FR2343061A1 - Perfectionnement aux bains acides de revetement de cuivre - Google Patents

Perfectionnement aux bains acides de revetement de cuivre

Info

Publication number
FR2343061A1
FR2343061A1 FR7706275A FR7706275A FR2343061A1 FR 2343061 A1 FR2343061 A1 FR 2343061A1 FR 7706275 A FR7706275 A FR 7706275A FR 7706275 A FR7706275 A FR 7706275A FR 2343061 A1 FR2343061 A1 FR 2343061A1
Authority
FR
France
Prior art keywords
perfection
acid copper
copper coating
coating baths
baths
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR7706275A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hull & Co R O
Original Assignee
Hull & Co R O
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hull & Co R O filed Critical Hull & Co R O
Publication of FR2343061A1 publication Critical patent/FR2343061A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Pyridine Compounds (AREA)
FR7706275A 1976-03-05 1977-03-03 Perfectionnement aux bains acides de revetement de cuivre Withdrawn FR2343061A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/664,278 US4038161A (en) 1976-03-05 1976-03-05 Acid copper plating and additive composition therefor

Publications (1)

Publication Number Publication Date
FR2343061A1 true FR2343061A1 (fr) 1977-09-30

Family

ID=24665359

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7706275A Withdrawn FR2343061A1 (fr) 1976-03-05 1977-03-03 Perfectionnement aux bains acides de revetement de cuivre

Country Status (7)

Country Link
US (1) US4038161A (fr)
JP (1) JPS52108340A (fr)
AU (1) AU2225477A (fr)
CA (1) CA1078323A (fr)
DE (1) DE2706521A1 (fr)
FR (1) FR2343061A1 (fr)
GB (1) GB1513709A (fr)

Families Citing this family (63)

