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JPS5851425B2
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1975-08-22 |
1983-11-16 |
株式会社日立製作所 |
ハンドウタイソウチ
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1975-11-07 |
1978-04-25 |
Rockwell International Corporation |
Batch process providing beam leads for microelectronic devices having metallized contact pads
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1975-12-10 |
1980-01-22 |
Tokyo Shibaura Electric Co., Ltd. |
Semiconductor device and a method for manufacturing the same
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JPS52137279A
(en)
*
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1976-05-12 |
1977-11-16 |
Hitachi Ltd |
Semiconductor device for optical coupling
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1976-08-11 |
1978-02-14 |
Philips Nv |
Werkwijze ter vervaardiging van een halfge- leiderinrichting en halfgeleiderinrichting vervaardigd door middel van een dergelijke werkwijze.
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JPS53123074A
(en)
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1977-04-01 |
1978-10-27 |
Nec Corp |
Semiconductor device
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1980-06-16 |
1983-04-05 |
Rockwell International Corporation |
Integrated circuit chip transmission line
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JPS57120295A
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*
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1981-01-17 |
1982-07-27 |
Mitsubishi Electric Corp |
Semiconductor memory device
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JPS60234346A
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1984-05-07 |
1985-11-21 |
Nec Corp |
半導体装置
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DE3610036A1
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1986-03-21 |
1987-09-24 |
Schering Ag |
Kontaktieren von mikroelektronischen schaltungen
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1986-10-27 |
1989-12-26 |
Hughes Aircraft Company |
Method for selectively forming small diameter holes in polyimide/Kevlar substrates
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1987-04-24 |
1989-06-06 |
Tactical Fabs, Inc. |
Solar cell and cell mount
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1988-12-16 |
1991-01-22 |
International Business Machines Corporation |
Method for providing improved insulation in VLSI and ULSI circuits
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JPH02192146A
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1989-01-20 |
1990-07-27 |
Toshiba Corp |
半導体装置
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JPH02220464A
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1989-02-22 |
1990-09-03 |
Toshiba Corp |
半導体装置及びその製造方法
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1989-04-14 |
1990-10-09 |
International Business Machines Corporation |
Process for fabricating multi-level integrated circuit wiring structure from a single metal deposit
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JP2856778B2
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1989-09-07 |
1999-02-10 |
株式会社東芝 |
半導体装置の配線構造
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1989-12-20 |
1991-04-16 |
National Semiconductor Corporation |
Stadium-stepped package for an integrated circuit with air dielectric
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1989-12-20 |
1992-11-03 |
National Semiconductor Corporation |
Method of connecting an IC component with another electrical component
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1990-01-11 |
1992-01-28 |
Matsushita Electric Industrial Co., Ltd. |
Fabrication method for thin film electroluminescent panels
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1990-05-14 |
1991-04-30 |
At&T Bell Laboratories |
Integrated electronic assembly comprising a transmission line
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JP3031966B2
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1990-07-02 |
2000-04-10 |
株式会社東芝 |
集積回路装置
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1990-09-07 |
1992-03-12 |
Telefunken Systemtechnik |
Duennfilm-mehrlagenschaltung und verfahren zur herstellung von duennfilm-mehrlagenschaltungen
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JPH04268750A
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1991-02-25 |
1992-09-24 |
Toshiba Corp |
半導体集積回路
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KR960001611B1
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1991-03-06 |
1996-02-02 |
가부시끼가이샤 한도다이 에네르기 겐뀨쇼 |
절연 게이트형 전계 효과 반도체 장치 및 그 제작방법
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JP2794678B2
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1991-08-26 |
1998-09-10 |
株式会社 半導体エネルギー研究所 |
絶縁ゲイト型半導体装置およびその作製方法
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1991-10-29 |
2003-03-27 |
Lockheed Corp |
Dichtgepackte Verbindungsstruktur, die eine Abstandshalterstruktur und einen Zwischenraum enthält
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1992-03-27 |
2003-09-23 |
Semiconductor Energy Laboratory Co., Ltd. |
Semiconductor device and method for forming the same
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JPH0722583A
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1992-12-15 |
1995-01-24 |
Internatl Business Mach Corp <Ibm> |
多層回路装置
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1993-01-28 |
1994-06-28 |
National Semiconductor Corporation |
Interconnector for a multi-chip module or package
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1993-11-24 |
1996-07-23 |
Mitsubishi Denki Kabushiki Kaisha |
Multi-layer wiring
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JP3359780B2
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1995-04-12 |
2002-12-24 |
三菱電機株式会社 |
配線装置
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1997-01-03 |
2003-06-10 |
Integrated Device Technology, Inc. |
Semiconductor integrated circuit with an insulation structure having reduced permittivity
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1997-07-10 |
2003-06-10 |
International Business Machines Corporation |
Chip interconnect wiring structure with low dielectric constant insulator and methods for fabricating the same
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JPH11154701A
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1997-11-21 |
1999-06-08 |
Mitsubishi Electric Corp |
半導体装置
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1998-02-05 |
2000-02-15 |
Integrated Device Technology, Inc. |
Method for fabricating air gap with borderless contact
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1998-04-22 |
2000-01-18 |
Cvc, Inc. |
Ultra high-speed chip semiconductor integrated circuit interconnect structure and fabrication method using free-space dielectrics
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1998-04-22 |
2000-09-26 |
Cvc, Inc. |
Ultra high-speed chip interconnect using free-space dielectrics
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1998-11-23 |
2000-08-08 |
National Semiconductor Corporation |
Low capacitance multilevel metal interconnect structure and method of manufacture
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1999-02-18 |
2001-06-12 |
Advanced Micro Devices, Inc. |
Low dielectric semiconductor device with rigid, conductively lined interconnection system
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1999-10-25 |
2001-06-26 |
Chartered Semiconductor Manufacturing Ltd. |
Method to form, and structure of, a dual damascene interconnect device
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2000-08-31 |
2005-01-01 |
Georgia Tech Res Inst |
Fabrication of semiconductor devices with air gaps for ultra low capacitance interconnections and methods of making same
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2003-03-13 |
2007-05-16 |
セイコーエプソン株式会社 |
カラーフィルタ基板の製造方法
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2003-10-24 |
2005-04-05 |
International Business Machines Corporation |
Method of forming gas dielectric with support structure
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2007-02-07 |
2012-05-08 |
Raytheon Company |
Environmental protection coating system and method
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2007-02-07 |
2010-08-03 |
Raytheon Company |
Passivation layer for a circuit device and method of manufacture
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固态图像捕获元件与电子设备
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