JP2009277967A - Electronic component mounting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To meet a demand to eliminate the need for an intermediate stock of printed wiring boards being partially-fabricated items by making an electronic component mounting device compact and incorporating the device in a production line for final finished products. <P>SOLUTION: The electronic component mounting device for mounting an electronic component on the board includes a setting tool 20 which sets the board at a prescribed working position 14, a conveying mechanism 40 which moves the setting tool reciprocally from the working position 14 to a mounting machine 60 for mounting the electronic component on the board via a printer 50 printing solder on the board, a conveyor 72 capable of passing in a reflow furnace 70 to move toward the working position 14, and a transfer machine capable of moving the board mounted with the electronic component by the mounting machine 60 onto the conveyor 72 of the reflow furnace from the setting tool 20. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an electronic component mounting apparatus of a type in which solder is printed on a wiring pattern of a substrate, and a substrate on which electronic components are mounted on the solder is heated in a reflow furnace to perform soldering.

As this type of mounting apparatus (system), for example, the technique disclosed in Patent Document 1 is already known. In this technique, a substrate feeder, a printing machine, a mounting machine, a reflow furnace, and a substrate storage machine are arranged in this order along a continuous line on a conveyor that moves in one direction. The board supplied to the line by the board feeder is carried to the printing machine, and after paste-like solder is printed on the wiring pattern, the electronic component is mounted on the solder in the mounting machine. The board on which the electronic components are mounted is heated in a reflow furnace and soldered, and then the board is taken out of the line and stored in a board storage machine.
JP 2007-88023 A

  In the technique disclosed in Patent Document 1, solder printing processing, electronic component mounting processing, and heating processing in a reflow furnace are sequentially performed along a line that conveys a substrate in one direction. For this reason, the distance from the board supply machine at the start of the line to the board storage at the end of the line becomes long, and the entire mounting apparatus (system) becomes large. Therefore, it is difficult to incorporate this mounting system in a line for assembling a substrate on which electronic components are mounted to complete a predetermined product, and an intermediate stock of substrates that are semi-finished products is required.

  The present invention is intended to solve such a problem, and its purpose is to reduce the size of the electronic component mounting apparatus and to incorporate this apparatus into the production line of the final finished product. It is to realize a demand such as eliminating the need for intermediate stock of a certain printed wiring board.

The present invention is for achieving the above object, and is configured as follows.
In the first invention, solder is printed on a wiring pattern for connecting an electronic component to the substrate, and the substrate on which the electronic component is mounted is heated in a reflow furnace to melt the solder and perform soldering. An electronic component mounting apparatus, a set jig capable of setting a substrate at a predetermined position at a predetermined work position, and a printing machine that prints solder on the substrate from the work position. It is arranged in parallel along the reciprocating movement direction of the set jig and reciprocating between the mounting machine for mounting electronic components on the machine, and it can move toward the working position through the reflow furnace A conveyor and a transfer machine capable of transferring a substrate on which electronic components are mounted by a mounting machine from a setting jig onto a conveyor of a reflow furnace are provided.

  In this way, after the set jig on which the substrate is set at the predetermined work position is moved to the electronic component mounting machine through the solder printing machine, the conveyor moves in the direction reverse to the previous moving direction. By moving the substrate upward and passing through the reflow furnace, the substrate on which the electronic component has been mounted is returned to the original working position. Therefore, the mounting device becomes smaller, and it is possible to incorporate the mounting device in the line for assembling the board to complete the product, and the need for intermediate stock of printed circuit boards, which are semi-finished products, is eliminated. Can be deployed.

According to a second aspect of the present invention, in the first aspect, the solder printer includes a masking sheet that supplies paste solder on the wiring pattern of the substrate, and a squeegee that is movable in contact with the surface of the masking sheet. The squeegee is set in a hollow shape in which only a portion in contact with the surface of the masking sheet is opened.
Thereby, even when the paste-like solder is moving the squeegee, it does not protrude from the inside thereof, and foreign matter can be prevented from entering the solder.

