JPH1197592A - 熱消散装置 - Google Patents

熱消散装置

Info

Publication number
JPH1197592A
JPH1197592A JP10210486A JP21048698A JPH1197592A JP H1197592 A JPH1197592 A JP H1197592A JP 10210486 A JP10210486 A JP 10210486A JP 21048698 A JP21048698 A JP 21048698A JP H1197592 A JPH1197592 A JP H1197592A
Authority
JP
Japan
Prior art keywords
module
heat
power converter
converter module
emi
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10210486A
Other languages
English (en)
Japanese (ja)
Other versions
JPH1197592A5 (enExample
Inventor
Danieru Kuromuueru Suteiibun
スティーブン・ダニエル・クロムウエル
Beradeii Kurisuteian
クリスティアン・ベラディー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HP Inc
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of JPH1197592A publication Critical patent/JPH1197592A/ja
Publication of JPH1197592A5 publication Critical patent/JPH1197592A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
JP10210486A 1997-07-30 1998-07-27 熱消散装置 Pending JPH1197592A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US902,770 1997-07-30
US08/902,770 US5901040A (en) 1997-07-30 1997-07-30 Heat sink and Faraday Cage assembly for a semiconductor module and a power converter

Publications (2)

Publication Number Publication Date
JPH1197592A true JPH1197592A (ja) 1999-04-09
JPH1197592A5 JPH1197592A5 (enExample) 2005-10-27

Family

ID=25416374

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10210486A Pending JPH1197592A (ja) 1997-07-30 1998-07-27 熱消散装置

Country Status (2)

Country Link
US (1) US5901040A (enExample)
JP (1) JPH1197592A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012124445A (ja) * 2010-12-07 2012-06-28 Samsung Electro-Mechanics Co Ltd パワーパッケージモジュール
JP2023510495A (ja) * 2020-01-15 2023-03-14 シスコ テクノロジー，インコーポレイテッド 冷却を伴うポイントオブロードからの配電

