GB2046024B - Circuit assembly - Google Patents

Circuit assembly

Info

Publication number
GB2046024B
GB2046024B GB7911308A GB7911308A GB2046024B GB 2046024 B GB2046024 B GB 2046024B GB 7911308 A GB7911308 A GB 7911308A GB 7911308 A GB7911308 A GB 7911308A GB 2046024 B GB2046024 B GB 2046024B
Authority
GB
United Kingdom
Prior art keywords
circuit assembly
assembly
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB7911308A
Other versions
GB2046024A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ferranti International PLC
Original Assignee
Ferranti PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ferranti PLC filed Critical Ferranti PLC
Priority to GB7911308A priority Critical patent/GB2046024B/en
Priority to DE3010770A priority patent/DE3010770A1/en
Priority to FR8006659A priority patent/FR2452787B1/en
Publication of GB2046024A publication Critical patent/GB2046024A/en
Application granted granted Critical
Publication of GB2046024B publication Critical patent/GB2046024B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
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    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
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    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10393—Clamping a component by an element or a set of elements
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
GB7911308A 1979-03-30 1979-03-30 Circuit assembly Expired GB2046024B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
GB7911308A GB2046024B (en) 1979-03-30 1979-03-30 Circuit assembly
DE3010770A DE3010770A1 (en) 1979-03-30 1980-03-20 CIRCUIT ARRANGEMENT WITH THIN FILM COMPONENTS
FR8006659A FR2452787B1 (en) 1979-03-30 1980-03-26 THIN FILM CIRCUIT

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB7911308A GB2046024B (en) 1979-03-30 1979-03-30 Circuit assembly

Publications (2)

Publication Number Publication Date
GB2046024A GB2046024A (en) 1980-11-05
GB2046024B true GB2046024B (en) 1983-01-26

Family

ID=10504247

Family Applications (1)

Application Number Title Priority Date Filing Date
GB7911308A Expired GB2046024B (en) 1979-03-30 1979-03-30 Circuit assembly

Country Status (3)

Country Link
DE (1) DE3010770A1 (en)
FR (1) FR2452787B1 (en)
GB (1) GB2046024B (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5875863A (en) * 1981-10-13 1983-05-07 フエアチヤイルド・カメラ・アンド・インストルメント・コ−ポレ−シヨン Hybrid circuit module and method of producing same
FR2524707B1 (en) * 1982-04-01 1985-05-31 Cit Alcatel METHOD OF ENCAPSULATION OF SEMICONDUCTOR COMPONENTS, AND ENCAPSULATED COMPONENTS OBTAINED
JPS59208800A (en) * 1983-05-12 1984-11-27 株式会社日立製作所 Electronic device for vehicle
DE3407784A1 (en) * 1984-03-02 1985-09-12 Brown, Boveri & Cie Ag, 6800 Mannheim THICK-LAYER HYBRID CIRCUIT
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US3404213A (en) * 1962-07-26 1968-10-01 Owens Illinois Inc Hermetic packages for electronic components
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DE2419157C3 (en) * 1974-04-20 1979-06-28 W.C. Heraeus Gmbh, 6450 Hanau Metallic carrier for semiconductor components and process for its manufacture
JPS51138179A (en) * 1975-05-23 1976-11-29 Seiko Instr & Electronics Ltd Semi-conductor device

Also Published As

Publication number Publication date
FR2452787B1 (en) 1985-12-06
GB2046024A (en) 1980-11-05
FR2452787A1 (en) 1980-10-24
DE3010770A1 (en) 1980-10-09

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