According to a third invention, in the second invention, the setting jig includes a recess into which the substrate is fitted, and is configured to be able to move up and down with respect to the transport mechanism, and is set in a printing process by a printing press. By raising the jig, the surface of the substrate can be bonded to the masking sheet. Further, prior to the raising of the setting jig in the printing process, the positioning pins are inserted into the holes of the substrate set in the recesses.
As a result, the substrate is accurately positioned on the set jig, and there is no variation in solder printing or electronic component mounting on the substrate, and these are always performed accurately.

According to a fourth invention, in the first, second, or third invention, the reflow furnace is configured to be supplied with hot air from an air heater and passes through the hot air supply port and the furnace. A diffusion plate is arranged between the conveyor.
In this configuration, hot air is diffused by the diffusion plate, and the substrate can be efficiently heated by far infrared rays radiated from the diffusion plate toward the conveyor. Therefore, power saving is achieved and the reflow furnace is compact. Can be realized.

Hereinafter, the best mode for carrying out the present invention will be described with reference to the drawings.
As shown in FIGS. 1 to 3, an electronic component mounting apparatus for a printed wiring board includes a set jig 20 for setting a substrate, a solder printing machine 50, and an electronic component on a base 12 supported by a frame 10. Mounting machine 60 and reflow furnace 70 are arranged respectively. The mounting device 60 also serves as a substrate transfer device, as will be described later. Further, in this mounting apparatus, the front side of FIG. 1 or the left side of FIG. 3 is a work position 14, and the space, particularly the width space in the left-right direction of FIG. 1, is set to about one worker.
As apparent from the plan view of FIG. 1, the setting jig 20 and the printing machine 50 are arranged on the right side of the drawing, and the reflow furnace 70 is arranged on the left side of the drawing. The mounting machine 60 also serving as a transfer machine is disposed on the opposite side of the work position 14.

First, the configuration of the setting jig 20 will be described.
As is clear from FIGS. 4 to 6, the setting jig 20 includes a setting plate 21 supported by a lifting member 44 that is lifted and lowered by a cylinder 42 of a transport mechanism 40 described later. On the upper surface of the set plate 21, there is formed a rectangular recess 21a for setting in a state where a substrate (not shown) is fitted. At two positions on the diagonal line in the recess 21a, through holes 21b penetrating between the upper and lower surfaces of the set plate 21 are formed.
The cylinder base 32 of the elevator 30 shown in FIGS. 5 and 6 is supported by the lifting member 44 of the transport mechanism 40. A cylinder 34 is assembled upward on the lower surface side of the cylinder base 32, and its rod 36 is coupled to an elevating plate 38 positioned above the cylinder base 32. Therefore, the elevating plate 38 moves up and down by the drive control of the cylinder 34.

The floating member 23 located between the set plate 21 and the elevating plate 38 is supported in a floating state by a spring 25 interposed between the floating member 23 and the elevating plate 38. A flange 23 a formed on the lower outer surface of the floating member 23 is engaged with a stopper 26 fixed to the elevating plate 38 (FIG. 6) and is pushed up by the elastic force of the spring 25. The position of 23 is regulated.
Moreover, the upper end part of the guide rod 24 extended below is fixed to two places on the diagonal of the set plate 21, respectively. These guide rods 24 are inserted through the floating member 23 and the lifting plate 38 of the elevator 30. As a result, the floating member 23 and the lifting plate 38 are lifted and lowered while being guided by the guide rods 24.

The floating member 23 is formed with through holes 23b penetrating between both upper and lower surfaces coaxially with both through holes 21b of the set plate 21. Pipe-shaped positioning pins 23c are respectively inserted in the through holes 23b in an inserted state, and the base ends of the positioning pins 23c are fixed to the floating member 23 (FIG. 6). The tip portions of the positioning pins 23c are inserted into the corresponding through holes 21b of the set plate 21, and the tip portions are divided into four in the circumferential direction so that the diameter can be expanded. The distal end of the positioning pin 23c is a small diameter portion, and this portion can be inserted into the hole of the substrate set in the recess 21a of the set plate 21 even if the substrate set is slightly shifted. ing.
In both positioning pins 23c, taper pins 27 whose tip portions are tapered cone surfaces are respectively inserted. The lower end portions of these taper pins 27 are fixed to the lifting plate 38.

