JP2004087651A - Electronic part mounting system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic part mounting system which is capable of improving an operator's working efficiency. <P>SOLUTION: The electronic part mounting system 1 is equipped with a first segment transfer path 111 which transfers a board 9 in a prescribed direction from a loader 12, a second segment transfer path 112 which transfers the board 9 in a perpendicular direction from the terminal point of the first segment transfer 111, and a third segment transfer path 113 which transfers the board 9 in the direction opposite to that of the first segment transfer 111 in which the board 9 is transferred. A region between the first segment transfer path 111 and the third segment transfer path 113 is set as a working region 10 for the operator 90. By this setup, the moving range of the operator 90 can be limited to a small space, and the operator 90 can be improved in working efficiency. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an electronic component mounting system for mounting an electronic component on a substrate.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, when mounting electronic components on a printed wiring board is automated, devices that execute each process related to mounting have been linearly arranged. For example, when mounting is performed using paste solder, a loader that stores the board before mounting, a printing device that prints solder on the board, a mounting device that mounts small electronic components on the board, and a large electronic component are used. Many devices such as a mounting device for mounting on a substrate, a reflow device for heating and cooling the substrate to fix electronic components, and an unloader for storing mounted substrates are arranged along a linear transport path. Further, an inspection device for performing an inspection in the middle of the processing relating to the mounting is appropriately provided.
[0003]
[Problems to be solved by the invention]
However, when many devices are arranged in a straight line, the loader and the unloader are very far apart, and it becomes necessary to arrange workers on the loader side and the unloader side. Further, when monitoring each device, the operator must move a long distance from the loader to the unloader, so that it is necessary to secure a path for the operator along the electronic component mounting system. As a result, the floor area required for arranging the electronic component mounting system must be considerably larger than the sum of the occupied areas of the devices.
[0004]
On the other hand, in recent years, there has been a great tendency for the production of substrates to be of a variety of types and in small quantities, and the types of substrates to be produced are frequently changed. Each time the type of the substrate is changed, the worker needs to readjust the production line, and an environment in which the worker can easily access each device is required.
[0005]
The present invention has been made in view of the above problems, and has as its main object to improve the work efficiency of a worker in an electronic component mounting system, and also to reduce the area required for installing the electronic component mounting system.
[0006]
[Means for Solving the Problems]
The invention according to claim 1 is an electronic component mounting system for mounting an electronic component on a substrate, comprising: a loader that supplies a substrate to a transport path; an unloader that collects the substrate from the transport path; A plurality of processing units that are arranged along and carry out a series of steps relating to mounting of electronic components, wherein the transport path is a first partial transport path that transports a substrate in a predetermined direction from the loader; A second partial transport path for transporting the substrate in a direction substantially perpendicular from the end point of the one partial transport path, and a third partial transport path for transporting the substrate in a direction opposite to the predetermined direction from the end point of the second partial transport path; Having.
[0007]
The invention according to claim 2 is the electronic component mounting system according to claim 1, wherein the operation panel of the processing unit arranged along the first partial transport path and the operation panel along the third partial transport path. The operation panels of the processing units arranged in a row face each other.
[0008]
The invention according to claim 3 is the electronic component mounting system according to claim 1 or 2, wherein an area between the first partial transport path and the third partial transport path is the plurality of processing units. Is the work area of the worker for
[0009]
The invention according to claim 4 is an electronic component mounting system for mounting an electronic component on a substrate, comprising a plurality of processing units for performing a series of steps relating to mounting of the electronic component, wherein the plurality of processing units are in a predetermined area. And a predetermined work performed by the operator on the plurality of processing units is performed from the predetermined area side.
[0010]
The invention according to claim 5 is the electronic component mounting system according to claim 4, wherein the plurality of processing units include a plurality of operation panels facing the predetermined area side.
[0011]
The invention according to claim 6 is the electronic component mounting system according to claim 4 or 5, wherein component supply or material supply to the plurality of processing units is performed from the predetermined area side.
[0012]
According to a seventh aspect of the present invention, there is provided the electronic component mounting system according to any one of the fourth to sixth aspects, wherein loading and unloading of the substrate from and to each of the plurality of processing units are performed from the predetermined area side. Be done.
