CN117858371A - High-precision ceramic-based PCB production process - Google Patents

Abstract

The invention relates to a production process of a high-precision ceramic-based PCB (printed Circuit Board), which comprises a lower supporting mechanism and a surface mounting mechanism, wherein the lower supporting mechanism comprises a conveying component arranged at the lower end of a circuit board assembly and a supporting component arranged on the conveying component and used for supporting electric components, after the circuit board assembly is turned over, the supporting component is driven by the conveying component to rise and support the electric components arranged at the lower end of the circuit board assembly, so that the electric components at the lower end of the circuit board assembly cannot loosen and fall off with solder paste in the surface mounting and welding processes of the circuit board assembly, the stability of connection between the electric components and the circuit board is ensured, and the problem that the electric components with larger part of mass on the other surface are easy to loosen with the solder paste due to the influence of gravity when the electric components on one surface of the traditional surface mounting machine are attached is solved, and the subsequent welding quality is affected.

Description

High-precision ceramic-based PCB production process

Technical Field

The invention relates to the technical field of PCB boards, in particular to a production process of a high-precision ceramic-based PCB board.

Background

With the rapid development of fields such as high-speed rail, new energy automobiles, wind power generation, robots, IGBT (insulated gate bipolar transistor) for 5G base stations, LD/LED (light-emitting diode) heat dissipation, laser systems, hybrid integrated circuits and the like in recent years, the market demand for high-heat-conductivity ceramic substrates is huge. Because the manufacturing threshold is higher, the damage rate in the production process is higher due to the material characteristics, and some main equipment can only be introduced from abroad, PCB manufacturers in the field occupy less area at present, and see the future development prospect, and I develop the new market product requirement; the traditional double-sided PCB board generally uses the chip mounter when carrying out the paster, after passing through the solder paste with electrical components and bonding on the PCB board, transports the inside that the reflow soldering stove was carried out reflow soldering with the PCB board again.

Patent document CN115070151a discloses a printed circuit board welded SMT reflow soldering machine, especially, relate to reflow soldering machine technical field, including the fuselage, the air pump is installed to the fuselage upper end, the inside top of fuselage is provided with a plurality of jet equipment that is left and right arranged, the inside bottom of fuselage just is located the jet equipment below and rotates and be connected with a pair of drive wheel that is left and right distribution, two drive wheel front ends are provided with empty box, motor two is installed to two empty box front ends, two inside upper and lower both sides of empty box are provided with driver plate and sheave respectively, sensor one aligns with sensor two and triggers motor one and operates, drive the conveyer belt on left and right sides under motor one's operation and according to each other for opposite direction transmission, the PCB circuit board is along with the conveyer belt transmission gradually the downwardly moving to place inside the box, the electro-magnet makes the centre gripping piece with the PCB circuit board centre gripping firm.

However, in the actual use process, the inventor finds that when the chip mounter sticks to one of the electrical components, the electrical component with larger part of mass on the other surface is easy to loosen with solder paste due to the influence of gravity, so that the subsequent welding quality is influenced; meanwhile, in the process of reflow soldering of the circuit board, the electrical components and the solder paste are heated at the same time, so that the electrical components are easy to damage.

Disclosure of Invention

The invention aims at overcoming the defects of the prior art, by arranging the special structure of the PCB, and utilizing the mechanical structure to finish the primary assembly work of the double-sided electric components on the same station during the manufacturing and assembly, and stably welding the double-sided electric components to integrate the double-sided electric components, the invention solves the problem that the electric components with larger part of mass on the other side are easy to loosen with solder paste due to the influence of gravity when the traditional chip mounter is used for pasting the electric components on one side, thereby influencing the subsequent welding quality.