When the lift plate 38 is lifted from the fixed position shown in FIG. 6 by driving control of the cylinder 34 in the lift 30, the floating member 23 is pushed up by the elastic force of the spring 25 relative to the lift plate 38 according to the lift. That is, the positioning pin 23c fixed to the floating member 23 and the taper pin 27 fixed to the elevating plate 38 rise while maintaining the relative positional relationship shown in FIG. Therefore, the positioning pin 23c rises prior to the taper pin 27, and the small diameter portion thereof is inserted into the hole of the substrate.
When the upper surface of the floating member 23 comes into contact with the lower surface of the set plate 21 due to the lifting of the lift plate 38, only the lift plate 38 and the taper pin 27 are lifted while compressing the spring 25 thereafter. Along with this, the taper pin 27 rises relative to the positioning pin 23c, and the diameter of the tip portion of the positioning pin 23c is expanded by the tapered cone surface of the taper pin 27. As a result, the gap between the small-diameter portion of the positioning pin 23c and the hole of the substrate is filled, and the substrate is accurately positioned in the recess 21a of the set plate 21.

  The transport mechanism 40 is disposed on the base 12 of the mounting apparatus as shown in FIGS. The cylinder 42 and the elevating member 44 of the transport mechanism 40 are configured to reciprocate between the work position 14 and the mounting machine 60 on the base 12. As described above, the setting jig 20 and the elevator 30 are supported on the lifting member 44 of the transport mechanism 40. Therefore, the transport mechanism 40 can reciprocate the setting jig 20 (including the elevator 30) from the board setting position A indicated by the solid line to the electronic component mounting position C indicated by the phantom line in FIG. . A solder printing position B indicated by an imaginary line in FIG. 1 is approximately in the middle between the set position A and the mounting position C.

Next, the printing press 50 will be described.
As is clear from FIGS. 7 and 8, the support base 51 of the printing press 50 is disposed on the base 12 of the mounting apparatus. The support base 51 is located above the setting jig 20 and the transport mechanism 40 (FIGS. 2 and 3), and a sheet frame 52 with a masking sheet 53 of the printing press 50 is attached to the front end side thereof. ing. The masking sheet 53 is for supplying (printing) paste solder on the wiring pattern of the substrate.
A drive mechanism 54 of the printing press 50 is disposed on the support base 51, and an arm 55a extending upward of the masking sheet 53 is attached to a moving member 55 that moves by driving control thereof. An elevator 56 is provided at the end of the arm 55a, and a squeegee 58 of the printing press 50 is coupled to the lower end of the spindle. The moving member 55 of the drive mechanism 54 reciprocates in the same direction as the cylinder 42 of the transport mechanism 40 in the setting jig 20, whereby the squeegee 58 moves on the masking sheet 53 with the solid line position and the virtual line position in FIG. Reciprocate between.

As shown in FIG. 9 and FIG. 10, the squeegee 58 has a hollow shape inside, and has a “bowl shape” in which the lower surface in contact with the masking sheet 53 is opened. The squeegee 58 is an integrally molded product made of urethane resin or the like, and the hollow interior is hermetically sealed by bringing its lower surface into contact with the masking sheet 53.
The squeegee 58 can be moved up and down by an elevator 56. Therefore, as shown in FIG. 8, in the state where the squeegee 58 is raised, paste-like solder can be replenished on the masking sheet 53. Then, by lowering the squeegee 58, the lower surface can be brought into close contact with the surface of the masking sheet 53 in a state where the solder is taken into the hollow interior.

Next, the mounting machine 60 will be described.
The mounting machine 60 is mainly composed of the robot arm 61 shown in FIGS. 1 to 3 disposed on the base 12. The robot arm 61 can be driven and controlled to turn around the axis 62 shown in FIG. 1, and can also drive and control the spindle 63 shown in FIG. 3 in the vertical direction. A component chuck 64 is attached to the lower end portion of the spindle 63, and the component chuck 64 can control to hold or release the electronic component (not shown). A component stocker 68 for supplying electronic components to the mounting machine 60 is disposed on the base 12 in the vicinity of the robot arm 61.
As described above, the mounting machine 60 also serves as a transfer machine for transferring the substrate from the setting jig 20 to the reflow furnace 70. That is, the robot arm 61 includes a spindle 65 for a transfer machine as shown in FIG. 3, and the spindle 65 can be driven and controlled in the vertical direction. A substrate chuck 66 is attached to the lower end of the spindle 65, and the substrate chuck 66 can be controlled to grip the substrate or release the grip.

