CN213305839U - Circuit board heat dissipation device - Google Patents
Circuit board heat dissipation device Download PDFInfo
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- CN213305839U CN213305839U CN202021725584.6U CN202021725584U CN213305839U CN 213305839 U CN213305839 U CN 213305839U CN 202021725584 U CN202021725584 U CN 202021725584U CN 213305839 U CN213305839 U CN 213305839U
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- circuit board
- air supply
- supply mechanism
- conveying
- lifting
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Abstract
The utility model relates to a circuit board technical field, concretely relates to circuit board heat abstractor, including the frame, set up the loading board that is used for placing the circuit board in the frame, set up respectively in first air supply mechanism, the second air supply mechanism at loading board up end left and right sides edge, set up respectively around the loading board up end first transport mechanism and the second that are used for transporting the circuit board transport the mechanism, set up in the elevating system that is used for the jacking circuit board of loading board below, the loading board is provided with the opening that supplies elevating system to pass. The utility model discloses set up first air supply mechanism, second air supply mechanism on the loading board, reciprocating motion can be realized to two air supply mechanism's first fan under the drive of electric screw, realizes the even cooling to multilayer circuit board, and the bottom of loading board has set up fin and second fan simultaneously, has further strengthened the cooling effect, has improved cooling efficiency, has saved the activity duration, has reduced manufacturing cost.
Description
Technical Field
The utility model relates to a circuit board technical field, concretely relates to circuit board heat abstractor.
Background
A printed circuit board, also called PCB or printed circuit board, is one of the important components in the electronic industry, and almost every kind of electronic equipment, as small as electronic watches, calculators, as large as computers, communication electronic equipment, and military weapon systems, has electronic components such as integrated circuits, etc., and the printed circuit board is used for electrically interconnecting the components. Common circuit boards generally include single-sided boards, double-sided boards, multi-layer boards, and the like. In the manufacturing process of the multilayer board, a plurality of individual circuit board layers are usually bonded together by an insulating material, and the circuit board layers are laminated to form a multilayer circuit board, and the insulating material is generally a hot-melt material, such as a hot-melt resin, which is melted by heating, so as to be uniformly bonded to two circuit board layers. After the pressing, a cooling process is required to facilitate the cooling and solidification of the hot melt material, and finally the multilayer circuit board product is formed. The traditional cooling is that the circuit board after the pressfitting is placed on the frame manually for natural cooling, so that the cooling efficiency is low, and a large amount of time is consumed.
SUMMERY OF THE UTILITY MODEL
In order to solve the problem, the utility model provides a circuit board heat abstractor.
The utility model discloses a following scheme realizes:
a circuit board heat dissipation device comprises a rack, a bearing plate, a first air supply mechanism, a second air supply mechanism, a first conveying mechanism, a second conveying mechanism and a lifting mechanism, wherein the bearing plate is arranged on the rack and used for placing a circuit board; the first air supply mechanism and the second air supply mechanism respectively comprise an electric lead screw assembly, a moving platform connected with the electric lead screw assembly, a first fan arranged on the moving platform, and an air supply duct arranged on one side of the air feeder facing the middle of the bearing plate.
Furthermore, a first supporting platform for bearing the first air supply mechanism, a second supporting platform for bearing the second air supply mechanism and a third supporting platform for bearing the first conveying mechanism are arranged on the bearing plate; the electric screw rod assembly of the first air supply mechanism is arranged on the first supporting table, and the moving table of the first air supply mechanism is movably connected with the first supporting table; and the electric screw rod assembly of the second air supply mechanism is arranged on the second support table, and the moving table of the second air supply mechanism is movably connected with the second support table.
Furthermore, the air supply duct comprises a connecting section connected with the first fan and an air outlet section facing the bearing plate, and the area of the connecting section is larger than that of the air outlet section facing the tail end of the bearing plate.
Furthermore, the bottom surface of the bearing plate is provided with a plurality of radiating fins.
Furthermore, a plurality of second fans are arranged below the radiating fins and connected with the bearing plate through fan supports.
Furthermore, elevating system is including setting up the cylinder in the frame, the lifter plate of being connected with the cylinder piston rod, sets up a plurality of conveying assembly on the lifter plate.
Furthermore, the conveying assembly comprises a roller arranged on the lifting plate and a lifting motor used for driving the roller to rotate, and the roller and the lifting motor are in transmission connection through a belt pulley group.
Further, the first conveying mechanism and the second conveying mechanism both comprise conveying rollers and conveying motors for driving the conveying rollers to rotate.
Contrast prior art, the utility model discloses following beneficial effect has:
the utility model discloses set up first air supply mechanism, second air supply mechanism on the loading board, reciprocating motion can be realized to two air supply mechanism's first fan under the drive of electric screw, realizes the even cooling to multilayer circuit board, and the bottom of loading board has set up fin and second fan simultaneously, has further strengthened the cooling effect, has improved cooling efficiency, has saved the activity duration, has reduced manufacturing cost. On the other hand, the multi-layer circuit board can be automatically conveyed under the matching of the first conveying mechanism, the second conveying mechanism and the lifting mechanism, manual intervention is not needed, and the labor intensity is reduced.
Drawings
Fig. 1 is a schematic cross-sectional structure diagram of a circuit board heat dissipation device provided by the present invention.
Fig. 2 is another schematic view of the heat sink according to the present invention, in which the electric screw and the second conveying mechanism are hidden.
The figure includes:
the device comprises a rack 1, a bearing plate 2, an opening 21, a first supporting table 22, a second supporting table 23, a third supporting table 24, a radiating fin 25, a second fan 26, a fan bracket 27, a first air supply mechanism 3, an electric screw component 31, a moving table 32, a first fan 33, an air supply duct 34, a connecting section 341, an air outlet section 342, a second air supply mechanism 4, a first conveying mechanism 5, a roller 51, a conveying motor 52, a second conveying mechanism 6, a lifting mechanism 7, an air cylinder 71, a lifting plate 72, a conveying component 73, a roller 731, a lifting motor 732 and a pulley group 733.
Detailed Description
To facilitate understanding of the present invention for those skilled in the art, the present invention will be described in further detail with reference to the following detailed description and accompanying drawings.
Referring to fig. 1 to 2, the utility model provides a circuit board heat dissipation device, which comprises a frame 1, a loading plate 2 arranged on the frame 1 and used for placing a circuit board, a first air supply mechanism 3 and a second air supply mechanism 4 respectively arranged on the left and right edges of the upper end surface of the loading plate 2, a first conveying mechanism 5 and a second conveying mechanism 6 respectively arranged on the front and back edges of the upper end surface of the loading plate 2 and used for conveying the circuit board, and a lifting mechanism 7 arranged below the loading plate 2 and used for jacking the circuit board, wherein the loading plate 2 is provided with an opening 21 for the lifting mechanism 7 to pass through; the first air supply mechanism 3 and the second air supply mechanism 4 both comprise an electric screw rod assembly 31, a moving platform 32 connected with the electric screw rod assembly 31, a first fan 33 arranged on the moving platform 32, and an air supply duct 34 arranged on one side of the air feeder facing the middle of the bearing plate 2.
The bearing plate 2 is provided with a first supporting platform 22 for bearing the first air supply mechanism 3, a second supporting platform 23 for bearing the second air supply mechanism 4 and a third supporting platform 24 for bearing the first conveying mechanism 5; the electric screw assembly 31 of the first air supply mechanism 3 is arranged on the first supporting table 22, and the moving table 32 of the first air supply mechanism 3 is movably connected with the first supporting table 22; the electric screw assembly 31 of the second air supply mechanism 4 is arranged on the second support table 23, and the moving table 32 of the second air supply mechanism 4 is movably connected with the second support table 23.
The air supply duct 34 includes a connection section 341 connected to the first fan 33, and an air outlet section 342 facing the bearing plate 2, and an area of the connection section 341 is larger than an area of the air outlet section 342 facing the end of the bearing plate 2. The areas of air inlet and outlet are different, and the temperature of the blown air flow is lower according to the throttling expansion principle, so that the multilayer circuit board can be cooled more quickly.
The bottom surface of the carrier plate 2 is provided with a plurality of heat dissipation fins 25. Of course, the heat radiation fins 25 are provided only in the region other than the elevating mechanism 7. A plurality of second fans 26 are arranged below the heat dissipation fins 25, and the second fans 26 are connected with the bearing plate 2 through fan brackets 27.
The lifting mechanism 7 comprises an air cylinder 71 arranged on the frame 1, a lifting plate 72 connected with a piston rod of the air cylinder 71, and a plurality of conveying assemblies 73 arranged on the lifting plate 72. The openings 21 on the bearing plate 2, specifically the openings 21 for the conveying assemblies 73 to pass through, the number of the openings 21 is the same as the number of the conveying assemblies 73, and two openings are provided in this embodiment.
The conveying assembly 73 comprises a roller 731 arranged on the lifting plate 72 and a lifting motor 732 for driving the roller 731 to rotate, wherein the roller 731 and the lifting motor 732 are in transmission connection through a pulley set 733. In specific implementation, the lifting plate 72 is provided with a connecting piece, and two ends of the rolling shaft 731 are respectively connected with different connecting pieces in a rotating manner.
The first conveying mechanism 5 and the second conveying mechanism 6 each include a conveying roller 51, and a conveying motor 52 for driving the conveying roller 51 to rotate, wherein the second conveying mechanism 6 is disposed on the carrying plate 2. When the conveying roller 51 rotates, the multi-layer circuit board can be driven to move. The third support platform 24 is also provided with a connecting piece, two ends of the conveying roller 51 of the first conveying mechanism 5 are respectively connected with different connecting pieces in a rotating manner, the second conveying mechanism 6 on the bearing plate 2 is also similar, and the only difference is that the height of the connecting piece on the bearing plate 2 needs to ensure that the top of the conveying roller 51 of the second conveying mechanism 6 and the top of the conveying roller 51 of the first conveying mechanism 5 are in the same horizontal plane.
