JPH11330236A - 多層配線を有する電子装置及びその製造方法 - Google Patents

多層配線を有する電子装置及びその製造方法

Info

Publication number
JPH11330236A
JPH11330236A JP12889098A JP12889098A JPH11330236A JP H11330236 A JPH11330236 A JP H11330236A JP 12889098 A JP12889098 A JP 12889098A JP 12889098 A JP12889098 A JP 12889098A JP H11330236 A JPH11330236 A JP H11330236A
Authority
JP
Japan
Prior art keywords
layer
conductive material
wiring
material layer
insulating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP12889098A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11330236A5 (enExample
Inventor
Susumu Matsumoto
晋 松本
Hiromitsu Abe
弘光 阿部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP12889098A priority Critical patent/JPH11330236A/ja
Publication of JPH11330236A publication Critical patent/JPH11330236A/ja
Publication of JPH11330236A5 publication Critical patent/JPH11330236A5/ja
Withdrawn legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP12889098A 1998-05-12 1998-05-12 多層配線を有する電子装置及びその製造方法 Withdrawn JPH11330236A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12889098A JPH11330236A (ja) 1998-05-12 1998-05-12 多層配線を有する電子装置及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12889098A JPH11330236A (ja) 1998-05-12 1998-05-12 多層配線を有する電子装置及びその製造方法

Publications (2)

Publication Number Publication Date
JPH11330236A true JPH11330236A (ja) 1999-11-30
JPH11330236A5 JPH11330236A5 (enExample) 2005-09-29

Family

ID=14995889

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12889098A Withdrawn JPH11330236A (ja) 1998-05-12 1998-05-12 多層配線を有する電子装置及びその製造方法

Country Status (1)

Country Link
JP (1) JPH11330236A (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002305269A (ja) * 2001-04-09 2002-10-18 Toppan Printing Co Ltd 多層配線基板及びその製造方法
US6492735B1 (en) 1999-09-21 2002-12-10 Nec Corporation Semiconductor device with alloy film between barrier metal and interconnect
JP2008270509A (ja) * 2007-04-20 2008-11-06 Nec Electronics Corp 半導体装置の製造方法
US7521352B2 (en) 2006-04-28 2009-04-21 Kabushiki Kaisha Toshiba Method for manufacturing a semiconductor device
JP2011249483A (ja) * 2010-05-25 2011-12-08 Fujitsu Ltd 配線回路基板及びその製造方法
JP2014179545A (ja) * 2013-03-15 2014-09-25 Asahi Kasei Electronics Co Ltd 半導体装置の製造方法および半導体装置
CN114695357A (zh) * 2020-12-31 2022-07-01 中国科学院微电子研究所 一种半导体器件及其制备方法和存储器件

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6492735B1 (en) 1999-09-21 2002-12-10 Nec Corporation Semiconductor device with alloy film between barrier metal and interconnect
US6607978B2 (en) 1999-09-21 2003-08-19 Nec Electronics Corporation Method of making a semiconductor device with alloy film between barrier metal and interconnect
JP2002305269A (ja) * 2001-04-09 2002-10-18 Toppan Printing Co Ltd 多層配線基板及びその製造方法
US7521352B2 (en) 2006-04-28 2009-04-21 Kabushiki Kaisha Toshiba Method for manufacturing a semiconductor device
JP2008270509A (ja) * 2007-04-20 2008-11-06 Nec Electronics Corp 半導体装置の製造方法
JP2011249483A (ja) * 2010-05-25 2011-12-08 Fujitsu Ltd 配線回路基板及びその製造方法
JP2014179545A (ja) * 2013-03-15 2014-09-25 Asahi Kasei Electronics Co Ltd 半導体装置の製造方法および半導体装置
CN114695357A (zh) * 2020-12-31 2022-07-01 中国科学院微电子研究所 一种半导体器件及其制备方法和存储器件

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