JPH11330236A5 - - Google Patents

Info

Publication number
JPH11330236A5
JPH11330236A5 JP1998128890A JP12889098A JPH11330236A5 JP H11330236 A5 JPH11330236 A5 JP H11330236A5 JP 1998128890 A JP1998128890 A JP 1998128890A JP 12889098 A JP12889098 A JP 12889098A JP H11330236 A5 JPH11330236 A5 JP H11330236A5
Authority
JP
Japan
Prior art keywords
layer
conductive material
wiring
layer wiring
material layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP1998128890A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11330236A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP12889098A priority Critical patent/JPH11330236A/ja
Priority claimed from JP12889098A external-priority patent/JPH11330236A/ja
Publication of JPH11330236A publication Critical patent/JPH11330236A/ja
Publication of JPH11330236A5 publication Critical patent/JPH11330236A5/ja
Withdrawn legal-status Critical Current

Links

JP12889098A 1998-05-12 1998-05-12 多層配線を有する電子装置及びその製造方法 Withdrawn JPH11330236A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12889098A JPH11330236A (ja) 1998-05-12 1998-05-12 多層配線を有する電子装置及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12889098A JPH11330236A (ja) 1998-05-12 1998-05-12 多層配線を有する電子装置及びその製造方法

Publications (2)

Publication Number Publication Date
JPH11330236A JPH11330236A (ja) 1999-11-30
JPH11330236A5 true JPH11330236A5 (enExample) 2005-09-29

Family

ID=14995889

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12889098A Withdrawn JPH11330236A (ja) 1998-05-12 1998-05-12 多層配線を有する電子装置及びその製造方法

Country Status (1)

Country Link
JP (1) JPH11330236A (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3329380B2 (ja) 1999-09-21 2002-09-30 日本電気株式会社 半導体装置およびその製造方法
JP4715014B2 (ja) * 2001-04-09 2011-07-06 凸版印刷株式会社 多層配線基板及びその製造方法
JP2007299947A (ja) 2006-04-28 2007-11-15 Toshiba Corp 半導体装置の製造方法
JP2008270509A (ja) * 2007-04-20 2008-11-06 Nec Electronics Corp 半導体装置の製造方法
JP5565095B2 (ja) * 2010-05-25 2014-08-06 富士通株式会社 配線回路基板の製造方法
JP6096013B2 (ja) * 2013-03-15 2017-03-15 旭化成エレクトロニクス株式会社 半導体装置の製造方法および半導体装置
CN114695357A (zh) * 2020-12-31 2022-07-01 中国科学院微电子研究所 一种半导体器件及其制备方法和存储器件

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