JPS52103954A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS52103954A
JPS52103954A JP2075776A JP2075776A JPS52103954A JP S52103954 A JPS52103954 A JP S52103954A JP 2075776 A JP2075776 A JP 2075776A JP 2075776 A JP2075776 A JP 2075776A JP S52103954 A JPS52103954 A JP S52103954A
Authority
JP
Japan
Prior art keywords
semiconductor device
terminal
ump
separation
caused
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2075776A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5441464B2 (enExample
Inventor
Masaru Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP2075776A priority Critical patent/JPS52103954A/ja
Publication of JPS52103954A publication Critical patent/JPS52103954A/ja
Publication of JPS5441464B2 publication Critical patent/JPS5441464B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2075776A 1976-02-26 1976-02-26 Semiconductor device Granted JPS52103954A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2075776A JPS52103954A (en) 1976-02-26 1976-02-26 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2075776A JPS52103954A (en) 1976-02-26 1976-02-26 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS52103954A true JPS52103954A (en) 1977-08-31
JPS5441464B2 JPS5441464B2 (enExample) 1979-12-08

Family

ID=12036052

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2075776A Granted JPS52103954A (en) 1976-02-26 1976-02-26 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS52103954A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009107034A (ja) * 2007-10-26 2009-05-21 Brother Ind Ltd 印刷装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS48113360U (enExample) * 1972-03-31 1973-12-25
JPS4945192A (enExample) * 1972-09-06 1974-04-30
JPS5026765U (enExample) * 1973-07-02 1975-03-27

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS48113360U (enExample) * 1972-03-31 1973-12-25
JPS4945192A (enExample) * 1972-09-06 1974-04-30
JPS5026765U (enExample) * 1973-07-02 1975-03-27

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009107034A (ja) * 2007-10-26 2009-05-21 Brother Ind Ltd 印刷装置
US8562229B2 (en) 2007-10-26 2013-10-22 Brother Kogyo Kabushiki Kaisha Printing apparatus with cutter having a blade including a step portion

Also Published As

Publication number Publication date
JPS5441464B2 (enExample) 1979-12-08

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