JPS51138179A - Semi-conductor device - Google Patents

Semi-conductor device

Info

Publication number
JPS51138179A
JPS51138179A JP50062193A JP6219375A JPS51138179A JP S51138179 A JPS51138179 A JP S51138179A JP 50062193 A JP50062193 A JP 50062193A JP 6219375 A JP6219375 A JP 6219375A JP S51138179 A JPS51138179 A JP S51138179A
Authority
JP
Japan
Prior art keywords
semi
conductor device
circuit
chip
constitute
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP50062193A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5619101B2 (cs
Inventor
Susumu Kotake
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Instruments Inc
Original Assignee
Seiko Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Instruments Inc filed Critical Seiko Instruments Inc
Priority to JP50062193A priority Critical patent/JPS51138179A/ja
Priority to GB21179/76A priority patent/GB1552144A/en
Publication of JPS51138179A publication Critical patent/JPS51138179A/ja
Publication of JPS5619101B2 publication Critical patent/JPS5619101B2/ja
Priority to HK494/82A priority patent/HK49482A/xx
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
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    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495Lead-frames or other flat leads
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    • H01L23/495Lead-frames or other flat leads
    • H01L23/49517Additional leads
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    • H01L23/495Lead-frames or other flat leads
    • H01L23/49541Geometry of the lead-frame
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    • H01L23/00Details of semiconductor or other solid state devices
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    • H01L23/522Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/525Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
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    • H01L23/525Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
    • H01L23/5256Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising fuses, i.e. connections having their state changed from conductive to non-conductive
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    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
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    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Electric Clocks (AREA)
  • Semiconductor Integrated Circuits (AREA)
JP50062193A 1975-05-23 1975-05-23 Semi-conductor device Granted JPS51138179A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP50062193A JPS51138179A (en) 1975-05-23 1975-05-23 Semi-conductor device
GB21179/76A GB1552144A (en) 1975-05-23 1976-05-21 Semi-conductor device
HK494/82A HK49482A (en) 1975-05-23 1982-11-25 Semi-conductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50062193A JPS51138179A (en) 1975-05-23 1975-05-23 Semi-conductor device

Publications (2)

Publication Number Publication Date
JPS51138179A true JPS51138179A (en) 1976-11-29
JPS5619101B2 JPS5619101B2 (cs) 1981-05-06

Family

ID=13193055

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50062193A Granted JPS51138179A (en) 1975-05-23 1975-05-23 Semi-conductor device

Country Status (3)

Country Link
JP (1) JPS51138179A (cs)
GB (1) GB1552144A (cs)
HK (1) HK49482A (cs)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59171152A (ja) * 1983-03-17 1984-09-27 Nec Corp 半導体装置

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2046024B (en) * 1979-03-30 1983-01-26 Ferranti Ltd Circuit assembly
US4484213A (en) * 1982-02-19 1984-11-20 Solitron Devices, Inc. Binary weighted resistor and package
FR2524707B1 (fr) * 1982-04-01 1985-05-31 Cit Alcatel Procede d'encapsulation de composants semi-conducteurs, et composants encapsules obtenus
FR2818404B1 (fr) * 2000-12-19 2003-03-21 Valeo Climatisation Procede de programmation de l'adresse d'un peripherique et peripherique pour sa mise en oeuvre

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59171152A (ja) * 1983-03-17 1984-09-27 Nec Corp 半導体装置

Also Published As

Publication number Publication date
GB1552144A (en) 1979-09-12
JPS5619101B2 (cs) 1981-05-06
HK49482A (en) 1982-12-03

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