[0013]
The invention according to claim 8 is the electronic component mounting system according to claim 7, wherein at least one of the plurality of processing units has a substantially U-shaped transfer path through which the substrate is transferred.
[0014]
According to a ninth aspect of the present invention, in the electronic component mounting system according to the eighth aspect, the take-in position and the discharge position are vertically arranged in the substantially U-shaped transport path.
[0015]
BEST MODE FOR CARRYING OUT THE INVENTION
FIG. 1 is a plan view showing a configuration of an electronic component mounting system 1 according to the first embodiment of the present invention. The illustration of each device constituting the electronic component mounting system 1 is simplified as appropriate.
[0016]
The electronic component mounting system 1 is a system in which electronic components are mounted on a printed wiring board (hereinafter, referred to as “substrate”) 9 using solder, and a central area is a work area 10 where an operator 90 performs an operation. ing. A transport path 11 on which the substrate 9 is transported is formed around the work area 10, and the transport path 11 starts from the loader 12 and moves in the (+ Y) direction in FIG. A second partial transport path 112 extending from the end point of the partial transport path 111 in the (+ X) direction, and a third partial transport path 113 extending from the end point of the second partial transport path 112 to the unloader 19 in the (−Y) direction. Have.
[0017]
Along the transport path 11 from the loader 12 to the unloader 19, a printing device 13, a plurality of high-speed mounting devices 14, an inspection device 15, a plurality of multifunctional mounting devices 16, a reflow device 17, and an inspection device 18 are arranged in order. While the substrate 9 is transported on the transport path 11, a series of steps relating to mounting of electronic components are executed by these devices. In addition, between the first partial transport path 111 and the second partial transport path 112, and between the second partial transport path 112 and the third partial transport path 113, a direction changer 114 that changes the direction of the substrate 9. Is arranged.
[0018]
A storage device 91 (a so-called magazine rack) that stores a plurality of substrates 9 before mounting is placed on the loader 12. The substrate 9 taken out of the loader 12 and supplied to the transport path 11 is transported into the printing device 13 while being transported through the first partial transport path 111, and the solder paste is applied to a necessary portion on the substrate 9 by using a printing technique. Is applied. Thereafter, the substrate 9 is transported to the high-speed mounting device 14.
[0019]
The high-speed mounting device 14 has a supply unit 141 in which a tape on which small electronic components are arranged is wound around a reel, and the small electronic components from the supply unit 141 are mounted on the solder on the substrate 9 at high speed. , To the inspection device 15. The inspection device 15 inspects the mounting state of the small electronic components on the substrate 9, for example, the presence or absence of the electronic components, the position of the electronic components, and the like.
[0020]
Thereafter, the direction of the substrate 9 is changed by the direction changer 114, the substrate 9 is transferred on the second partial transfer path 112, the direction is changed again by the direction changer 114, and the substrate 9 is transferred to the third partial transfer path 113. . In the third partial transport path 113, first, a relatively large-sized electronic component such as a quad flat package (QFP) or a chip size package (CSP) is mounted on the solder on the substrate 9 by the multifunctional mounting device 16. Note that the electronic components are stored in a tray in the supply unit 161 of the multi-function mounting device 16.
[0021]
When the mounting of all the electronic components is completed, the substrate 9 is carried into the reflow device 17, and the reflow device 17 heats and melts the solder while transporting the substrate 9, and then cools the substrate 9 to transfer the electronic components to the substrate. 9 is fixed. The mounted board 9 is subjected to an appearance inspection by the inspection device 18, and after the inspection result is obtained, the board 9 is collected by the unloader 19 from the third partial transport path 113 and stored in the storage container 92.
[0022]
Next, features of the electronic component mounting system 1 will be described. In the electronic component mounting system 1, as described above, the transport path 11 is provided so as to surround the work area 10 of the worker 90 (accurately, in three directions). Here, the supply of the solder material to the printing apparatus 13 and the replacement of the aperture plate for printing can be performed from the work area 10 side. The supply unit 141 of the high-speed mounting device 14 and the supply unit 161 of the multi-function mounting device 16 are also provided on the work area 10 side, and components are supplied from the work area 10 side.