Aiming at the technical problems, the technical scheme is as follows:

a high-precision ceramic-based PCB production process comprises the following steps:

s1: assembling the PCB and the rotating piece, and assembling the punched PCB and the rotating piece and transferring the punched PCB and the punched rotating piece to a transmission assembly;

s2: assembling the PCB and the electrical components, and completing the primary assembly work of the double-sided electrical components of the PCB under the cooperation of the surface mounting device and the transmission assembly;

s3: the lower supporting mechanism works and supports the electric elements at the lower end of the circuit board assembly in the step S2;

s4: and (3) welding the circuit board assembly, wherein the circuit board assembly enters the welding mechanism and is matched with the upper supporting mechanism and the lower supporting mechanism to finish the welding operation of the circuit board assembly.

The invention also discloses a high-precision ceramic-based PCB production device which is matched with the high-precision ceramic-based PCB production process, comprising:

the surface mounting mechanism can realize the turn-over work of the circuit board assembly in the process of transferring the circuit board assembly, and the lower end of the surface mounting mechanism is also provided with a lower supporting mechanism which can support the electric appliance element arranged at the lower end of the circuit board assembly after the circuit board assembly is turned over;

the rear end of the patch mechanism is also provided with a welding mechanism, the upper end of the welding mechanism is provided with an upper supporting mechanism which is arranged opposite to the lower supporting mechanism, and the upper supporting mechanism and the lower supporting mechanism are mutually matched in the welding mechanism so as to realize the welding work of the circuit board assembly;

the circuit board assembly consists of a PCB, rotating parts symmetrically arranged on two sides of the PCB and used for driving the PCB to rotate, and a plurality of electric elements arranged on the PCB;

the lower supporting mechanism comprises a conveying component arranged at the lower end of the circuit board assembly and a supporting component arranged on the conveying component and used for supporting the electric elements.

Preferably, the supporting component comprises an outer box body arranged on the conveying component, a lifting plate arranged in the outer box body in a sliding manner, supporting pieces connected through a plurality of buffer springs and an inner box body fixedly arranged in the outer box body;

the supporting pieces are arranged corresponding to the circuit board assembly arrays and comprise supporting rods connected with the buffer springs, hollow tubes connected with the supporting rods through a plurality of connecting rods and pressing plates connected to one sides of the hollow tubes.

Preferably, lifting rods are further arranged on two sides of the lifting plate, and lifting guide rails are arranged at positions corresponding to the lifting rods on the conveying assembly.

Preferably, the welding mechanism comprises a heating zone and a cooling zone;

the outer box body and the inner box body form an air supply cavity at the position corresponding to the connecting rod, the outer side of the air supply cavity is connected with an air supply pipeline through a control valve, the outer side of the inner box body is connected with an air suction pipeline through a control valve, and the air supply pipeline and the air suction pipeline can be communicated with the heating area or the cooling area.

Preferably, the PCB is provided with a plurality of positioning holes;

the rotating piece comprises a sliding block used for supporting the PCB, a rotating block which is arranged in the sliding block and sleeved with a rotating gear outside, a clamping plate which is fixedly arranged on one side of the rotating block and used for limiting and supporting the PCB, and a connecting piece used for fixedly connecting the clamping plate and the PCB, wherein the clamping plate is provided with a through hole at a position corresponding to the positioning hole.

Preferably, one side of the sliding block is further provided with a limiting unit for limiting rotation of the rotating gear, the limiting unit comprises a reset spring arranged in the sliding block, a limiting rod arranged on the outer side of the reset spring and a guide block arranged at the upper end of the limiting rod, and the rotating gear is provided with two limiting holes which are oppositely arranged at positions corresponding to the limiting rod.

Preferably, the patch mechanism comprises a workbench, a transmission component arranged on the workbench and used for transferring the circuit board assembly, and a patch device arranged on the transmission component and used for assembling various electrical components on the PCB.

Preferably, the transmission assembly comprises two transmission guide rails which are arranged oppositely and used for driving the sliding block to move, a guide rail arranged at a position corresponding to the guide block and a rotating rack matched with the rotating gear.

Preferably, the front end of the patch mechanism is further provided with an assembling mechanism, and the assembling mechanism comprises a feeding component for transferring the PCB, a punching component for processing locating holes in the PCB, and a placing table for containing the PCB, wherein the placing table is convenient for assembling the PCB and a rotating piece.

The invention has the beneficial effects that:

(1) According to the invention, the lower supporting mechanism comprises the conveying component arranged at the lower end of the circuit board assembly and the supporting component arranged on the conveying component and used for supporting the electrical components, after the circuit board assembly is turned over, the supporting component is driven by the conveying component to rise and support the electrical components arranged at the lower end of the circuit board assembly, so that the electrical components at the lower end of the circuit board assembly cannot loosen and fall off with solder paste in the following process of the surface mounting and welding processing of the circuit board assembly, the stability of connection between the electrical components and the circuit board is ensured, and the problem that the electrical components with larger partial mass on the other surface are easy to loosen with the solder paste due to the influence of gravity when the electrical components on one surface are attached by the traditional surface mounting machine is solved, and the subsequent welding quality is affected;

(2) According to the invention, the upper supporting mechanism, the lower supporting mechanism and the welding mechanism are arranged, the supporting components in the upper supporting mechanism and the lower supporting mechanism comprise the outer box body, the supporting parts and the inner box body fixedly arranged in the outer box body, and the supporting parts are of hollow structures, so that when the upper supporting mechanism and the lower supporting mechanism respectively support the circuit board assembly positioned in the welding mechanism, the supporting parts which are not contacted with the electric elements are closer to the position where the solder paste is arranged, and the special structures in the supporting parts and the outer box body are utilized to convey hot air to the air supply cavity between the outer box body and the inner box body, the hot air only flows along the supporting parts which are closer to the solder paste and blows the hot air to the solder paste to be in a molten state, and redundant hot air can be discharged from the supporting parts which are contacted with the electric elements, so that the electric elements are prevented from being heated to an excessive temperature along with the solder paste, and the qualification rate of the electric elements is ensured;

(3) According to the invention, the circuit board assembly is composed of the PCB and the rotating parts symmetrically arranged on two sides of the PCB, after the surface mounting operation of the electrical components is finished on one side of the PCB by the surface mounting mechanism, the transmission assembly in the surface mounting mechanism is controlled to continuously drive the circuit board assembly to move, the rotating rack can drive the rotating gear to rotate so as to realize the turn-over operation of the PCB, then the surface mounting mechanism can carry out surface mounting of the electrical components on the other side of the PCB, the double-sided processing operation of the PCB can be realized without turning over the PCB manually or by a robot, and the surface mounting mechanism is simple in structure and convenient to use;

in conclusion, the equipment has the advantages of good product forming effect and convenience in use, and is particularly suitable for the technical field of circuit boards.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly described below, it being obvious that the drawings described below are only some embodiments of the present invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic structural diagram of a circuit board assembly.

Fig. 2 is an enlarged schematic view of the structure at a in fig. 1.

Fig. 3 is a schematic elevational view of the present invention.

Fig. 4 is a schematic overall structure of the present invention.

Fig. 5 is a schematic structural view of the patch mechanism.

Fig. 6 is a schematic structural view of the support assembly.

Fig. 7 is a schematic structural view of the support member.

Fig. 8 is a cross-sectional view of the support assembly.

FIG. 9 is a schematic view of the support assembly with the air flow inside.

Fig. 10 is a schematic view of the circuit board assembly as it works inside the soldering mechanism.

Fig. 11 is a schematic view of the structure of the lift rail in the transport assembly.

Fig. 12 is a schematic view of the circuit board assembly at the position of the mounting mechanism.

Fig. 13 is an enlarged schematic view of the structure at B in fig. 12.

Fig. 14 is a schematic structural view of the rotating member and the limiting member.

Fig. 15 is a schematic structural view of a rotary gear.

Fig. 16 is an enlarged schematic view of the structure at C in fig. 14.

Fig. 17 is a schematic view of the structure of the guide block when sliding inside the guide rail.

Fig. 18 is a schematic structural view of the assembly mechanism.

Fig. 19 is a flowchart of a high-precision ceramic-based PCB board production process.

Detailed Description

The technical solutions in the embodiments of the present invention are clearly and completely described below with reference to the accompanying drawings.

Example 1

As shown in fig. 19, a high-precision ceramic-based PCB production process includes the following steps:

s1: assembling the PCB 110 and the rotating member 120, and assembling the punched PCB 110 and the rotating member 120 and transferring the assembled PCB 110 and the punched rotating member 120 to the transmission assembly 12;

s2: the PCB 110 is assembled with the electrical components 130, and the primary assembly work of the double-sided electrical components 130 of the PCB 110 is completed under the cooperation of the surface mounting device 13 and the transmission assembly 12;

s3: the support of the circuit board assembly 100, the lower support mechanism 2 works and supports the electrical components 130 at the lower end of the circuit board assembly 100 in S2;

s4: and (3) welding the circuit board assembly 100, wherein the circuit board assembly 100 enters the welding mechanism 3 and is matched with the upper supporting mechanism 4 and the lower supporting mechanism 2 to finish the welding work of the circuit board assembly 100.

Example two

As shown in fig. 1 to 5, a high-precision ceramic-based PCB production apparatus includes:

the surface mounting mechanism 1, the surface mounting mechanism 1 can realize the turn-over work of the circuit board assembly 100 in the process of transferring the circuit board assembly 100, the lower end of the surface mounting mechanism 1 is also provided with a lower supporting mechanism 2, and after the circuit board assembly 100 finishes the turn-over, the lower supporting mechanism 2 can support the electrical components 130 arranged at the lower end of the circuit board assembly 100;

the rear end of the patch mechanism 1 is also provided with a welding mechanism 3, the upper end of the welding mechanism 3 is provided with an upper supporting mechanism 4 which is arranged opposite to the lower supporting mechanism 2, and the upper supporting mechanism 4 and the lower supporting mechanism 2 are mutually matched in the welding mechanism 3 so as to realize the welding work of the circuit board assembly 100;

the circuit board assembly 100 is composed of a PCB 110, rotating members 120 symmetrically arranged on two sides of the PCB 110 and used for driving the PCB 110 to rotate, and a plurality of electrical components 130 arranged on the PCB 110;

the lower support mechanism 2 includes a conveying assembly 21 disposed at a lower end of the circuit board assembly 100, and a support assembly 22 disposed on the conveying assembly 21 for supporting the electrical component 130.

In this embodiment, the supporting effect on the electrical component 130 in the circuit board assembly 100 is achieved by setting the patch mechanism 1 and matching with the lower supporting mechanism 2, and by setting the upper supporting mechanism 4 and matching with the lower supporting mechanism 2 and the welding mechanism 3, the heating effect of hot air on the electrical component 130 can be reduced when the circuit board is welded, so as to avoid damage to the electrical component 130.

In detail, the PCB board 110 is transferred to the pasting mechanism 1 after being matched with the rotating member 120, after the pasting mechanism 1 completes the pasting work of one surface of the electrical component 130 on the PCB board 110, the pasting mechanism 1 cooperates with the rotating member 120 to drive the PCB board 110 to rotate and turn over, so that the pasting work of the other surface of the PCB board 110 is facilitated, after the turning over of the PCB board 110 is completed, the lower supporting mechanism 2 ascends and supports the electrical component 130 at the lower end of the PCB board 110, so as to ensure the stability of connection between the electrical component 130 and the PCB board 110, then the lower supporting mechanism 2 and the circuit board assembly 100 enter the welding mechanism 3 together, the upper supporting mechanism 4 descends and presses the electrical component 130 at the upper end of the PCB board 110, and after the welding mechanism 3 works, hot air is respectively conveyed to the upper end and the lower end of the circuit board assembly 100 along the upper supporting mechanism 4 and the lower supporting mechanism 2, so as to realize the primary melting work of solder paste.

