JPH1140654A - 基板保持構造 - Google Patents

基板保持構造

Info

Publication number
JPH1140654A
JPH1140654A JP19275397A JP19275397A JPH1140654A JP H1140654 A JPH1140654 A JP H1140654A JP 19275397 A JP19275397 A JP 19275397A JP 19275397 A JP19275397 A JP 19275397A JP H1140654 A JPH1140654 A JP H1140654A
Authority
JP
Japan
Prior art keywords
substrate
film
substrate holding
holding structure
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19275397A
Other languages
English (en)
Japanese (ja)
Other versions
JPH1140654A5 (enExample
Inventor
Shinichi Nomura
慎一 野村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kokusai Denki Electric Inc
Original Assignee
Kokusai Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kokusai Electric Co Ltd filed Critical Kokusai Electric Co Ltd
Priority to JP19275397A priority Critical patent/JPH1140654A/ja
Publication of JPH1140654A publication Critical patent/JPH1140654A/ja
Publication of JPH1140654A5 publication Critical patent/JPH1140654A5/ja
Pending legal-status Critical Current

Links

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP19275397A 1997-07-17 1997-07-17 基板保持構造 Pending JPH1140654A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19275397A JPH1140654A (ja) 1997-07-17 1997-07-17 基板保持構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19275397A JPH1140654A (ja) 1997-07-17 1997-07-17 基板保持構造

Publications (2)

Publication Number Publication Date
JPH1140654A true JPH1140654A (ja) 1999-02-12
JPH1140654A5 JPH1140654A5 (enExample) 2005-04-28

Family

ID=16296485

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19275397A Pending JPH1140654A (ja) 1997-07-17 1997-07-17 基板保持構造

Country Status (1)

Country Link
JP (1) JPH1140654A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002190511A (ja) * 2000-12-04 2002-07-05 Samsung Electronics Co Ltd 半導体装置のアッシング設備のチャックプレート及びこれを用いたチャック組立体
WO2008096717A1 (ja) * 2007-02-09 2008-08-14 Tokyo Electron Limited 載置台構造、これを用いた処理装置及びこの装置の使用方法
JP2012099825A (ja) * 2003-06-30 2012-05-24 Lam Research Corporation 動的な温度制御を有する基板支持体
JP2022059908A (ja) * 2020-10-02 2022-04-14 株式会社カネカ 成膜用トレイ及び太陽電池製造方法

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002190511A (ja) * 2000-12-04 2002-07-05 Samsung Electronics Co Ltd 半導体装置のアッシング設備のチャックプレート及びこれを用いたチャック組立体
JP2012099825A (ja) * 2003-06-30 2012-05-24 Lam Research Corporation 動的な温度制御を有する基板支持体
US8747559B2 (en) 2003-06-30 2014-06-10 Lam Research Corporation Substrate support having dynamic temperature control
WO2008096717A1 (ja) * 2007-02-09 2008-08-14 Tokyo Electron Limited 載置台構造、これを用いた処理装置及びこの装置の使用方法
JP2008198739A (ja) * 2007-02-09 2008-08-28 Tokyo Electron Ltd 載置台構造、これを用いた処理装置及びこの装置の使用方法
KR101054481B1 (ko) * 2007-02-09 2011-08-04 도쿄엘렉트론가부시키가이샤 재치대 구조, 이를 이용한 처리 장치, 이 장치의 사용 방법, 및 이를 실행시키는 프로그램을 격납한 컴퓨터 판독가능 기록매체
CN101606227B (zh) 2007-02-09 2012-06-06 东京毅力科创株式会社 载置台构造、以及用其的处理装置和该装置的使用方法
US9177846B2 (en) 2007-02-09 2015-11-03 Tokyo Electron Limited Placing bed structure, treating apparatus using the structure, and method for using the apparatus
US10388557B2 (en) 2007-02-09 2019-08-20 Tokyo Electron Limited Placing bed structure, treating apparatus using the structure, and method for using the apparatus
JP2022059908A (ja) * 2020-10-02 2022-04-14 株式会社カネカ 成膜用トレイ及び太陽電池製造方法

Similar Documents

Publication Publication Date Title
US20240186122A1 (en) Substrate processing apparatus
KR100362995B1 (ko) 기판 유지 방법 및 기판 유지 장치
KR100883285B1 (ko) 열 분산 플레이트 및 에지 지지대를 구비하는 어셈블리
JP5528394B2 (ja) プラズマ処理装置、搬送キャリア、及びプラズマ処理方法
TWI483333B (zh) 液體處理裝置、液體處理方法及記憶媒體
EP2235748B1 (en) High temperature vacuum chuck assembly
TW434669B (en) Sectional clamp ring
CN104425202B (zh) 等离子处理装置
TWI379019B (en) Gas distributor and apparatus using the same
CN1653591A (zh) 在包含基座的处理室中加热半导体基板的工艺和系统
JP2009256789A (ja) セラミックスヒータ
KR20130058312A (ko) 서셉터와 섀도우 프레임 간의 아크 발생 방지 장치
JP2010010304A (ja) 処理装置
JPH1140654A (ja) 基板保持構造
JPH11251257A (ja) 基板熱処理装置及び同装置からの基板の分離方法
CN112599469A (zh) 基板处理装置及基板处理方法
CN108103473B (zh) 用于半导体处理腔体的遮蔽装置及其使用方法
TW202247343A (zh) 用於沉積腔室的基板支撐件設計
CN108140607A (zh) 基板托架
TW442838B (en) Method and apparatus for fabricating a wafer spacing mask on a substrate support chuck
JP2007067353A (ja) プラズマ処理用環状部品、プラズマ処理装置、及び外側環状部材
JP2024022361A (ja) 基板処理装置
JP4515171B2 (ja) 真空処理方法
TW515024B (en) Wafer sucking device
JPH11111820A (ja) 基板処理装置

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20040622

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20040622

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20060627

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20061020