JPH11307993A - Mounting head - Google Patents

Abstract

PROBLEM TO BE SOLVED: To speed up the production, etc., by maintaining the electronic parts mounting accuracy of a mounting head at a high level by cooling a driving means, such as the voice coil motor, etc. SOLUTION: In a mounting head 20 provided with a voice coil motor 24 which moves a mounting nozzle 29 used for mounting parts in the vertical direction, a heat transfer material 40 is attached to the periphery of the motor 23 and a fan motor 41 which cools the material 40 is attached to the material 40. Consequently, the mounting head 20 can speed up the production, etc., because the voice coil motor 23 can be cooled well and the electronic parts mounting accuracy of the head 20 can be maintained at a high level.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus for mounting an electronic component on a circuit board, and more particularly to a mounting head having a nozzle for sucking and mounting an electronic component.

[0002]

2. Description of the Related Art For automatically mounting (including temporary mounting and mounting) various electronic components on a circuit board, a component supply mechanism according to the type of electronic component has been proposed and adopted.

For example, fine so-called chip components are handled as taping components or bulk components by a component supply cassette, and each electronic component is supplied to a predetermined position for use. A large number of irregularly shaped electronic components having a special shape are stored in a plurality of trays in a plurality of types, and a plurality of types are stored, and a predetermined component is selected from the stored various trays to determine a predetermined component supply position. And use the stored electronic components for use.

In recent years, while electronic components have been miniaturized, electronic components have been further diversified and increased in size due to advances in integrated circuits and development of connectors. For this reason, various types, forms, shapes,
It is necessary to handle electronic components of a large size.
In addition, the number of electronic components mounted on one electronic circuit board has been rapidly increasing due to multifunctional and large-sized electric devices.

[0005] In these electronic component mounting apparatuses, high speed, high precision, high productivity, and high reliability are demanded.
Hereinafter, an example of a mounting head of a conventional electronic component mounting apparatus will be described with reference to FIG. In FIG.
Only the main components of the mounting head are shown, and the X and Y robot parts and the like excluding the X-axis block are omitted.

Reference numeral 21 denotes an X-axis block of the X and Y robots, on which a mounting head 35 is mounted. X axis block 2
1, a connecting plate 22 is attached to the connecting plate 22. A plurality of voice coil motors 23 are connected to and attached to the connecting plate 22 in such a manner that a plurality of voice coil motors 23 are arranged side by side in the lateral direction. I have. In addition, the motor bracket 24 attached to the upper surface of the X-axis block 21
And a driving force of each motor 25 is transmitted to a mounting nozzle 29 via a driving pulley 26, a timing belt 27, and a driven pulley 28, and is driven to rotate.

[0007] Radiation fins 30 for suppressing heat generation are mounted on the front side and the back side (the side close to the connection plate 22) of the voice coil motor 23, respectively. Reference numeral 31 denotes a sensor scale that senses the position of the mounting nozzle 29 in the vertical direction, and is configured so that the mounting nozzle 29 descends to suck and mount the electronic component 1.

The operation of the mounting head 35 configured as described above will be described. When the X and Y robots are operated, the mounting head 35 is moved to a component suction position where the electronic component 1 is picked up. Then, the voice coil motor 23 is driven to lower the mounting nozzle 29, and the electronic component 1 is sucked.

Next, the voice coil motor 23 is driven, the mounting nozzle 29 is raised, and the X, Y robot operates to move the mounting head 35 to the component mounting position on the circuit board. The mounting nozzle 29 is lowered to mount the electronic component 1 on the circuit board.

During the manufacture of the electronic circuit board by repeating the above operation, the heat generated by the voice coil motor 23 is absorbed by the heat radiation fins 30 to prevent the temperature from rising.

[0011]

However, in the above configuration, the radiating fins 30 are not connected to the voice coil motor 2.
3, the heat radiation fins 30 on the back side of the voice coil motor 23 are mounted in a narrow space where the voice coil motor 23 and the connection plate 21 are close to each other and the airflow is poor. The cooling effect on the voice coil motor 23, particularly the cooling effect on the back side of the voice coil motor 23, is not so much obtained, and the positional accuracy of the various mounting nozzles 29 slightly changes due to thermal deformation, and it is difficult to maintain the electronic component mounting accuracy. Was.