Further, as shown in fig. 6 to 11, the supporting assembly 22 includes an outer case 221 provided on the conveying assembly 21, a lifting plate 222 slidably provided inside the outer case 221, a supporting member 224 connected by a plurality of buffer springs 223, and an inner case 225 fixedly provided inside the outer case 221;

the supporting members 224 are arranged in an array corresponding to the circuit board assembly 100, and the supporting members 224 include supporting rods 2241 (solid rods) connected with the buffer springs 223, hollow tubes 2243 connected with the supporting rods 2241 through a plurality of connecting rods 2242, and pressing plates 2244 connected to one sides of the hollow tubes 2243;

the lifting plate 222 is also provided with lifting bars 226 on both sides, and the conveying assembly 21 is provided with lifting rails 211 at positions corresponding to the lifting bars 226.

In the present embodiment, the supporting effect of the circuit board assembly 100 is achieved by providing the supporting member 22 to cooperate with the circuit board assembly 100.

In detail, after the conveying assembly 21 in the lower supporting mechanism 2 transports the supporting assembly 22 to the lower end of the PCB 110 in the patch mechanism 1, the lifting rod 226 gradually lifts up in the lifting guide rail 211 and drives the lifting plate 222 to lift up, the lifting plate 222 lifts up and drives the plurality of buffer springs 223 and the supporting members 224 on the upper end thereof to synchronously lift up, the pressing plate 2244 in the supporting members 224 stops moving and drives the buffer springs 223 connected with the pressing plate 2244 to compress after contacting the electrical component 130, and the supporting members 224 can have a good supporting effect on the electrical component 130, and the supporting members 224 not contacting the electrical component can move up until the pressing plate 2244 moves to a position close to the pins of the electrical component 130.

It should be noted that, when the plurality of pressing plates 2244 are on the same plane, the same size as the inner area of the PCB board 110, the conveying assembly 21 in the upper supporting mechanism 4 is disposed at the upper end of the supporting assembly 22, so a limiting structure is required to be disposed between the outer case 221 in the upper supporting mechanism 4 and the conveying assembly 21 to prevent the supporting assembly 22 from falling from the conveying assembly 21.

Further, as shown in fig. 3 to 10, the welding mechanism 3 includes a heating zone 31 and a cooling zone 32;

the inner case 225 is divided into a cavity region 2251 and a solid region 2252 provided at an upper end of the cavity region 2251;

an air supply cavity 227 is formed between the outer case 221 and the inner case 225 at a position corresponding to the connecting rod 2242, an air supply pipe 2271 is connected to the outer side of the air supply cavity 227 through a control valve, an air suction pipe 2252 is connected to the outer side of the inner case 225 through a control valve, and the air supply pipe 2271 and the air suction pipe 2252 may be both communicated with the heating zone 31 or the cooling zone 32.

In this embodiment, by arranging the welding mechanism 3 to cooperate with the outer case 221, the inner case 225 and the supporting member 224, when the hot air is delivered to the air delivery cavity 227 between the outer case 221 and the inner case 225, the hot air only flows along the supporting member 224 closer to the solder paste, and blows the hot air to the solder paste to change the solder paste into a molten state, and the redundant hot air can be discharged from the supporting member 224 contacting the electrical component 130, thereby avoiding the electrical component 130 from being heated to an excessively high temperature along with the solder paste, and ensuring the qualification rate of the electrical component 130.

In detail, taking the following supporting mechanism 2 as an example, before the lifting plate 222 is not lifted, the plurality of pressing plates 2244 are at the same level, and the upper ends of the connecting rods 2242 are all disposed in the solid region 2252 of the inner box 225, so when the hot air is conveyed to the inside of the air feeding cavity 227 at this time, the hot air cannot enter the inside of the hollow tube 2243 along the gap between the connecting rods 2242, when the lifting plate 222 is lifted upwards, after the supporting member 224 finishes the supporting action on the electric element 130, the supporting member 224 which is not contacted with the electric element 130 is lifted to the maximum height, at this time, the upper ends of the connecting rods 2242 extend out of the solid region 2252 and enter the inside of the air feeding cavity 227, and the supporting member 224 which is contacted with the electric element 130 is still disposed in the inside of the solid region 2252 due to the limiting action of the electric element 130, after the supporting component 22 moves to the inside of the circuit board assembly 100 synchronously, the heating member 31 is communicated with the hot air pipe 2271 and conveys the hot air into the inside of the hollow tube 2243, and the hot air pipe 2271 is conveyed to the inside of the air feeding cavity 227, and the upper end of the connecting rod 2242 is directly discharged from the hollow tube 2242 to the inside of the electric element 130 to the electric element 110, and the electric element can be directly disposed at the position of the electric element 110, and the electric element can be directly opposite to the electric element 110, and the PCB can be directly heated by the electric element 110, and the electric element can be directly disposed on the surface of the PCB 110;

after heating for a certain period of time (preferably, heating time is 30s-60 s), because more hot air is accumulated on the circuit board assembly 100, in order to avoid that the redundant hot air heats the electrical components 130, a suction device arranged inside the heating area 31 can be communicated with a cavity region 2251 in the inner box 225, after the suction device works, the redundant hot air can be sucked into the hollow tube 2243 along the pressing plate 2244 attached to the electrical components 130 (the edge of the part pressing plate 2244 also stops moving after being pressed to the electrical components 130, so that the air outlet of the part pressing plate 2244 always appears to be exposed), and enters the inside of the cavity region 2251 from a gap of the connecting rod 2242 and finally is sucked out by the suction device;

after the solder paste is heated to a molten state, the circuit board assembly 100 can be transferred into the cooling area 32, and at this time, the whole circuit board assembly 100 is directly placed into the cooling area 32 with cold air or the cold air is fed into the air feeding cavity 227;

similarly, the upper support mechanism 4 is similar to the lower support mechanism 2 in structure, and the working principle of the two is the same, and the description thereof is omitted.

The heating element disposed in the heating zone 31 may be a heat gun.

Further, as shown in fig. 12-17, the PCB 110 is provided with a plurality of positioning holes 111;

the rotating member 120 includes a sliding block 121 for supporting the PCB 110, a rotating block 123 rotatably disposed inside the sliding block 121 and having a rotating gear 122 sleeved on an outer side thereof, a clamping plate 124 fixedly disposed on one side of the rotating block 123 and used for limiting and supporting the PCB 110, and a connecting member 125 for fixedly connecting the clamping plate 124 and the PCB 110, wherein the clamping plate 124 is provided with a through hole 1241 at a position corresponding to the positioning hole 111;

the sliding block 121 is further provided with a limiting unit 126 for limiting the rotation of the rotating gear 122, and the limiting unit comprises a return spring 1261 arranged in the sliding block 121, a limiting rod 1262 arranged outside the return spring 1261, and a guide block 1263 arranged at the upper end of the limiting rod 1262, wherein two limiting holes 1221 which are oppositely arranged are formed in the position corresponding to the limiting rod 1262 of the rotating gear 122;

the patch mechanism 1 comprises a workbench 11, a transmission component 12 arranged on the workbench 11 and used for transferring the circuit board assembly 100, and a patch device 13 arranged on the transmission component 12 and used for assembling various electrical components 130 on the PCB 110;

the transfer assembly 12 includes two transfer rails 1211 disposed opposite to each other for driving the sliding block 121 to move, a guide rail 1212 disposed at a position corresponding to the guide block 1263, and a rotary rack 1213 engaged with the rotary gear 122.