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SE509451C2 (sv) * 1997-05-13 1999-01-25 Webra Ind Ab Förfarande för åstadkommande av en för värmeöverföringsändamål avsedd anordning
US7147045B2 (en) * 1998-06-08 2006-12-12 Thermotek, Inc. Toroidal low-profile extrusion cooling system and method thereof
US6935409B1 (en) * 1998-06-08 2005-08-30 Thermotek, Inc. Cooling apparatus having low profile extrusion
US6144557A (en) * 1999-04-09 2000-11-07 Lucent Technologies, Inc. Self-locking conductive pin for printed wiring substrate electronics case
US6981322B2 (en) 1999-06-08 2006-01-03 Thermotek, Inc. Cooling apparatus having low profile extrusion and method of manufacture therefor
US7305843B2 (en) 1999-06-08 2007-12-11 Thermotek, Inc. Heat pipe connection system and method
US6391442B1 (en) * 1999-07-08 2002-05-21 Saint-Gobain Performance Plastics Corporation Phase change thermal interface material
JP4388174B2 (ja) 1999-09-06 2009-12-24 株式会社ソニー・コンピュータエンタテインメント 電子機器
US6243265B1 (en) * 1999-10-06 2001-06-05 Intel Corporation Processor EMI shielding
US6285550B1 (en) * 2000-01-04 2001-09-04 Hewlett Packard Company Sub-cooled processor and companion voltage regulator
US6515861B1 (en) 2001-04-02 2003-02-04 Advanced Micro Devices, Inc. Method and apparatus for shielding electromagnetic emissions from an integrated circuit
KR20030010829A (ko) * 2001-07-27 2003-02-06 주식회사 태림테크 냉각장치
US7134486B2 (en) * 2001-09-28 2006-11-14 The Board Of Trustees Of The Leeland Stanford Junior University Control of electrolysis gases in electroosmotic pump systems
US6942018B2 (en) 2001-09-28 2005-09-13 The Board Of Trustees Of The Leland Stanford Junior University Electroosmotic microchannel cooling system
US7857037B2 (en) 2001-11-27 2010-12-28 Thermotek, Inc. Geometrically reoriented low-profile phase plane heat pipes
US7198096B2 (en) * 2002-11-26 2007-04-03 Thermotek, Inc. Stacked low profile cooling system and method for making same
US6834712B2 (en) * 2001-11-27 2004-12-28 Thermotek, Inc. Stacked low profile cooling system and method for making same
US9113577B2 (en) 2001-11-27 2015-08-18 Thermotek, Inc. Method and system for automotive battery cooling
US6606251B1 (en) 2002-02-07 2003-08-12 Cooligy Inc. Power conditioning module
US7165603B2 (en) * 2002-04-15 2007-01-23 Fujikura Ltd. Tower type heat sink
US7117930B2 (en) * 2002-06-14 2006-10-10 Thermal Corp. Heat pipe fin stack with extruded base
US6785140B2 (en) * 2002-08-28 2004-08-31 Dell Products L.P. Multiple heat pipe heat sink
US7140422B2 (en) * 2002-09-17 2006-11-28 Hewlett-Packard Development Company, L.P. Heat sink with heat pipe in direct contact with component
US6819562B2 (en) * 2003-01-31 2004-11-16 Hewlett-Packard Development Company, L.P. Cooling apparatus for stacked components
US6771507B1 (en) 2003-01-31 2004-08-03 Hewlett-Packard Development Company, L.P. Power module for multi-chip printed circuit boards
US7475175B2 (en) 2003-03-17 2009-01-06 Hewlett-Packard Development Company, L.P. Multi-processor module
US6992894B1 (en) * 2003-03-17 2006-01-31 Unisys Corporation Method and apparatus for EMI shielding
TWM244512U (en) * 2003-09-19 2004-09-21 Hon Hai Prec Ind Co Ltd Heat pipe type radiator
TWM247916U (en) * 2003-10-28 2004-10-21 Hon Hai Prec Ind Co Ltd Heat dissipatin device using heat pipe
US6945319B1 (en) * 2004-09-10 2005-09-20 Datech Technology Co., Ltd. Symmetrical heat sink module with a heat pipe for spreading of heat
US7433203B1 (en) * 2005-11-30 2008-10-07 Cisco Technology, Inc. Techniques for providing an EMI seal for a circuit board
US7597133B2 (en) * 2005-12-25 2009-10-06 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device with heat pipes
US7285851B1 (en) * 2006-09-29 2007-10-23 Teradyne, Inc. Liquid immersion cooled multichip module
US7755186B2 (en) * 2007-12-31 2010-07-13 Intel Corporation Cooling solutions for die-down integrated circuit packages
FR2929070B1 (fr) * 2008-03-18 2010-03-12 Kontron Modular Computers Dispositif de prechauffage d'un composant refroidi par conduction et/ou par convection
US20100051236A1 (en) * 2008-09-02 2010-03-04 Kuo-Len Lin Process and assembly for flush connecting evaporator sections of juxtaposed heat pipes to a fixing base
US20110214842A1 (en) * 2010-03-05 2011-09-08 Lea-Min Technologies Co., Ltd. Heat sink
EP3496523A1 (en) 2013-09-23 2019-06-12 Coriant Operations, Inc. Spring clip for fixation of heat sink on sfp/xfp cage
CN103501118B (zh) * 2013-09-29 2016-03-23 东方电气集团东方汽轮机有限公司 一种热管型风电变流器功率单元
GB2524093B (en) 2014-03-14 2016-11-16 Dyson Technology Ltd Light fixture
US10463863B2 (en) 2016-10-28 2019-11-05 General Electric Company High current flexible feedthrough for use with a power converter
US10757809B1 (en) 2017-11-13 2020-08-25 Telephonics Corporation Air-cooled heat exchanger and thermal arrangement for stacked electronics
DE102018204625A1 (de) * 2018-03-27 2019-10-02 Siemens Aktiengesellschaft Gehäuse für einen Umrichter, Endstufe eines Umrichters mit einem derartigen Gehäuse, Umrichter sowie Luftfahrzeug mit einem Umrichter
EP4098088A1 (de) 2020-01-27 2022-12-07 Sew-Eurodrive GmbH & Co. KG Antrieb, aufweisend einen umrichter
CN113453482B (zh) * 2020-03-26 2023-04-11 新疆金风科技股份有限公司 变流器模块、变流器模块的冷却系统及风力发电机组
US11320610B2 (en) 2020-04-07 2022-05-03 Cisco Technology, Inc. Integration of power and optics through cold plate for delivery to electronic and photonic integrated circuits
US11307368B2 (en) 2020-04-07 2022-04-19 Cisco Technology, Inc. Integration of power and optics through cold plates for delivery to electronic and photonic integrated circuits
CN113556916B (zh) * 2020-04-26 2023-02-28 台达电子企业管理（上海）有限公司 数据处理装置