Also, in such a mounting head 35, the temperature of a predetermined portion such as the voice coil motor 23 is controlled, and if the temperature of the voice coil motor 23 rises excessively, an optical system such as a camera and the mounting head are mounted. In order to prevent this, the positional accuracy relationship between the optical system such as a camera and the mounting head 35 must be calibrated every time a certain temperature rise occurs. This is performed during production, and as a result, there has been a problem that it is not possible to speed up production and the like.

An object of the present invention is to provide a mounting head capable of satisfactorily cooling a driving means such as a voice coil motor, maintaining good mounting accuracy of electronic components, and increasing the speed of production and the like. It is intended for.

[0014]

According to the present invention, there is provided a mounting head having a driving means for moving a mounting nozzle for mounting a component in a predetermined direction. A heat transfer material is mounted around the heat transfer material, and a fan motor for cooling the heat transfer material is mounted on the heat transfer material.

According to the present invention, it is possible to obtain a mounting head that can cool the voice coil motor satisfactorily, maintain good electronic component mounting accuracy, and can speed up production and the like.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 of the present invention is a mounting head provided with a driving means for moving a mounting nozzle for mounting a component in a predetermined direction, wherein the mounting head is provided around the driving means. A heat transfer material is attached to the heat transfer material, and a fan motor that cools the heat transfer material is attached to the heat transfer material.
By driving the fan motor, heat can be radiated from the driving means through the heat transfer material, and thermal deformation can be minimized.

According to a second aspect of the present invention, in the mounting head according to the first aspect, a ventilation hole is formed in a cooling portion of the heat transfer material which is cooled by being blown by the fan motor. By driving the air conditioner, the ventilation state is improved through the ventilation hole, and the cooling portion is effectively cooled, so that the heat radiating of the driving means can be satisfactorily performed through the heat transfer material.

According to a third aspect of the present invention, in the mounting head according to the first or second aspect, the portion of the heat transfer material on which the other component is closer to the driving means is extended. A fan motor is attached to this extension, so that the side of the drive means where other components are close to each other, where heat tends to accumulate, is cooled well through the heat transfer material.

Hereinafter, an embodiment of the present invention will be described with reference to FIG.
This will be described with reference to FIG. Note that the same reference numerals are given to those having substantially the same functions as the conventional ones. FIG. 3 is an overall schematic perspective view of an electronic component mounting apparatus provided with the mounting head according to the embodiment of the present invention.

The electronic component mounting apparatus 2 shown in FIG. 3 is used for manufacturing an electronic circuit board by mounting various electronic components 1 including a connector or the like as an example of an electronic component on a circuit board 3 as an example of a mounting object. Is shown. However, the present invention is not limited to these, and is applicable to all cases where various electronic components 1 are mounted on various component objects and various components are assembled, manufactured, or manufactured.

In order to handle various electronic components 1, the electronic component mounting apparatus 2 selects a tray 4 storing predetermined electronic components 1 and moves the tray 4 from its storage position to a component supply position as necessary. A tray component supply unit 5 for supplying the components 2 and a plurality of component supply cassettes 6 are arranged adjacent to each other.
Load electronic components 1 by loading taping parts and bulk parts
And a cassette component supply unit 7 for feeding the components to the component supply position. The electronic components 1 supplied from the tray component supply unit 5 and the cassette component supply unit 7 are
X, which are orthogonal to each other when viewed from a plane by the Y robot 10,
The electronic circuit board is manufactured by being picked up as needed by the mounting head 20 moved in the Y direction and mounted at a predetermined position on the circuit board 3.

The tray component supply section 5 is provided with a drawer section 8 for taking the tray 4 in and out. Tray 4 contains
A plurality of recesses are formed in a matrix in accordance with the shape and size of the electronic component 1 to be stored.
The electronic components 1 are stored and handled in an aligned state in which the corresponding electronic components 1 are stored in a predetermined direction in each of the concave portions. As the electronic components 1 to be stored in the tray 4, large and flat electronic components 1 and flat and large and irregularly shaped electronic components 1 such as connectors are suitable.
The electronic component 1 to be accommodated is positioned and held in a fixed direction on the tray 4 by the concave portion.

