JPH11317336A - 集積回路デバイス製造のための装置と方法 - Google Patents
集積回路デバイス製造のための装置と方法Info
- Publication number
- JPH11317336A JPH11317336A JP11055603A JP5560399A JPH11317336A JP H11317336 A JPH11317336 A JP H11317336A JP 11055603 A JP11055603 A JP 11055603A JP 5560399 A JP5560399 A JP 5560399A JP H11317336 A JPH11317336 A JP H11317336A
- Authority
- JP
- Japan
- Prior art keywords
- lot
- wafer
- controller
- box
- wafer stepper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 97
- 238000000034 method Methods 0.000 title abstract description 50
- 230000004044 response Effects 0.000 claims description 16
- 230000008569 process Effects 0.000 abstract description 34
- 238000011112 process operation Methods 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 251
- 238000012545 processing Methods 0.000 description 32
- 238000010586 diagram Methods 0.000 description 14
- 238000000206 photolithography Methods 0.000 description 9
- 238000012360 testing method Methods 0.000 description 6
- 229920002120 photoresistant polymer Polymers 0.000 description 5
- 238000012546 transfer Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000012217 deletion Methods 0.000 description 1
- 230000037430 deletion Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000036316 preload Effects 0.000 description 1
- 238000012958 reprocessing Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Automation & Control Theory (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US034967 | 1993-03-22 | ||
| US09/034,967 US6136614A (en) | 1998-03-04 | 1998-03-04 | Apparatus and method for manufacturing integrated circuit devices |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11317336A true JPH11317336A (ja) | 1999-11-16 |
| JPH11317336A5 JPH11317336A5 (enExample) | 2006-04-20 |
Family
ID=21879784
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11055603A Withdrawn JPH11317336A (ja) | 1998-03-04 | 1999-03-03 | 集積回路デバイス製造のための装置と方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (2) | US6136614A (enExample) |
| JP (1) | JPH11317336A (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6398429B1 (en) * | 1999-03-15 | 2002-06-04 | Tokyo Electron Limited | Developing method and developing apparatus |
| US6351684B1 (en) * | 2000-09-19 | 2002-02-26 | Advanced Micro Devices, Inc. | Mask identification database server |
| JP2002270667A (ja) * | 2001-03-12 | 2002-09-20 | Sony Corp | 半導体製造方法及び半導体製造装置 |
| TW533468B (en) * | 2002-04-02 | 2003-05-21 | Macronix Int Co Ltd | Yield monitoring and analysis system and method |
| US7477959B2 (en) * | 2002-06-26 | 2009-01-13 | Taiwan Semiconductor Manufacturing Co., Ltd. | Photoresist system |
| KR100735027B1 (ko) * | 2006-01-03 | 2007-07-03 | 삼성전자주식회사 | 레티클 식별장치와 이를 구비한 노광설비 및 노광방법 |
| US9987747B2 (en) * | 2016-05-24 | 2018-06-05 | Semes Co., Ltd. | Stocker for receiving cassettes and method of teaching a stocker robot disposed therein |
| KR102813793B1 (ko) * | 2021-03-30 | 2025-05-27 | 텐센트 테크놀로지(센젠) 컴퍼니 리미티드 | 포토레지스트 제거 방법 및 포토레지스트 제거 시스템 |
Family Cites Families (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1534248A (en) * | 1976-03-31 | 1978-11-29 | Tokyo Shibaura Electric Co | Apparatus for manufacturing semiconductor devices |
| US4636634A (en) * | 1984-08-28 | 1987-01-13 | Veeco Integrated Automation, Inc. | Apparatus with intelligent bins indicating the presence and identity of stored coded articles |
| JPS63232921A (ja) * | 1987-03-19 | 1988-09-28 | Toshiba Corp | 製造方法及び装置 |
