-10 1976-08-03 The Richardson Company Alkaline bright zinc plating and additive composition therefore

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011213717A (ja) * 2010-03-15 2011-10-27 Rohm & Haas Electronic Materials Llc めっき浴および方法
JP2019052374A (ja) * 2010-03-15 2019-04-04 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ めっき浴および方法
JP2013091850A (ja) * 2011-10-24 2013-05-16 Rohm & Haas Electronic Materials Llc めっき浴および方法

Also Published As

Publication number Publication date
FR2343061A1 (fr) 1977-09-30
US4038161A (en) 1977-07-26
AU2225477A (en) 1978-08-24
DE2706521A1 (de) 1977-09-08
GB1513709A (en) 1978-06-07
CA1078323A (en) 1980-05-27

Similar Documents

Publication Publication Date Title
JPS52108340A (en) Copper oxide electroplating bath* additive composition therefor and method for forming levelled copper coat
AU496780B2 (en) Additives in baths forthe electrodeposition of copper
AU3283278A (en) Coating bath composition and method
JPS5394227A (en) Additive component for zinc plating bath* and method of electrodepositing zinc film zinc plating bath
JPS5281032A (en) Tinngold electroplating bath and plating method
JPS5365327A (en) Coating composition for electrodeposition and process using same
JPS5363227A (en) Electroplating method of golddcobalt alloy
AU1243576A (en) Electroplating metal surfaces
JPS55104493A (en) Brightener composition for acidic zinc electroplating bath and method
JPS51138540A (en) Method of electrodepositing zinc and bath composition therefor
GB2030596B (en) Combined method of electroplating and deplating electroplated ferrous based wire
JPS51121042A (en) Electrodeposition bath composition and electrodepositing method
JPS5362740A (en) Electrolytic plating method
JPS52153834A (en) Plating method and plating composition
JPS5235722A (en) One side molten metal plating method
JPS5273134A (en) Zinc electrocasting bath and additive composition used therefor
JPS5370931A (en) Nonnelectrolytic copper plating method
JPS5319935A (en) Method of supplying metallic ions in electroplating bath
JPS52156138A (en) Plating method and plating composition
JPS5345634A (en) Additive for improving electroplating method
JPS5322126A (en) Molten metal plating method
GB1543867A (en) Brightening method and composition for zinc plating baths
JPS5352252A (en) Method of chemically treating surface of copper based alloy
JPS51128647A (en) Method of zinc plating bath
AU513101B2 (en) Electroplating bath composition