[0023]
Further, an operation panel 21 for operating each device around the work area 10 is attached so as to face the work area 10 side. That is, in the case of the electronic component mounting system 1, the operation panel 21 of the device arranged along the first partial transport path 111 and the operation panel 21 of the device arranged along the third partial transport path 113 face each other. Placed in In the electronic component mounting system 1, all the operations related to the change of the type of the substrate 9 can be performed from the work area 10 side.
[0024]
Since the worker 90 uses the cart 95 to carry parts and the like into the work area 10, the width of the work area 10 in the X direction is set in consideration of the width of the carriage 95 and the work efficiency of the worker 90. . Specifically, the width of the work area 10 in the X direction is 1.5 to 3 m. If it is shorter than 1.5 m, it is difficult to secure a working space (for example, about 60 cm) on both sides of the carriage 95, and if it exceeds 3 m, an extra space for the work content is generated.
[0025]
As described above, in the electronic component mounting system 1, the transport path 11 is moved from the loader 12 to the first partial transport path 111 for transporting the substrate 9 in a predetermined direction, and the substrate 9 is moved in a direction substantially perpendicular to the end point of the first partial transport path 111. A second partial transport path 112 for transporting the substrate and a third partial transport path 113 for transporting the substrate 9 in a direction opposite to the first partial transport path 111 from an end point of the second partial transport path 112 are provided. By using the area between the path 111 and the third partial transport path 113 (that is, the area surrounded by the transport path 11) as the work area 10, the substantial occupied floor area of the electronic component mounting system 1 is reduced. Is realized.
[0026]
Further, the transport path 11 is bent twice to the same side to make the electronic component mounting system 1 compact, so that the moving range of the worker 90 can be reduced, and the working efficiency of the worker 90 can be improved. Is done.
[0027]
FIG. 2 is a plan view showing the electronic component mounting system 1 according to the second embodiment. In the electronic component mounting system 1 shown in FIG. 2, electronic components are mounted on a small substrate 9 used for manufacturing a portable information terminal or the like.
[0028]
The electronic component mounting system 1 has a printing device 13, a mounting device 14a, a small reflow device 17a, and an inspection device 18a arranged around the central work area 10. Each device is not connected, and the transfer of the substrate 9 between the devices is performed by an operator 90. A transport path is provided in each device in a direction substantially along a circumference centered on the work area 10, and the operator 9 places the substrate 9 on the take-in position 31 of each device so that the substrate 9 is transferred. The substrate 9 is taken into the apparatus and processed, and the processed substrate 9 is discharged to the discharge position 32. The discharge position 32 and the take-in position 31 are adjacent to each other between the apparatuses, and the operator 90 transports the substrate 9 from the discharge position 32 to the take-in position 31 of the next apparatus.
[0029]
In FIG. 2, in order to improve the work efficiency of the worker 90, a cart 95 on which a tray or a component cassette for electronic components supplied to the mounting device 14a is placed, and the substrate 9 before processing are stored. The cart 96 on which the storage device 91 and the storage device 92 for storing the mounted board 9 are also shown is shown in the case where they are arranged on the circumference where the respective devices are arranged.
[0030]
When the electronic components are mounted on the board 9, first, the operator 90 takes out the board 9 from the container 91, places the board 9 on the take-in position 31 of the printing device 13, and places the solder paste on the printing device 13. The application is performed, and the substrate 9 is discharged to the discharge position 32. The operator 90 transports the board 9 by hand from the discharge position 32 of the printing device 13 to the take-in position 31 of the mounting device 14a, and the mounting device 14a mounts the electronic component on the solder on the substrate 9. The mounting device 14a is a device that can mount various types of electronic components required on the substrate 9.
[0031]
The board 9 after the mounting of the electronic components is discharged to the discharge position 32 of the mounting device 14a, and the operator 90 transfers the board 9 to the take-in position 31 of the reflow device 17a. The substrate 9 is taken into the reflow device 17a, subjected to reflow processing, and discharged to the discharge position 32. The substrate 9 is further transferred by the operator 90 to the take-in position 31 of the inspection device 18a, and when the final appearance inspection is performed by the inspection device 18a, the substrate 9 is discharged to the discharge position 32 and the worker 90 stores the substrate 9 in the storage device. 92.