On the other hand, the component supply cassette 6 is suitable for handling electronic components 1 that are used much more frequently than the electronic components 1 handled on the tray 4, such as minute and various types of chip components. Many are arranged side by side,
A large number of electronic components 1 can be supplied.

The tray component supply unit 5 and the cassette component supply unit 7 may be basically arranged in any manner. The electronic component 1 picked up by the mounting head 20 as needed is picked up by the mounting head 20. After the position is measured and corrected by the component recognition camera 11, it is mounted at a predetermined position on the circuit board 3 by relative movement with respect to the circuit board 3.

The cassette component supply unit 7 handles minute and various types of electronic components 1 that are frequently used, sequentially supplies many types of electronic components 1 from a large number of component supply cassettes 7, and mounts them on the circuit board 3 by the mounting head 20. At a predetermined position. The tray component supply unit 5 alternately supplies the different types of electronic components 1, thereby reducing the time required for sequentially supplying the different types of electronic components 1 by half and doubling the supply speed of the plurality of types of electronic components 1 from the tray 9. It is supposed to. That is, while the mounting head 20 continuously handles and mounts the electronic components 1 supplied from the cassette component supply unit 7, it handles a plurality of types of electronic components 1 from the tray 4, and furthermore, supplies components. The time lag has been reduced or eliminated to speed up component mounting.

The mounting head 20 is moved in the X and Y directions while being supported by the X and Y robots 10. On the other hand, the circuit board 3 is transported in the X direction by the transport rails 12 and 13 and is used for mounting the electronic component 1 by the mounting head 20.
That is, the circuit board 3 is carried into the component mounting position through the carrying-in portion having the pair of transport rails 12 and is used for component mounting. The mounted circuit board 3 at the component mounting position has the pair of transport rails 13. The circuit board 3 is conveyed out through the carrying-out section, and constitutes a transfer path of the circuit board 3 as a whole.

The mounting head 20 includes a plurality of mounting nozzles 29 for mounting the electronic components 1 arranged in the X direction, which is also an arrangement direction in which the component supply cassette 6 and the tray component supply unit 5 are arranged adjacent to each other. And a recognition camera 11 for recognizing a position on the circuit board 3 where the electronic component 1 picked up by the user is mounted, while maintaining a predetermined positional relationship.

Each mounting nozzle 29 is used to handle the electronic component 1
An example of the mounting nozzle 29 is a suction nozzle that suctions and holds the electronic component 1. Reference numeral 15 denotes a component transfer head for transferring the electronic components 1 stored in the tray 4 to the drawer unit 8 in advance.
Reference numeral 6 denotes a nozzle replacement unit that stores and replaces the mounting nozzle 29.

FIG. 1 shows a detailed configuration of the mounting head 20.
As shown in FIG. 1, a connecting plate 22 is attached to the X-axis block 21, and a plurality of voice coil motors 23 are mounted on the connecting plate 22 in a posture in which a plurality of voice coil motors 23 are arranged in a horizontal direction. Each is attached and connected. A plurality of motors 25 are mounted via a motor bracket 24 mounted on the upper surface of the X-axis block 21, and the mounting nozzle 29 is rotationally driven via a driving pulley 26, a timing belt 27, and a driven pulley 28. It has become. Reference numeral 31 denotes a sensor scale that senses the position of the mounting nozzle 29 in the vertical direction, and is configured so that the mounting nozzle 29 descends to suck and mount the electronic component 1.

Here, a heat transfer plate 40 having good heat conductivity, such as a copper plate, is wound around the voice coil motor 23 of the mounting head 20. As shown in FIGS. 1 and 2A and 2B, the heat transfer plate 40 surrounds the outer periphery of the voice coil motor 23 and is disposed on the back side of the voice coil motor 23 close to the connection plate 22. The portions are connected to each other and have a shape extended to the side. And this extension 4
A fan motor 41 is attached to the motor 0a, and the extension 40a is cooled by the fan motor 41. Further, a plurality of ventilation holes 40b are formed in the extension 40a as the cooling portion.