At specific during operation, the utility model discloses the conveyer that the accessible set up in addition connects lamination equipment, and the multilayer circuit board after the pressfitting flows in from first transport mechanism 5, and elevating system 7 lifting that makes progress this moment is in the coplanar until conveying assembly 73's roller bearing 731 top and conveying roller 51 top, and the multilayer circuit board transports 6 one sides of mechanism and removes towards the second, and after the multilayer circuit board wholly entered into loading board 2 top, elevating system 7 resets, and the multilayer circuit board contacts with loading board 2. The bearing plate 2 is made of metal, and can play a good heat conduction effect. After the multilayer wiring board is placed on the carrier board 2. The first fan 33 of the first air supply assembly and the second fan 26 of the second air supply assembly reciprocate in the front-rear direction, and blow air toward the multilayer board until cooling is completed. After the cooling, the lifting mechanism 7 lifts up the multilayer circuit board, the multilayer circuit board moves toward the second conveying mechanism 6 under the action of the conveying assembly 73, and the second conveying mechanism 6 sends the cooled multilayer circuit board out of the area of the carrier plate 2 and conveys the multilayer circuit board to the next process through a conveying mechanism arranged additionally. In the concrete implementation, a vision sensor can be additionally arranged to judge whether the circuit board integrally enters the area of the bearing plate 2, and a temperature sensor can be arranged to judge whether the multilayer circuit board is cooled.
The utility model discloses set up first air supply mechanism, second air supply mechanism on the loading board, reciprocating motion can be realized to two air supply mechanism's first fan under the drive of electric screw, realizes the even cooling to multilayer circuit board, and the bottom of loading board has set up fin and second fan simultaneously, has further strengthened the cooling effect, has improved cooling efficiency, has saved the activity duration, has reduced manufacturing cost. On the other hand, the multi-layer circuit board can be automatically conveyed under the matching of the first conveying mechanism, the second conveying mechanism and the lifting mechanism, manual intervention is not needed, and the labor intensity is reduced.
In the description of the present invention, it should be understood that the indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention.
Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "connected" and "fixed" are to be construed broadly, e.g., as meaning either a fixed connection or a removable connection, or as an integral part; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
While the invention has been described in conjunction with the specific embodiments set forth above, it is evident that many alternatives, modifications and variations will be apparent to those skilled in the art in light of the foregoing description. Accordingly, it is intended to embrace all such alternatives, modifications, and variations that fall within the scope of the included claims.
Claims (8)
1. A circuit board heat dissipation device is characterized by comprising a rack, a bearing plate, a first air supply mechanism, a second air supply mechanism, a first conveying mechanism, a second conveying mechanism and a lifting mechanism, wherein the bearing plate is arranged on the rack and used for placing a circuit board; the first air supply mechanism and the second air supply mechanism respectively comprise an electric lead screw assembly, a moving platform connected with the electric lead screw assembly, a first fan arranged on the moving platform, and an air supply duct arranged on one side of the air feeder facing the middle of the bearing plate.
2. The circuit board heat dissipation device of claim 1, wherein the carrier board is provided with a first supporting platform for carrying the first air blowing mechanism, a second supporting platform for carrying the second air blowing mechanism, and a third supporting platform for carrying the first conveying mechanism; the electric screw rod assembly of the first air supply mechanism is arranged on the first supporting table, and the moving table of the first air supply mechanism is movably connected with the first supporting table; and the electric screw rod assembly of the second air supply mechanism is arranged on the second support table, and the moving table of the second air supply mechanism is movably connected with the second support table.
3. The circuit board heat dissipation device of claim 1, wherein the air duct comprises a connection section connected to the first fan, and an air outlet section facing the carrier plate, and an area of the connection section is larger than an area of the air outlet section facing an end of the carrier plate.
4. The circuit board heat sink according to claim 1, wherein the bottom surface of the carrier plate is provided with a plurality of heat dissipating fins.
5. The circuit board heat sink according to claim 4, wherein a plurality of second fans are disposed below the heat dissipating fins, and the second fans are connected to the carrier plate through fan brackets.
6. The circuit board heat sink according to claim 1, wherein the lifting mechanism comprises a cylinder disposed on the frame, a lifting plate connected to a piston rod of the cylinder, and a plurality of conveying assemblies disposed on the lifting plate.
7. The circuit board heat dissipation device of claim 6, wherein the conveying assembly comprises a roller disposed on the lifting plate, and a lifting motor for driving the roller to rotate, and the roller and the lifting motor are in transmission connection through a pulley set.
8. The circuit board heat sink according to claim 1, wherein the first and second transport mechanisms each comprise a transport roller and a transport motor for driving the transport roller to rotate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021725584.6U CN213305839U (en) | 2020-08-18 | 2020-08-18 | Circuit board heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021725584.6U CN213305839U (en) | 2020-08-18 | 2020-08-18 | Circuit board heat dissipation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213305839U true CN213305839U (en) | 2021-05-28 |
Family
ID=76025431
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021725584.6U Active CN213305839U (en) | 2020-08-18 | 2020-08-18 | Circuit board heat dissipation device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213305839U (en) |
-
2020
- 2020-08-18 CN CN202021725584.6U patent/CN213305839U/en active Active
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