[0032]
Here, in the electronic component mounting system 1, the work related to the mounting by the worker 90 and the supply of the components can be performed from the work area 10. That is, the operation panel 21 of each device is provided so as to face the work area 10 side, and the intake position 31 and the discharge position 32 of each device are set to positions accessible from the work area 10 side. Further, the supply of materials and components to the printing device 13 and the mounting device 14a is performed from the work area 10 side.
[0033]
Accordingly, in the electronic component mounting system 1, it is necessary for the operator 90 to move out of the work area 10 when setting of each device is changed when the type of the substrate 9 is changed, and when supplying materials and components. And work efficiency is improved. Further, since the moving range of the worker 90 can be reduced, the occupied floor area of the electronic component mounting system 1 can be substantially reduced.
[0034]
FIG. 3 is a plan view showing an electronic component mounting system 1 according to the third embodiment. The electronic component mounting system 1 shown in FIG. 3 is a system of a scale between the first embodiment and the second embodiment.
[0035]
In the electronic component mounting system 1, a printing device 13, a high-speed mounting device 14, a multifunctional mounting device 16, a reflow device 17, and an inspection device 18 are arranged around a central work area 10, as in the second embodiment. . The printing device 13 and the plurality of high-speed mounting devices 14 are connected, and the plurality of multi-function mounting devices 16 are also connected. The transport path of the substrate 9 in each device or group of devices extends approximately radially around the work area 10, and the end of the transport path in the device or group of devices except the reflow device 17 on the work area 10 side is the substrate 9. Is a delivery position 35 at which take-in and discharge are performed.
[0036]
FIG. 4 is a front view showing the transport path in the reflow device 17 (the left side is the work area 10 side). The reflow device 17 has an upper transport path 171 and a lower transport path 172, and the end of the transport path 171 on the work area 10 side is a take-in position 31 for the substrate 9. The end on the side is a discharge position 32 of the substrate 9. When the substrate 9 is placed at the take-in position 31, the substrate 9 is processed by the reflow processing unit 174 while being transported along the transport path 171 and is moved to the lower transport path 172 by the elevating mechanism 173 and transported. The paper is conveyed on the path 172 and discharged to the discharge position 32.
[0037]
By providing the transfer path in a substantially U-shape in the reflow device 17 as described above, the take-in position 31 and the discharge position 32 of the substrate 9 are positioned on the work area 10 side, and the plurality of substrates 9 are transferred to the reflow device 17. Can be conveyed continuously. Furthermore, since the intake position 31 and the discharge position 32 are vertically arranged in the reflow device 17, the occupied floor area of the reflow device 17 can be reduced.
[0038]
On the other hand, another apparatus or a group of apparatuses has only one horizontal transport path, and the substrate 9 is taken in and processed, then transported in the reverse direction on the transport path, and discharged to the delivery position 35.
[0039]
The specific operation and work of the electronic component mounting system 1 are as follows. First, the substrate 9 is taken in from the delivery position 35 of the printing device 13 and sent to the high-speed mounting device 14 as it is, so that solder is Electronic components are mounted. Then, the substrate 9 returns on the transport path and is discharged to the delivery position 35. The operator 90 transfers the substrate 9 to the delivery position 35 of the multi-function mounting device 16, and the substrate 9 is taken into the device from the delivery position 35 to mount a large-sized electronic component. Is discharged.
[0040]
Next, the operator 90 transfers the substrate 9 to the take-in position 31 of the reflow device 17, and the substrate 9 is subjected to reflow processing while being transported along the transport path 171 shown in FIG. To the discharge position 32. The operator 90 transfers the substrate 9 from the discharge position 32 to the delivery position 35 of the inspection device 18, and after the appearance inspection is performed, is discharged to the delivery position 35. Finally, the operator 90 transports the board 9 from the delivery position 35 of the inspection device 18 to a predetermined location, and the mounting of the electronic components on one board 9 is completed.
[0041]
In the electronic component mounting system 1 according to the third embodiment, all positions related to delivery of the substrate 9 to the device or the device group are provided so as to face the work area 10. Therefore, even if the electronic component mounting system 1 is relatively large, the work by the worker 90 can be efficiently performed in the central work area 10. The operation panel 21 of each device or group of devices is also provided so as to face the work area 10 side, and various operations can be performed from the work area 10 side.
[0042]
Although the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and various modifications are possible.