Next, the reflow furnace 70 will be described.
As is clear from FIGS. 11 and 12, a reflow furnace 70 is disposed on the base 12 of the mounting apparatus. The reflow furnace 70 is located on the opposite side (the left side in FIGS. 1 and 2) of the setting jig 20 and the printing press 50 as described above. Further, the conveyor 72 of the reflow furnace 70 is parallel to the reciprocating direction of the set jig 20 and from the position facing the mounting position C of the set jig 20 indicated by the phantom line in FIG. It is arranged over a range up to a position passing through the work position 14. The conveyor 72 is configured to continuously move from the side facing the mounting position C toward the work position 14.
A plurality of air heaters 74 are connected to the top wall of the reflow furnace 70 along the moving direction of the conveyor 72, and hot air is supplied from the air heaters 74 to the inside of the reflow furnace 70. Inside the upper surface wall of the reflow furnace 70, a diffusion plate 78 that faces the supply port 76 of hot air from each air heater 74 is provided. Therefore, the hot air blown out from each supply port 76 is diffused into the furnace by the diffusion plate 78, and far infrared rays are radiated from the diffusion plate 78 toward the conveyor 72.

The operation of mounting electronic components on the printed wiring board using the apparatus configured as described above will be described.
First, an operator standing at the work position 14 of the apparatus sets and inserts a substrate into the recess 21a of the set plate 21 in the set jig 20 waiting at the set position A in FIG. Turn on (not shown). As a result, the lift plate 38 is raised by the cylinder 34 of the lift 30 as described above, the tip of the positioning pin 23c is inserted into the hole of the substrate set in the recess 21a of the set plate 21, and the diameter thereof is expanded. Is done. As a result, the substrate is accurately positioned with respect to the set plate 21.
In parallel with the operation of the elevator 30, the transport mechanism 40 moves the setting jig 20 from the setting position A to the printing position B in FIG. In this printing position B, the lifting member 44 is raised by the cylinder 42 of the transport mechanism 40, and the set plate 21 makes the surface of the substrate contact the lower surface of the masking sheet 53 of the printing machine 50 and holds it in that state.

Here, the drive mechanism 54 of the printing press 50 is driven and controlled, whereby the squeegee 58 reciprocates on the masking sheet 53 between the solid line position and the virtual line position in FIG. Thereby, the paste-like solder in the hollow interior of the squeegee 58 is printed on the wiring pattern of the substrate. Then, after the drive mechanism 54 of the printing press 50 is stopped, the lifting member 44 is lowered by the cylinder 42 of the transport mechanism 40, whereby the set plate 21 is lowered and the surface of the substrate is separated from the lower surface of the masking sheet 53. However, the tip of the positioning pin 23c is still inserted into the hole of the substrate, and the positioning of the substrate with respect to the set plate 21 is maintained.
After the set plate 21 is lowered to the original position, the set jig 20 is moved again from the printing position B to the mounting position C in FIG.

Solder is printed on the predetermined wiring pattern by the printing machine 50 on the surface of the substrate carried to the mounting position C by the movement of the setting jig 20. Here, by the drive control of the mounting machine 60, the robot arm 61 pivots around the axis 62 shown in FIG. 1, the spindle 63 shown in FIG. 3 moves up and down, and the component chuck 64 mounted on the lower end thereof. By repeating the operation, the electronic components in the component stocker 68 are mounted on the solder of the board.
As described above, the mounting machine 60 also serves as a transfer machine. When the mounting of the electronic components necessary on the solder of the board is completed by the function as the mounting machine 60, the function is switched to the function as the transfer machine. That is, the substrate set on the set plate 21 of the set jig 20 is moved by the turning operation of the robot arm 61, the vertical movement of the spindle 65 shown in FIG. 3, and the operation of the substrate chuck 66 attached to the lower end thereof. Then, it is transferred onto the conveyor 72 of the reflow furnace 70. At this timing, the set jig 20 is returned to the set position A in FIG.

The conveyor 72 of the reflow furnace 70 is continuously moved toward the work position 14 as described above. Accordingly, the substrate transferred onto the conveyor 72 passes through the reflow furnace 70 and is carried to a position facing the working position 14. The substrate is heated by passing through the reflow furnace 70, and the solder printed by the printer 50 is melted to be soldered to the electronic component. The mounting board sent out from the reflow furnace 70 is collected from the conveyor 72 at the work position 14.
Inside the reflow furnace 70, the hot air supplied from the supply port 76 of each air heater 74 is uniformly diffused into the furnace by the diffusion plate 78 as described above, and from the diffusion plate 78 to the substrate on the conveyor 72. Far infrared rays are emitted toward Therefore, the substrate can be efficiently heated, and the reflow furnace 70 can be reduced in size and power can be saved.

  Thus, in the electronic component mounting apparatus according to the present embodiment, solder printing and electronic component mounting are performed while the substrate set on the set plate 21 of the setting jig 20 is transferred in one direction at one work position 14. I do. Thereafter, the board transfer direction can be reversed and soldering can be performed in a reflow furnace, and the board on which electronic components have been mounted can be returned to the original working position 14. Therefore, unlike conventional systems that perform solder printing, electronic component mounting, and soldering by heating in a reflow furnace along a continuous line on a conveyor that moves in one direction as before, the mounting device itself Becomes small and compact. As a result, it is possible to incorporate a mounting device into a line for completing a product by incorporating a board on which electronic components are mounted, and respond to demands such as eliminating the need for semi-finished printed wiring boards. can do.

The top view showing the electronic component mounting apparatus. The front view of FIG. The right view of FIG. The top view showing the setting jig. The front view showing the setting jig. Sectional drawing showing the setting jig. The top view showing a printing machine. The front view showing a printing machine. The top view showing the squeegee of the printing press. The front view showing the squeegee of the printing press. The top view showing the reflow furnace. Sectional drawing which represented the reflow furnace from the front side.

Explanation of symbols

14 working position 20 setting jig 30 lift mechanism 40 transport mechanism 50 printing machine 60 mounting machine 70 reflow furnace 72 conveyor

Claims (4)

This is an electronic component mounting device that performs soldering by printing solder on a wiring pattern that connects electronic components to a board, and then heating the board on which this electronic component is mounted in a reflow furnace to melt the solder. And
A mounting jig that can set a substrate in a predetermined position at a predetermined work position, and a mounting machine that mounts electronic components on the board through a printing machine that prints solder on the board from the working position. A transport mechanism that reciprocally moves between the conveyor, a conveyor that is arranged in parallel along the reciprocating direction of the set jig, and that can move through the reflow furnace toward the working position, and an electronic component on the mounting machine. An electronic component mounting apparatus provided with a transfer machine capable of transferring a substrate mounted with a transfer from a set jig onto a conveyor of a reflow furnace. An electronic component mounting apparatus according to claim 1,
The solder printing machine includes a masking sheet that supplies paste solder on the wiring pattern of the substrate, and a squeegee that can move in contact with the surface of the masking sheet. An electronic component mounting apparatus that is set in a hollow shape in which only a contact portion is open. An electronic component mounting apparatus according to claim 2,
The setting jig is provided with a recess for fitting the substrate, and is configured to be able to be raised and lowered with respect to the transport mechanism. By raising the setting jig in a printing process in a printing machine, the surface of the substrate is Electronic component mounting that can be joined to the masking sheet and that the positioning pins are inserted into the holes in the board set in the recesses prior to the raising of the set jig in this printing process apparatus. The electronic component mounting apparatus according to claim 1, 2, or 3,
An electronic component mounting apparatus in which hot air from an air heater is supplied inside the reflow furnace, and a diffusion plate is disposed between the hot air supply port and a conveyor passing through the furnace .

Images