In this embodiment, the rotation of the PCB board 110 can be achieved by providing the PCB board 110 in cooperation with the rotation member 120.

In detail, the rotating members 120 on two sides of the PCB 110 are placed on the transmission guide 1211, the transmission guide 1211 drives the rotating members 120 and the PCB 110 to move, in order to prevent the PCB 110 and the rotating members 120 from rotating relative to each other during the movement, a limit unit 126 is disposed on one side of the sliding block 121, when the PCB 110 is transported, the limit rod 1262 is inserted into the limit hole 1221 in the rotating gear 122 to prevent the rotating gear 122 from rotating, when the PCB 110 is required to rotate, the transmission guide 1211 drives the PCB 110 to move and slides the guide block 1263 in the guide track 1212, so that the limit rod 1262 is separated from the limit hole 1221, then the rotating gear 122 contacts the rotating rack 1213 to rotate, the rotating gear 122 drives the PCB 110 to rotate after the rotating gear 122 rotates, and after the PCB 110 rotates 180 ° along with the rotating gear 122, the limit rod 1262 is reinserted into the other limit hole 1221, thereby realizing the fixing of the rotating gear 122 and the PCB 110.

It should be noted that, the connecting member 125 may be a screw or a rivet, and the conveying assembly 21 and the conveying assembly 12 may be a belt conveying unit, and only a portion of the conveying assembly 21 and the conveying assembly 12 are shown in the drawings.

Example III

As shown in fig. 18, in which the same or corresponding parts as those in the first embodiment are given the same reference numerals as those in the first embodiment, only the points of distinction from the first embodiment will be described below for the sake of brevity. The second embodiment is different from the first embodiment in that:

further, the front end of the patch mechanism 1 is further provided with an assembling mechanism 5, and the assembling mechanism 5 includes a feeding component 51 for transferring the PCB board 110, a punching component 52 for processing the PCB board 110 into a positioning hole 111, and a placing table 53 for placing the PCB board 110, which is convenient for assembling the PCB board 110 and the rotating member 120.

In this embodiment, the assembly mechanism 5 is provided to automatically assemble the PCB panel 110 and the rotating member 120.

In detail, after the drilling of the positioning hole 111 is completed on the PCB 110 by the drilling assembly 52, the feeding assembly 51 transfers the PCB 110 to the placement table 53, and then the rotating member 120 can be assembled on the PCB 110 by a person or an assembling device, and the assembled PCB 110 and rotating member 120 can be sent to a subsequent processing procedure.

In the description of the present invention, it should be understood that the directions or positional relationships indicated by the terms "front and rear", "left and right", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of description and simplification of the description, and do not indicate or imply that the apparatus or component in question must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as limiting the invention.

Of course, in this disclosure, those skilled in the art will understand that the term "a" or "an" is to be interpreted as "at least one" or "one or more," i.e., in one embodiment, the number of elements may be one, and in another embodiment, the number of elements may be multiple, and the term "a" is not to be construed as limiting the number.

The foregoing is merely a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions easily conceivable by those skilled in the art under the technical teaching of the present invention should be included in the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope of the claims.

Claims (9)

1. The production process of the high-precision ceramic-based PCB is characterized by comprising the following steps of:

s1: assembling the PCB and the rotating piece, and assembling the punched PCB and the rotating piece and transferring the punched PCB and the punched rotating piece to a transmission assembly;

s2: assembling the PCB and the electrical components, and completing the primary assembly work of the double-sided electrical components of the PCB under the cooperation of the surface mounting device and the transmission assembly;

s3: the lower supporting mechanism works and supports the electric elements at the lower end of the circuit board assembly in the step S2;

s4: and (3) welding the circuit board assembly, wherein the circuit board assembly enters the welding mechanism and is matched with the upper supporting mechanism and the lower supporting mechanism to finish the welding operation of the circuit board assembly.

