JPH11345904A5 - - Google Patents

Info

Publication number
JPH11345904A5
JPH11345904A5 JP1998153040A JP15304098A JPH11345904A5 JP H11345904 A5 JPH11345904 A5 JP H11345904A5 JP 1998153040 A JP1998153040 A JP 1998153040A JP 15304098 A JP15304098 A JP 15304098A JP H11345904 A5 JPH11345904 A5 JP H11345904A5
Authority
JP
Japan
Prior art keywords
resin
semiconductor element
semiconductor device
internal substrate
outer edge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1998153040A
Other languages
English (en)
Japanese (ja)
Other versions
JP4110303B2 (ja
JPH11345904A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP15304098A priority Critical patent/JP4110303B2/ja
Priority claimed from JP15304098A external-priority patent/JP4110303B2/ja
Priority to US09/321,587 priority patent/US6249043B1/en
Publication of JPH11345904A publication Critical patent/JPH11345904A/ja
Publication of JPH11345904A5 publication Critical patent/JPH11345904A5/ja
Application granted granted Critical
Publication of JP4110303B2 publication Critical patent/JP4110303B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP15304098A 1998-06-02 1998-06-02 樹脂封止型半導体装置の製造方法 Expired - Fee Related JP4110303B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP15304098A JP4110303B2 (ja) 1998-06-02 1998-06-02 樹脂封止型半導体装置の製造方法
US09/321,587 US6249043B1 (en) 1998-06-02 1999-05-28 Resin-sealed type semiconductor device, and method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15304098A JP4110303B2 (ja) 1998-06-02 1998-06-02 樹脂封止型半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JPH11345904A JPH11345904A (ja) 1999-12-14
JPH11345904A5 true JPH11345904A5 (enExample) 2004-07-15
JP4110303B2 JP4110303B2 (ja) 2008-07-02

Family

ID=15553666

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15304098A Expired - Fee Related JP4110303B2 (ja) 1998-06-02 1998-06-02 樹脂封止型半導体装置の製造方法

Country Status (2)

Country Link
US (1) US6249043B1 (enExample)
JP (1) JP4110303B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030087477A1 (en) * 2001-05-02 2003-05-08 Tomohiro Kawashima Repairable flip clip semiconductor device with excellent packaging reliability and method of manufacturing same
TW200507218A (en) * 2003-03-31 2005-02-16 North Corp Layout circuit substrate, manufacturing method of layout circuit substrate, and circuit module
JP2009026861A (ja) * 2007-07-18 2009-02-05 Elpida Memory Inc 半導体装置及びその製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5227664A (en) * 1988-02-26 1993-07-13 Hitachi, Ltd. Semiconductor device having particular mounting arrangement
JP3449796B2 (ja) 1994-08-18 2003-09-22 ソニー株式会社 樹脂封止型半導体装置の製造方法
JPH08195417A (ja) 1995-01-13 1996-07-30 Fujitsu Ltd フィルム基板及び半導体装置
JPH0982850A (ja) 1995-09-13 1997-03-28 Toshiba Corp 半導体パッケージ装置およびその製造方法
JPH09139404A (ja) 1995-11-16 1997-05-27 Toshiba Corp 半導体装置およびその製造方法
JPH10163386A (ja) * 1996-12-03 1998-06-19 Toshiba Corp 半導体装置、半導体パッケージおよび実装回路装置
JP2980046B2 (ja) * 1997-02-03 1999-11-22 日本電気株式会社 半導体装置の実装構造および実装方法

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