GB2046024B - Circuit assembly - Google Patents
Circuit assemblyInfo
- Publication number
- GB2046024B GB2046024B GB7911308A GB7911308A GB2046024B GB 2046024 B GB2046024 B GB 2046024B GB 7911308 A GB7911308 A GB 7911308A GB 7911308 A GB7911308 A GB 7911308A GB 2046024 B GB2046024 B GB 2046024B
- Authority
- GB
- United Kingdom
- Prior art keywords
- circuit assembly
- assembly
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
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- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
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- H01L23/00—Details of semiconductor or other solid state devices
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- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
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- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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- H05K1/00—Printed circuits
- H05K1/02—Details
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
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Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Insulated Conductors (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Details Of Resistors (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB7911308A GB2046024B (en) | 1979-03-30 | 1979-03-30 | Circuit assembly |
DE3010770A DE3010770A1 (en) | 1979-03-30 | 1980-03-20 | CIRCUIT ARRANGEMENT WITH THIN FILM COMPONENTS |
FR8006659A FR2452787B1 (en) | 1979-03-30 | 1980-03-26 | THIN FILM CIRCUIT |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB7911308A GB2046024B (en) | 1979-03-30 | 1979-03-30 | Circuit assembly |
Publications (2)
Publication Number | Publication Date |
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GB2046024A GB2046024A (en) | 1980-11-05 |
GB2046024B true GB2046024B (en) | 1983-01-26 |
Family
ID=10504247
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB7911308A Expired GB2046024B (en) | 1979-03-30 | 1979-03-30 | Circuit assembly |
Country Status (3)
Country | Link |
---|---|
DE (1) | DE3010770A1 (en) |
FR (1) | FR2452787B1 (en) |
GB (1) | GB2046024B (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5875863A (en) * | 1981-10-13 | 1983-05-07 | フエアチヤイルド・カメラ・アンド・インストルメント・コ−ポレ−シヨン | Hybrid circuit module and method of producing same |
FR2524707B1 (en) * | 1982-04-01 | 1985-05-31 | Cit Alcatel | METHOD OF ENCAPSULATION OF SEMICONDUCTOR COMPONENTS, AND ENCAPSULATED COMPONENTS OBTAINED |
JPS59208800A (en) * | 1983-05-12 | 1984-11-27 | 株式会社日立製作所 | Electronic device for vehicle |
DE3407784A1 (en) * | 1984-03-02 | 1985-09-12 | Brown, Boveri & Cie Ag, 6800 Mannheim | THICK-LAYER HYBRID CIRCUIT |
FR2605463A1 (en) * | 1986-10-17 | 1988-04-22 | Renault Vehicules Ind | Electrical connection device |
GB2220107B (en) * | 1988-04-30 | 1992-06-24 | Pressac Ltd | Circuit board assembly |
US4979787A (en) * | 1990-01-12 | 1990-12-25 | Pco, Inc. | Optical-electronic interface module |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3404213A (en) * | 1962-07-26 | 1968-10-01 | Owens Illinois Inc | Hermetic packages for electronic components |
US3178506A (en) * | 1962-08-09 | 1965-04-13 | Westinghouse Electric Corp | Sealed functional molecular electronic device |
IE33422B1 (en) * | 1968-12-09 | 1974-06-26 | Gen Electric | Semiconductor device with shock absorbing and passivation means |
US3714709A (en) * | 1970-07-06 | 1973-02-06 | Rca Corp | Method of manufacturing thick-film hybrid integrated circuits |
DE2419157C3 (en) * | 1974-04-20 | 1979-06-28 | W.C. Heraeus Gmbh, 6450 Hanau | Metallic carrier for semiconductor components and process for its manufacture |
JPS51138179A (en) * | 1975-05-23 | 1976-11-29 | Seiko Instr & Electronics Ltd | Semi-conductor device |
-
1979
- 1979-03-30 GB GB7911308A patent/GB2046024B/en not_active Expired
-
1980
- 1980-03-20 DE DE3010770A patent/DE3010770A1/en not_active Withdrawn
- 1980-03-26 FR FR8006659A patent/FR2452787B1/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
DE3010770A1 (en) | 1980-10-09 |
FR2452787A1 (en) | 1980-10-24 |
GB2046024A (en) | 1980-11-05 |
FR2452787B1 (en) | 1985-12-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |