JPH1197592A5 - - Google Patents

Info

Publication number
JPH1197592A5
JPH1197592A5 JP1998210486A JP21048698A JPH1197592A5 JP H1197592 A5 JPH1197592 A5 JP H1197592A5 JP 1998210486 A JP1998210486 A JP 1998210486A JP 21048698 A JP21048698 A JP 21048698A JP H1197592 A5 JPH1197592 A5 JP H1197592A5
Authority
JP
Japan
Prior art keywords
module
power converter
heat
assembly
converter module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1998210486A
Other languages
English (en)
Japanese (ja)
Other versions
JPH1197592A (ja
Filing date
Publication date
Priority claimed from US08/902,770 external-priority patent/US5901040A/en
Application filed filed Critical
Publication of JPH1197592A publication Critical patent/JPH1197592A/ja
Publication of JPH1197592A5 publication Critical patent/JPH1197592A5/ja
Pending legal-status Critical Current

Links

JP10210486A 1997-07-30 1998-07-27 熱消散装置 Pending JPH1197592A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US902,770 1997-07-30
US08/902,770 US5901040A (en) 1997-07-30 1997-07-30 Heat sink and Faraday Cage assembly for a semiconductor module and a power converter

Publications (2)

Publication Number Publication Date
JPH1197592A JPH1197592A (ja) 1999-04-09
JPH1197592A5 true JPH1197592A5 (enExample) 2005-10-27

Family

ID=25416374

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10210486A Pending JPH1197592A (ja) 1997-07-30 1998-07-27 熱消散装置

Country Status (2)

Country Link
US (1) US5901040A (enExample)
JP (1) JPH1197592A (enExample)

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US7134486B2 (en) * 2001-09-28 2006-11-14 The Board Of Trustees Of The Leeland Stanford Junior University Control of electrolysis gases in electroosmotic pump systems
US6942018B2 (en) 2001-09-28 2005-09-13 The Board Of Trustees Of The Leland Stanford Junior University Electroosmotic microchannel cooling system
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US7198096B2 (en) * 2002-11-26 2007-04-03 Thermotek, Inc. Stacked low profile cooling system and method for making same
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TWM244512U (en) * 2003-09-19 2004-09-21 Hon Hai Prec Ind Co Ltd Heat pipe type radiator
TWM247916U (en) * 2003-10-28 2004-10-21 Hon Hai Prec Ind Co Ltd Heat dissipatin device using heat pipe
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US7597133B2 (en) * 2005-12-25 2009-10-06 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device with heat pipes
US7285851B1 (en) * 2006-09-29 2007-10-23 Teradyne, Inc. Liquid immersion cooled multichip module
US7755186B2 (en) * 2007-12-31 2010-07-13 Intel Corporation Cooling solutions for die-down integrated circuit packages
FR2929070B1 (fr) * 2008-03-18 2010-03-12 Kontron Modular Computers Dispositif de prechauffage d'un composant refroidi par conduction et/ou par convection
US20100051236A1 (en) * 2008-09-02 2010-03-04 Kuo-Len Lin Process and assembly for flush connecting evaporator sections of juxtaposed heat pipes to a fixing base
US20110214842A1 (en) * 2010-03-05 2011-09-08 Lea-Min Technologies Co., Ltd. Heat sink
KR20120063256A (ko) * 2010-12-07 2012-06-15 삼성전기주식회사 파워 패키지 모듈
EP3496523A1 (en) 2013-09-23 2019-06-12 Coriant Operations, Inc. Spring clip for fixation of heat sink on sfp/xfp cage
CN103501118B (zh) * 2013-09-29 2016-03-23 东方电气集团东方汽轮机有限公司 一种热管型风电变流器功率单元
GB2524093B (en) 2014-03-14 2016-11-16 Dyson Technology Ltd Light fixture
US10463863B2 (en) 2016-10-28 2019-11-05 General Electric Company High current flexible feedthrough for use with a power converter
US10757809B1 (en) 2017-11-13 2020-08-25 Telephonics Corporation Air-cooled heat exchanger and thermal arrangement for stacked electronics
DE102018204625A1 (de) * 2018-03-27 2019-10-02 Siemens Aktiengesellschaft Gehäuse für einen Umrichter, Endstufe eines Umrichters mit einem derartigen Gehäuse, Umrichter sowie Luftfahrzeug mit einem Umrichter
US11252811B2 (en) * 2020-01-15 2022-02-15 Cisco Technology, Inc. Power distribution from point-of-load with cooling
EP4098088A1 (de) 2020-01-27 2022-12-07 Sew-Eurodrive GmbH & Co. KG Antrieb, aufweisend einen umrichter
CN113453482B (zh) * 2020-03-26 2023-04-11 新疆金风科技股份有限公司 变流器模块、变流器模块的冷却系统及风力发电机组
US11320610B2 (en) 2020-04-07 2022-05-03 Cisco Technology, Inc. Integration of power and optics through cold plate for delivery to electronic and photonic integrated circuits
US11307368B2 (en) 2020-04-07 2022-04-19 Cisco Technology, Inc. Integration of power and optics through cold plates for delivery to electronic and photonic integrated circuits
CN113556916B (zh) * 2020-04-26 2023-02-28 台达电子企业管理（上海）有限公司 数据处理装置

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