JPS5075531A - - Google Patents
Info
- Publication number
- JPS5075531A JPS5075531A JP49120225A JP12022574A JPS5075531A JP S5075531 A JPS5075531 A JP S5075531A JP 49120225 A JP49120225 A JP 49120225A JP 12022574 A JP12022574 A JP 12022574A JP S5075531 A JPS5075531 A JP S5075531A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2355581A DE2355581C3 (de) | 1973-11-07 | 1973-11-07 | Galvanisches Glanzgoldbad mit hoher Abscheidungsgeschwindigkeit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5075531A true JPS5075531A (enrdf_load_stackoverflow) | 1975-06-20 |
| JPS5615472B2 JPS5615472B2 (enrdf_load_stackoverflow) | 1981-04-10 |
Family
ID=5897412
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12022574A Expired JPS5615472B2 (enrdf_load_stackoverflow) | 1973-11-07 | 1974-10-18 |
Country Status (12)
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61276990A (ja) * | 1985-05-30 | 1986-12-06 | Shinko Electric Ind Co Ltd | 電解金めつき液 |
| JPS61276992A (ja) * | 1985-05-30 | 1986-12-06 | Shinko Electric Ind Co Ltd | 電解金めつき液 |
| JPS637390A (ja) * | 1986-06-26 | 1988-01-13 | Nippon Engeruharudo Kk | 金−コバルト合金めつき液 |
| WO2011070933A1 (ja) * | 2009-12-09 | 2011-06-16 | エヌ・イー ケムキャット株式会社 | 電解硬質金めっき液及びこれを用いるめっき方法 |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB8334226D0 (en) * | 1983-12-22 | 1984-02-01 | Learonal Uk Ltd | Electrodeposition of gold alloys |
| GB8501245D0 (en) * | 1985-01-18 | 1985-02-20 | Engelhard Corp | Gold electroplating bath |
| US4670107A (en) * | 1986-03-05 | 1987-06-02 | Vanguard Research Associates, Inc. | Electrolyte solution and process for high speed gold plating |
| GB8612361D0 (en) * | 1986-05-21 | 1986-06-25 | Engelhard Corp | Gold electroplating bath |
| US4744871A (en) * | 1986-09-25 | 1988-05-17 | Vanguard Research Associates, Inc. | Electrolyte solution and process for gold electroplating |
| US4755264A (en) * | 1987-05-29 | 1988-07-05 | Vanguard Research Associates, Inc. | Electrolyte solution and process for gold electroplating |
| CH680370A5 (enrdf_load_stackoverflow) * | 1989-12-19 | 1992-08-14 | H E Finishing Sa | |
| GB2242200B (en) * | 1990-02-20 | 1993-11-17 | Omi International | Plating compositions and processes |
| GB9522591D0 (en) * | 1995-11-03 | 1996-01-03 | Enthone Omi Suisse S A | Electroplating processes compositions and deposits |
| CA2235408A1 (en) | 1995-11-03 | 1997-05-15 | Enthone-Omi, Inc. | Electroplating processes compositions and deposits |
| DE19629658C2 (de) * | 1996-07-23 | 1999-01-14 | Degussa | Cyanidfreies galvanisches Bad zur Abscheidung von Gold und Goldlegierungen |
| DE19745602C1 (de) * | 1997-10-08 | 1999-07-15 | Atotech Deutschland Gmbh | Verfahren und Lösung zur Herstellung von Goldschichten |
| US6814850B1 (en) | 1999-06-17 | 2004-11-09 | Umicore Galvanotechnik Gmbh | Acid bath for electrodeposition of glossy gold and gold alloy layers and a gloss additive for same |
| US20050205425A1 (en) * | 2002-06-25 | 2005-09-22 | Integran Technologies | Process for electroplating metallic and metall matrix composite foils, coatings and microcomponents |
| US6805786B2 (en) * | 2002-09-24 | 2004-10-19 | Northrop Grumman Corporation | Precious alloyed metal solder plating process |