* Cited by examiner, † Cited by third party
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US4134803A (en) * 1977-12-21 1979-01-16 R. O. Hull & Company, Inc. Nitrogen and sulfur compositions and acid copper plating baths
US4316778A (en) * 1980-09-24 1982-02-23 Rca Corporation Method for the manufacture of recording substrates for capacitance electronic discs
DE3114131A1 (de) * 1981-04-08 1982-11-04 Teldec Telefunken-Decca-Schallplatten Gmbh, 2000 Hamburg Verfahren zur herstellung einer schneidtraegers
US4376685A (en) * 1981-06-24 1983-03-15 M&T Chemicals Inc. Acid copper electroplating baths containing brightening and leveling additives
FR2510145B1 (fr) * 1981-07-24 1986-02-07 Rhone Poulenc Spec Chim Additif pour bain de cuivrage electrolytique acide, son procede de preparation et son application au cuivrage des circuits imprimes
US4521282A (en) * 1984-07-11 1985-06-04 Omi International Corporation Cyanide-free copper electrolyte and process
GB8612361D0 (en) * 1986-05-21 1986-06-25 Engelhard Corp Gold electroplating bath
US4730022A (en) * 1987-03-06 1988-03-08 Mcgean-Rohco, Inc. Polymer compositions and alkaline zinc electroplating baths
US4786746A (en) * 1987-09-18 1988-11-22 Pennsylvania Research Corporation Copper electroplating solutions and methods of making and using them
US4948474A (en) * 1987-09-18 1990-08-14 Pennsylvania Research Corporation Copper electroplating solutions and methods
US5385661A (en) * 1993-09-17 1995-01-31 International Business Machines Corporation Acid electrolyte solution and process for the electrodeposition of copper-rich alloys exploiting the phenomenon of underpotential deposition
US5607570A (en) * 1994-10-31 1997-03-04 Rohbani; Elias Electroplating solution
DE19758121C2 (de) * 1997-12-17 2000-04-06 Atotech Deutschland Gmbh Wäßriges Bad und Verfahren zum elektrolytischen Abscheiden von Kupferschichten
KR100659544B1 (ko) * 1999-11-12 2006-12-19 에바라 유지라이토 코포레이션 리미티드 비아 필링 방법
EP1197587B1 (fr) * 2000-10-13 2006-09-20 Shipley Co. L.L.C. Réparation des couches de germination et bain électrolytique
US6610192B1 (en) * 2000-11-02 2003-08-26 Shipley Company, L.L.C. Copper electroplating
EP1203950B1 (fr) * 2000-11-02 2005-09-07 Shipley Company LLC Analyse de bains de placage
US6776893B1 (en) 2000-11-20 2004-08-17 Enthone Inc. Electroplating chemistry for the CU filling of submicron features of VLSI/ULSI interconnect
US8002962B2 (en) 2002-03-05 2011-08-23 Enthone Inc. Copper electrodeposition in microelectronics
EP1371757A1 (fr) * 2002-06-03 2003-12-17 Shipley Co. L.L.C. Agent redresseur pour bains de placage de cuivre
US6709568B2 (en) * 2002-06-13 2004-03-23 Advanced Technology Materials, Inc. Method for determining concentrations of additives in acid copper electrochemical deposition baths
DE60336539D1 (de) * 2002-12-20 2011-05-12 Shipley Co Llc Methode zum Elektroplattieren mit Umkehrpulsstrom
JP2004325441A (ja) * 2003-04-25 2004-11-18 Rohm & Haas Electronic Materials Llc 分析方法
JP2004323971A (ja) * 2003-04-25 2004-11-18 Rohm & Haas Electronic Materials Llc 改良された浴分析
US7128822B2 (en) * 2003-06-04 2006-10-31 Shipley Company, L.L.C. Leveler compounds
US20050067304A1 (en) * 2003-09-26 2005-03-31 King Mackenzie E. Electrode assembly for analysis of metal electroplating solution, comprising self-cleaning mechanism, plating optimization mechanism, and/or voltage limiting mechanism
US20050109624A1 (en) * 2003-11-25 2005-05-26 Mackenzie King On-wafer electrochemical deposition plating metrology process and apparatus
US20050224370A1 (en) * 2004-04-07 2005-10-13 Jun Liu Electrochemical deposition analysis system including high-stability electrode
US20050230262A1 (en) * 2004-04-20 2005-10-20 Semitool, Inc. Electrochemical methods for the formation of protective features on metallized features
US6984299B2 (en) * 2004-04-27 2006-01-10 Advanced Technology Material, Inc. Methods for determining organic component concentrations in an electrolytic solution
US7435320B2 (en) 2004-04-30 2008-10-14 Advanced Technology Materials, Inc. Methods and apparatuses for monitoring organic additives in electrochemical deposition solutions
US7427346B2 (en) * 2004-05-04 2008-09-23 Advanced Technology Materials, Inc. Electrochemical drive circuitry and method