[0043]
For example, the substrate 9 processed by the electronic component mounting system 1 is not only a plate-shaped printed wiring board formed of phenol resin or glass epoxy resin, but also a film-shaped wiring board or a wiring board formed of ceramic. There may be.
[0044]
Further, in the above-described embodiment, the electronic component is mounted using solder, but the present invention can also be applied to a system in which mounting is performed by another method. For example, the electronic components may be mounted by using an anisotropic conductive resin or by a method of directly joining metals.
[0045]
In the first embodiment, the substrate 9 is transported along the conveyor-like transport path 11, but the substrate 9 may be transported by a transport robot provided in each device. Further, the transport path 11 does not need to be exactly U-shaped, and may be, for example, substantially U-shaped. Further, the transport path may be a substantially U-shaped transport path in a vertical plane (that is, a transport path in which an outward path and a return path are two steps vertically).
[0046]
Further, in each of the above embodiments, maintenance work or the like for each device may be enabled from the work area 10 side.
[0047]
In the third embodiment, a substantially U-shaped conveyance path may be provided in a device or a group of devices other than the reflow device 17, and furthermore, all the take-in positions and the discharge positions may be arranged vertically. .
[0048]
【The invention's effect】
According to the present invention, the work efficiency of a worker in the electronic component mounting system can be improved.
[Brief description of the drawings]
FIG. 1 is a plan view showing an electronic component mounting system according to a first embodiment. FIG. 2 is a plan view showing an electronic component mounting system according to a second embodiment. FIG. 3 is a third embodiment. FIG. 4 is a plan view showing an electronic component mounting system according to the present invention. FIG. 4 is a front view showing a reflow device.
REFERENCE SIGNS LIST 1 electronic component mounting system 9 board 10 work area 11 transport path 12 loader 13 printing device 14 high-speed mounting device 14a mounting device 15, 18, 18a inspection device 16 multifunctional mounting device 17, 17a reflow device 19 unloader 21 operation panel 31 capture Position 32 Discharge position 35 Delivery position 111 First partial transport path 112 Second partial transport path 113 Third partial transport path 171, 172 Transport path

Claims (9)

An electronic component mounting system for mounting an electronic component on a substrate,
A loader that supplies a substrate to a transport path;
An unloader for collecting a substrate from the transfer path;
A plurality of processing units arranged along the transport path, performing a series of steps related to the mounting of electronic components,
With
The transport path,
A first partial transport path for transporting the substrate from the loader in a predetermined direction;
A second partial transport path for transporting the substrate in a direction substantially perpendicular from an end point of the first partial transport path;
A third partial transport path that transports the substrate in a direction opposite to the predetermined direction from an end point of the second partial transport path;
An electronic component mounting system comprising: The electronic component mounting system according to claim 1,
An electronic component mounting system, wherein an operation panel of a processing unit arranged along the first partial conveyance path and an operation panel of a processing unit arranged along the third partial conveyance path face each other. The electronic component mounting system according to claim 1 or 2,
An electronic component mounting system, wherein an area between the first partial transport path and the third partial transport path is a work area of an operator for the plurality of processing units. An electronic component mounting system for mounting an electronic component on a substrate,
Equipped with a plurality of processing units for performing a series of steps related to the mounting of electronic components,
An electronic component mounting system, wherein the plurality of processing units are arranged around a predetermined region, and a predetermined operation performed by an operator on the plurality of processing units is performed from the predetermined region side. The electronic component mounting system according to claim 4, wherein
The electronic component mounting system, wherein the plurality of processing units include a plurality of operation panels facing the predetermined area. The electronic component mounting system according to claim 4, wherein:
An electronic component mounting system, wherein component supply or material supply to the plurality of processing units is performed from the predetermined area side. The electronic component mounting system according to claim 4, wherein:
An electronic component mounting system, wherein loading and unloading of a substrate from and to each of the plurality of processing units is performed from the predetermined area side. The electronic component mounting system according to claim 7,
An electronic component mounting system, wherein at least one of the plurality of processing units has a substantially U-shaped transfer path through which a substrate is transferred. The electronic component mounting system according to claim 8, wherein:
An electronic component mounting system, wherein a take-in position and a discharge position are vertically arranged in the substantially U-shaped transport path.

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