| DE102011114931B4 (de) | 2011-10-06 | 2013-09-05 | Umicore Galvanotechnik Gmbh | Verfahren zur selektiveren, elektrolytischen Abscheidung von Gold oder einer Goldlegierung |
| DE102012004348B4 (de) | 2012-03-07 | 2014-01-09 | Umicore Galvanotechnik Gmbh | Verwendung von organischen Thioharnstoffverbindungen zur Erhöhung der galvanischen Abscheiderate von Gold und Goldlegierungen |
| CN103397356B (zh) * | 2013-07-15 | 2017-04-19 | 苏州苏凯路化学科技有限公司 | 一种无毒镀金用金盐及其合成方法 |
| CN107250440B (zh) | 2015-01-16 | 2019-07-30 | 哈钦森技术股份有限公司 | 金电镀溶液和方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE563647A (enrdf_load_stackoverflow) * | 1954-03-13 | |||
| DE1075398B (de) * | 1954-03-22 | 1960-02-11 | DEHYDAG Deutsche Hydrierwerke G.m.b.H., Düsseldorf | Bad zur galvanischen Herstellung von Metallüberzügen |
| BE570261A (enrdf_load_stackoverflow) * | 1957-08-13 | |||
| NL273924A (enrdf_load_stackoverflow) * | 1961-01-24 | |||
| US3149058A (en) * | 1959-12-31 | 1964-09-15 | Technic | Bright gold plating process |
| US2967135A (en) * | 1960-06-08 | 1961-01-03 | Barnet D Ostrow | Electroplating baths for hard bright gold deposits |
| USB373094I5 (enrdf_load_stackoverflow) * | 1964-08-26 |
-
1973
- 1973-11-07 DE DE2355581A patent/DE2355581C3/de not_active Expired
-
1974
- 1974-09-14 ES ES430054A patent/ES430054A1/es not_active Expired
- 1974-10-02 NL NLAANVRAGE7413010,A patent/NL186825C/xx not_active IP Right Cessation
- 1974-10-04 IT IT69975/74A patent/IT1020940B/it active
- 1974-10-18 JP JP12022574A patent/JPS5615472B2/ja not_active Expired
- 1974-10-21 GB GB4543774A patent/GB1426849A/en not_active Expired
- 1974-10-30 CH CH1453074A patent/CH603825A5/xx not_active IP Right Cessation
- 1974-11-04 US US520844A patent/US3929595A/en not_active Expired - Lifetime
- 1974-11-05 BR BR9243/74A patent/BR7409243A/pt unknown
- 1974-11-06 FR FR7436860A patent/FR2249979B1/fr not_active Expired
- 1974-11-06 BE BE6044809A patent/BE821923A/xx not_active IP Right Cessation
- 1974-11-06 SE SE7413961A patent/SE7413961L/xx unknown
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61276990A (ja) * | 1985-05-30 | 1986-12-06 | Shinko Electric Ind Co Ltd | 電解金めつき液 |
| JPS61276992A (ja) * | 1985-05-30 | 1986-12-06 | Shinko Electric Ind Co Ltd | 電解金めつき液 |
| JPS637390A (ja) * | 1986-06-26 | 1988-01-13 | Nippon Engeruharudo Kk | 金−コバルト合金めつき液 |
| WO2011070933A1 (ja) * | 2009-12-09 | 2011-06-16 | エヌ・イー ケムキャット株式会社 | 電解硬質金めっき液及びこれを用いるめっき方法 |
| JP2011122192A (ja) * | 2009-12-09 | 2011-06-23 | Ne Chemcat Corp | 電解硬質金めっき液及びこれを用いるめっき方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5615472B2 (enrdf_load_stackoverflow) | 1981-04-10 |
| BR7409243A (pt) | 1976-05-18 |
| GB1426849A (en) | 1976-03-03 |
| NL186825C (nl) | 1991-03-01 |
| DE2355581A1 (de) | 1975-05-28 |
| ES430054A1 (es) | 1976-10-16 |
| NL7413010A (nl) | 1975-05-12 |
| BE821923A (fr) | 1975-05-06 |
| FR2249979A1 (enrdf_load_stackoverflow) | 1975-05-30 |
| SE7413961L (enrdf_load_stackoverflow) | 1975-05-09 |
| US3929595A (en) | 1975-12-30 |
| FR2249979B1 (enrdf_load_stackoverflow) | 1976-10-22 |
| DE2355581C3 (de) | 1979-07-12 |
| DE2355581B2 (enrdf_load_stackoverflow) | 1978-11-16 |
| IT1020940B (it) | 1977-12-30 |
| CH603825A5 (enrdf_load_stackoverflow) | 1978-08-31 |