2. The production process of the high-precision ceramic-based PCB according to claim 1, wherein the circuit board assembly consists of a PCB, rotating parts symmetrically arranged on two sides of the PCB and used for driving the PCB to rotate, and a plurality of electrical components arranged on the PCB;

offer a plurality of locating hole on the PCB plate, rotate the piece including being used for supporting the slider of PCB plate, rotate the setting and be in the inside of slider and outside cover are equipped with the pivoted gear rotate the piece, fixedly set up pivoted piece one side just be used for right the cardboard that the PCB plate carries out spacing support and be used for carrying out fixed connection's connecting piece with cardboard and PCB plate, the cardboard is in the position department that corresponds to the locating hole has seted up the through-hole.

3. The production process of the high-precision ceramic-based PCB according to claim 2, wherein the surface mounting mechanism can realize the turn-over operation of the circuit board assembly in the process of transferring the circuit board assembly, and the lower end of the surface mounting mechanism is further provided with a lower supporting mechanism, and the lower supporting mechanism can support an electric element arranged at the lower end of the circuit board assembly after the circuit board assembly is turned over;

the rear end of the patch mechanism is also provided with a welding mechanism, the upper end of the welding mechanism is provided with an upper supporting mechanism which is arranged opposite to the lower supporting mechanism, and the upper supporting mechanism and the lower supporting mechanism are mutually matched in the welding mechanism so as to realize the welding work of the circuit board assembly;

the lower supporting mechanism comprises a conveying component arranged at the lower end of the circuit board assembly and a supporting component arranged on the conveying component and used for supporting the electric elements.

4. The process for producing the high-precision ceramic-based PCB according to claim 3, wherein the supporting assembly comprises an outer box body arranged on the conveying assembly, a lifting plate arranged in the outer box body in a sliding manner, supporting pieces connected through a plurality of buffer springs and an inner box body fixedly arranged in the outer box body;

the support pieces are arranged corresponding to the circuit board assembly array and comprise support rods connected with the buffer springs, hollow tubes connected with the support rods through a plurality of connecting rods and pressing plates connected to one sides of the hollow tubes;

lifting rods are further arranged on two sides of the lifting plate, and lifting guide rails are arranged at positions, corresponding to the lifting rods, of the conveying assembly.

5. The process for producing high-precision ceramic-based PCBs according to claim 4, wherein the soldering mechanism comprises a heating zone and a cooling zone;

the outer box body and the inner box body form an air supply cavity at the position corresponding to the connecting rod, the outer side of the air supply cavity is connected with an air supply pipeline through a control valve, the outer side of the inner box body is connected with an air suction pipeline through a control valve, and the air supply pipeline and the air suction pipeline can be communicated with the heating area or the cooling area.

6. The high-precision ceramic-based PCB production process according to claim 5, wherein one side of the sliding block is further provided with a limiting unit for limiting the rotation of the rotating gear, the limiting unit comprises a reset spring arranged in the sliding block, a limiting rod arranged on the outer side of the reset spring and a guide block arranged at the upper end of the limiting rod, and the rotating gear is provided with two limiting holes arranged oppositely at positions corresponding to the limiting rod.

7. The process of claim 6, wherein the mounting mechanism comprises a table, a transport assembly disposed on the table for transporting the circuit board assembly, and a mounting device disposed on the transport assembly for assembling various electrical components on the PCB.

8. The process of claim 7, wherein the transmission assembly comprises two transmission guide rails which are arranged oppositely and used for driving the sliding block to move, a guide rail which is arranged at a position corresponding to the guide block, and a rotating rack which is matched with the rotating gear.

9. The high-precision ceramic-based PCB production process according to claim 1, wherein an assembling mechanism is further arranged at the front end of the surface mounting mechanism, and comprises a feeding assembly for transferring the PCB, a punching assembly for processing the PCB into positioning holes, and a placing table for containing the PCB and facilitating assembling of the PCB and a rotating piece.