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* Cited by examiner, † Cited by third party
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JPS568238Y2 (enExample) * 1976-02-14 1981-02-23
US4067237A (en) * 1976-08-10 1978-01-10 Westinghouse Electric Corporation Novel heat pipe combination
US4638854A (en) * 1983-06-15 1987-01-27 Noren Don W Heat pipe assembly
JPS6057956A (ja) * 1983-09-09 1985-04-03 Furukawa Electric Co Ltd:The 半導体用ヒ−トパイプ放熱器
US4829432A (en) * 1987-12-28 1989-05-09 Eastman Kodak Company Apparatus for shielding an electrical circuit from electromagnetic interference
US4951740A (en) * 1988-06-27 1990-08-28 Texas A & M University System Bellows heat pipe for thermal control of electronic components
US4858093A (en) * 1988-12-12 1989-08-15 Qualitron, Inc. Integrated magnetic power converter
US5010292A (en) * 1989-12-12 1991-04-23 North American Philips Corporation Voltage regulator with reduced semiconductor power dissipation
US4975825A (en) * 1990-01-16 1990-12-04 Sundstrand Corporation Stacked power converter
US5229915A (en) * 1990-02-07 1993-07-20 Ngk Insulators, Ltd. Power semiconductor device with heat dissipating property
US5118925A (en) * 1990-08-13 1992-06-02 Itt Corporation Electromagnetic interference shielding device for image intensifiers
US5131859A (en) * 1991-03-08 1992-07-21 Cray Research, Inc. Quick disconnect system for circuit board modules
JP2626326B2 (ja) * 1991-07-31 1997-07-02 三菱電機株式会社 モータ制御ユニット
US5162974A (en) * 1991-04-15 1992-11-10 Unisys Corporation Heat sink assembly for cooling electronic components
US5136119A (en) * 1991-09-18 1992-08-04 The United States Of America As Represented By The Secretaty Of The Navy Lightweight portable EMI shielding container
JP3069819B2 (ja) * 1992-05-28 2000-07-24 富士通株式会社 ヒートシンク並びに該ヒートシンクに用いるヒートシンク取付具及びヒートシンクを用いた可搬型電子装置
US5289347A (en) * 1992-06-04 1994-02-22 Digital Equipment Corporation Enclosure for electronic modules
US5311397A (en) * 1992-08-06 1994-05-10 Logistics Management Inc. Computer with modules readily replaceable by unskilled personnel
US5522602A (en) * 1992-11-25 1996-06-04 Amesbury Group Inc. EMI-shielding gasket
US5339214A (en) * 1993-02-12 1994-08-16 Intel Corporation Multiple-fan microprocessor cooling through a finned heat pipe
US5313099A (en) * 1993-03-04 1994-05-17 Square Head, Inc. Heat sink assembly for solid state devices
US5475606A (en) * 1993-03-05 1995-12-12 International Business Machines Corporation Faraday cage for a printed circuit card
US5461541A (en) * 1994-02-22 1995-10-24 Dana Corporation Enclosure for an electronic circuit module
US5513070A (en) * 1994-12-16 1996-04-30 Intel Corporation Dissipation of heat through keyboard using a heat pipe
US5621635A (en) * 1995-03-03 1997-04-15 National Semiconductor Corporation Integrated circuit packaged power supply
US5598320A (en) * 1995-03-06 1997-01-28 Ast Research, Inc. Rotable and slideble heat pipe apparatus for reducing heat build up in electronic devices
US5579827A (en) * 1995-11-13 1996-12-03 Us Micro Lab, Inc. Heat sink arrangement for central processing unit

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012124445A (ja) * 2010-12-07 2012-06-28 Samsung Electro-Mechanics Co Ltd パワーパッケージモジュール
JP2023510495A (ja) * 2020-01-15 2023-03-14 シスコ テクノロジー，インコーポレイテッド 冷却を伴うポイントオブロードからの配電

Also Published As

Publication number Publication date
US5901040A (en) 1999-05-04

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