Hereinafter, the operation of the electronic component mounting apparatus 2 will be described. The mounting head 20 equipped with the mounting nozzle 29
Is a tray component supply unit 5 or a cassette component supply unit 7
Is positioned at the suction position of the electronic component 1 supplied by the
The mounting nozzle 29 is picked up by the voice coil motor 23 and the component posture is recognized by the component recognition camera 11. Thereafter, the mounting nozzle 29 is positioned at a predetermined position on the circuit board 3 by relative movement with respect to the circuit board 3, and the mounting nozzle 29 is moved by the voice coil motor 23.
Is lowered and the electronic component 1 is mounted.

As described above, when the electronic component 1 is mounted on the circuit board 3 to manufacture the electronic circuit board, the mounting nozzle 29 is mounted.
Is frequently operated by operations such as suction and mounting of the electronic component 1 while being moved up and down by the voice coil motor 23.

At this time, the current starts flowing to the voice coil motor 23 from the time of turning on the power supply of the equipment body, and the voice coil motor 23 is frequently operated. The accuracy may slightly change, and it may be difficult to maintain the electronic component mounting accuracy.

However, the heat transfer plate 40 having good heat conductivity is wound around the voice coil motor 23 of the mounting head 20, and the fan motor 41 is mounted on the extension 40a of the heat transfer plate 40. By driving the fan motor 41, the heat of the voice coil motor 23 can be radiated through the heat transfer material 40. Since the fan motor 41 is attached to the extension portion 40 a extending from the back side of the voice coil motor 23, the connection plate 22
The portion where heat easily accumulates in the vicinity of is also well cooled through the heat transfer material 40. Further, since a plurality of ventilation holes 40b are formed in the extension 40a cooled by the fan motor 41, the extension 40a is properly cooled when the air sent by the fan motor 41 passes through the ventilation hole 40b. In addition, the heat of the voice coil motor 23 can be satisfactorily radiated.

Therefore, a sufficient cooling effect can be obtained for the voice coil motor 23, especially for the back side of the voice coil motor 23, and it is possible to prevent a decrease in the positional accuracy of the various mounting nozzles 29 due to thermal deformation.

In the above embodiment, the case where the voice coil motor 23 as the driving means for driving the mounting nozzle 29 is cooled has been described, but it goes without saying that the present invention is not limited to this.

[0037]

As described above, according to the present invention, a heat transfer material having good heat conductivity is attached around drive means for moving the mounting nozzle in a predetermined direction, and the heat transfer material is attached to the heat transfer material. By installing a fan motor that cools the motor, the driving means can be cooled by the fan motor and the temperature difference can be added to increase the heat conduction effect, the amount of thermal deformation can be reduced, and the mounting accuracy of electronic components can be maintained. In addition, the frequency of calibration of the component recognition camera and the mounting head during the production of the electronic circuit board can be reduced, thereby improving the production efficiency.

[Brief description of the drawings]

FIG. 1 is a perspective view of a mounting head according to an embodiment of the present invention.

FIGS. 2A and 2B are a plan sectional view and a front view of a heat transfer material and a fan motor in the mounting head according to the embodiment;

FIG. 3 is an overall schematic perspective view of an electronic component mounting apparatus including the mounting head according to the embodiment;

FIG. 4 is a perspective view of a conventional mounting head.

DESCRIPTION OF SYMBOLS 1 Electronic component 2 Electronic component mounting device 3 Circuit board 20 Mounting head 22 Connecting plate 23 Voice coil motor 29 Mounting nozzle 40 Heat transfer plate 40a Extension 40b Vent hole 41 Fan motor

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Naoyuki Kitamura 1006 Kadoma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.

Claims (3)

[Claims] 1. A mounting head comprising a driving means for moving a mounting nozzle for mounting components along a predetermined direction, wherein a heat transfer material is attached around the drive means, and the heat transfer material is attached to the heat transfer material. A mounting head with a fan motor that cools the material. 2. The mounting head according to claim 1, wherein a ventilation hole is formed in a cooling portion of the heat transfer material which is cooled by being blown by the fan motor. 3. The heat transfer material according to claim 1, wherein a portion of the heat transfer material on the side where other components are close to the drive means is extended, and a fan motor is attached to the extension. Mounting head.