GB1552144A - Semi-conductor device - Google Patents

Semi-conductor device

Info

Publication number
GB1552144A
GB1552144A GB21179/76A GB2117976A GB1552144A GB 1552144 A GB1552144 A GB 1552144A GB 21179/76 A GB21179/76 A GB 21179/76A GB 2117976 A GB2117976 A GB 2117976A GB 1552144 A GB1552144 A GB 1552144A
Authority
GB
United Kingdom
Prior art keywords
semi
conductor device
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB21179/76A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Instruments Inc
Original Assignee
Seiko Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Instruments Inc filed Critical Seiko Instruments Inc
Publication of GB1552144A publication Critical patent/GB1552144A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
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    • H01L23/495—Lead-frames or other flat leads
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    • H01L23/49541—Geometry of the lead-frame
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    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
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    • H01L2924/0001—Technical content checked by a classifier
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Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electric Clocks (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)
GB21179/76A 1975-05-23 1976-05-21 Semi-conductor device Expired GB1552144A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50062193A JPS51138179A (en) 1975-05-23 1975-05-23 Semi-conductor device

Publications (1)

Publication Number Publication Date
GB1552144A true GB1552144A (en) 1979-09-12

Family

ID=13193055

Family Applications (1)

Application Number Title Priority Date Filing Date
GB21179/76A Expired GB1552144A (en) 1975-05-23 1976-05-21 Semi-conductor device

Country Status (3)

Country Link
JP (1) JPS51138179A (en)
GB (1) GB1552144A (en)
HK (1) HK49482A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2452787A1 (en) * 1979-03-30 1980-10-24 Ferranti Ltd THIN FILM CIRCUIT
EP0087112A1 (en) * 1982-02-19 1983-08-31 Solitron Devices, Inc. Multi purpose chip
EP0091072A1 (en) * 1982-04-01 1983-10-12 Alcatel Process for encapsulating semi-conductor components and encapsulated components so obtained
FR2818404A1 (en) * 2000-12-19 2002-06-21 Valeo Climatisation METHOD FOR PROGRAMMING THE ADDRESS OF A DEVICE AND PERIPHERAL FOR ITS IMPLEMENTATION

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59171152A (en) * 1983-03-17 1984-09-27 Nec Corp Semiconductor device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2452787A1 (en) * 1979-03-30 1980-10-24 Ferranti Ltd THIN FILM CIRCUIT
EP0087112A1 (en) * 1982-02-19 1983-08-31 Solitron Devices, Inc. Multi purpose chip
EP0091072A1 (en) * 1982-04-01 1983-10-12 Alcatel Process for encapsulating semi-conductor components and encapsulated components so obtained
FR2818404A1 (en) * 2000-12-19 2002-06-21 Valeo Climatisation METHOD FOR PROGRAMMING THE ADDRESS OF A DEVICE AND PERIPHERAL FOR ITS IMPLEMENTATION
WO2002050906A1 (en) * 2000-12-19 2002-06-27 Valeo Climatisation Method for programming a peripheral address and peripheral therefor

Also Published As

Publication number Publication date
JPS5619101B2 (en) 1981-05-06
JPS51138179A (en) 1976-11-29
HK49482A (en) 1982-12-03

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19920521