| US4833306A (en) * | 1988-05-18 | 1989-05-23 | Fluoroware, Inc. | Bar code remote recognition system for process carriers of wafer disks |
| US5536128A (en) * | 1988-10-21 | 1996-07-16 | Hitachi, Ltd. | Method and apparatus for carrying a variety of products |
| JP2802678B2 (ja) * | 1990-09-26 | 1998-09-24 | リンテック株式会社 | レチクルケースのバーコード貼着装置 |
| US5570293A (en) * | 1990-11-29 | 1996-10-29 | Tokyo Seimitsu Co., Ltd. | Method and device for manufacturing a semiconductor chip |
| US5668056A (en) * | 1990-12-17 | 1997-09-16 | United Microelectronics Corporation | Single semiconductor wafer transfer method and manufacturing system |
| US5442561A (en) * | 1992-05-12 | 1995-08-15 | Nippon Telegraph And Telephone Corporation | Production management system and its application method |
| US5325582A (en) * | 1992-10-19 | 1994-07-05 | Trw Inc. | Multi-function workstation for assembly and repair of printed wiring board assemblies |
| JPH06143103A (ja) * | 1992-10-29 | 1994-05-24 | Pfu Ltd | 混流生産システムとそのシステムに使用されるパレット |
| US5432702A (en) * | 1994-06-17 | 1995-07-11 | Advanced Micro Devices Inc. | Bar code recipe selection system using workstation controllers |
| US5567927A (en) * | 1994-07-25 | 1996-10-22 | Texas Instruments Incorporated | Apparatus for semiconductor wafer identification |
| JPH0878882A (ja) * | 1994-09-02 | 1996-03-22 | Fuji Mach Mfg Co Ltd | 対回路基板トランスファ作業装置 |
| JP3347528B2 (ja) * | 1995-05-23 | 2002-11-20 | キヤノン株式会社 | 半導体製造装置 |
| US5814829A (en) * | 1995-07-11 | 1998-09-29 | Qc Optics, Inc. | Multistation surface inspection system |
| US5751581A (en) * | 1995-11-13 | 1998-05-12 | Advanced Micro Devices | Material movement server |
| KR100217327B1 (ko) * | 1996-07-30 | 1999-10-01 | 윤종용 | 반도체장치 콘택 오픈 검사 방법 |
| JPH10177051A (ja) * | 1996-12-19 | 1998-06-30 | Asahi Chem Ind Co Ltd | 電磁波発生装置 |
| KR0174997B1 (ko) * | 1996-12-20 | 1999-03-20 | 김광호 | 노광설비의 이중노광 방지장치 |
| US5828989A (en) * | 1997-01-22 | 1998-10-27 | Advanced Micro Devices, Inc. | Semiconductor manufacturing system having a bar-code interface |
| US5942739A (en) * | 1997-01-22 | 1999-08-24 | Advanced Micro Devices, Inc. | Process timer monitor |
| US5883374A (en) * | 1997-03-27 | 1999-03-16 | Advanced Micro Devices, Inc. | Scanning system for identifying wafers in semiconductor process tool chambers |
| US6000830A (en) * | 1997-04-18 | 1999-12-14 | Tokyo Electron Limited | System for applying recipe of semiconductor manufacturing apparatus |
| JPH10303480A (ja) * | 1997-04-24 | 1998-11-13 | Amada Eng Center:Kk | 固体レーザー発振器 |
| US6138058A (en) * | 1998-01-06 | 2000-10-24 | Jenoptik Infab, Inc. | Method for electronically tracking containers to avoid misprocessing of contents |
| US6265684B1 (en) * | 1999-10-28 | 2001-07-24 | Promos Technologies Inc. | Wafer ID optical sorting system |
-
1998
- 1998-03-04 US US09/034,967 patent/US6136614A/en not_active Expired - Fee Related
-
1999
- 1999-03-03 JP JP11055603A patent/JPH11317336A/ja not_active Withdrawn
-
2000
- 2000-08-22 US US09/643,389 patent/US6819968B1/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US6819968B1 (en) | 2004-11-16 |
| US6136614A (en) | 2000-10-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20060303 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20060303 |
|
| A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A711 Effective date: 20060629 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20061201 |
|
| A761 | Written withdrawal of application |
Free format text: JAPANESE INTERMEDIATE CODE: A761 Effective date: 20070608 |