TW200613586A (en) * 2004-07-22 2006-05-01 Rohm & Haas Elect Mat Leveler compounds
CN1946879B (zh) * 2005-01-25 2010-05-05 日矿金属株式会社 作为添加剂含有具有特定骨架化合物的铜电解液以及由该铜电解液制造的电解铜箔
DE102005011708B3 (de) 2005-03-11 2007-03-01 Atotech Deutschland Gmbh Polyvinylammoniumverbindung und Verfahren zu deren Herstellung sowie diese Verbindung enthaltende saure Lösung und Verfahren zum elektrolytischen Abscheiden eines Kupferniederschlages
WO2006129886A1 (fr) * 2005-06-03 2006-12-07 Fujifilm Corporation Procede de placage, film conducteur et film de protection contre les ondes electromagnetiques transmettant de la lumiere
US7662981B2 (en) * 2005-07-16 2010-02-16 Rohm And Haas Electronic Materials Llc Leveler compounds
TWI328622B (en) * 2005-09-30 2010-08-11 Rohm & Haas Elect Mat Leveler compounds
JP5497261B2 (ja) * 2006-12-15 2014-05-21 ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． インジウム組成物
EP2848714B1 (fr) * 2008-04-22 2016-11-23 Rohm and Haas Electronic Materials LLC Procédé de régénération d'ions indium dans des compositions de dépôt électrique d'indium
EP2302103A4 (fr) * 2008-06-12 2014-05-28 Furukawa Electric Co Ltd Revêtement électrolytique de cuivre et son procédé de fabrication, et électrolyte de cuivre pour la fabrication de revêtements électrolytiques de cuivre
US10221496B2 (en) 2008-11-26 2019-03-05 Macdermid Enthone Inc. Copper filling of through silicon vias
US8388824B2 (en) * 2008-11-26 2013-03-05 Enthone Inc. Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers
US8268157B2 (en) * 2010-03-15 2012-09-18 Rohm And Haas Electronic Materials Llc Plating bath and method
US8262895B2 (en) * 2010-03-15 2012-09-11 Rohm And Haas Electronic Materials Llc Plating bath and method
JP5731802B2 (ja) 2010-11-25 2015-06-10 ローム・アンド・ハース電子材料株式会社 金めっき液
JP2012127003A (ja) 2010-12-15 2012-07-05 Rohm & Haas Electronic Materials Llc 銅層を均一にする電気めっき方法
GB201100447D0 (en) * 2011-01-12 2011-02-23 Johnson Matthey Plc Improvements in coating technology
US8454815B2 (en) 2011-10-24 2013-06-04 Rohm And Haas Electronics Materials Llc Plating bath and method
CN103060860B (zh) * 2013-01-22 2016-01-20 中南大学 一种印制线路板酸性镀铜电镀液及其制备和应用方法
CN103074657B (zh) * 2013-02-26 2015-07-29 灵宝华鑫铜箔有限责任公司 一种电解铜箔用添加剂及7μm双光锂离子电池用电解铜箔生产工艺
US9809891B2 (en) 2014-06-30 2017-11-07 Rohm And Haas Electronic Materials Llc Plating method
US9783905B2 (en) 2014-12-30 2017-10-10 Rohm and Haas Electronic Mateirals LLC Reaction products of amino acids and epoxies
US9725816B2 (en) 2014-12-30 2017-08-08 Rohm And Haas Electronic Materials Llc Amino sulfonic acid based polymers for copper electroplating
US9611560B2 (en) 2014-12-30 2017-04-04 Rohm And Haas Electronic Materials Llc Sulfonamide based polymers for copper electroplating
CN104764777A (zh) * 2015-03-31 2015-07-08 深圳崇达多层线路板有限公司 一种电镀填孔工艺用的电镀液的检测方法
CN105018979A (zh) * 2015-08-24 2015-11-04 苏州昕皓新材料科技有限公司 一种山梨醇酐棕榈酸酯的应用
US10988852B2 (en) 2015-10-27 2021-04-27 Rohm And Haas Electronic Materials Llc Method of electroplating copper into a via on a substrate from an acid copper electroplating bath
US10519557B2 (en) 2016-02-12 2019-12-31 Macdermid Enthone Inc. Leveler compositions for use in copper deposition in manufacture of microelectronics
CN106119913B (zh) * 2016-06-30 2018-07-03 深圳市励高表面处理材料有限公司 铜电镀液及其使用方法和其中的整平剂的合成方法
US11512406B2 (en) 2019-10-17 2022-11-29 Rohm And Haas Electronic Materials Llc Method of enhancing copper electroplating
CN112030199B (zh) * 2020-08-27 2021-11-12 江苏艾森半导体材料股份有限公司 一种用于先进封装的高速电镀铜添加剂及电镀液
CN112593262A (zh) * 2020-12-07 2021-04-02 博敏电子股份有限公司 一种含有吡咯烷二硫代甲酸铵盐的电镀液添加剂及其应用

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE82858C (fr) *
US3655534A (en) * 1970-02-24 1972-04-11 Enthone Alkaline bright zinc electroplating
US3725220A (en) * 1972-04-27 1973-04-03 Lea Ronal Inc Electrodeposition of copper from acidic baths
US3972789A (en) * 1975-02-10 1976-08-03 The Richardson Company Alkaline bright zinc plating and additive composition therefore

Also Published As

Publication number Publication date
AU2225477A (en) 1978-08-24
CA1078323A (fr) 1980-05-27
DE2706521A1 (de) 1977-09-08
JPS52108340A (en) 1977-09-10
US4038161A (en) 1977-07-26
GB1513709A (en) 1978-06-07

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Legal Events

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