JP6624927B2 - Component supply device cooling method - Google Patents

Description

  The present invention relates to a method for cooling a component supply device in a component mounter that picks up components and mounts the components on a mounting target.

  2. Description of the Related Art Conventionally, as a component mounter of this type, there is known a component mounter that includes a component supply device that supplies a component by pulling a tape in which components are stored at predetermined intervals from a reel. For example, in Patent Literature 1, after an electronic component carrier including a carrier tape in which pockets for accommodating electronic components are formed at regular intervals and a top cover tape attached to the upper surface of the carrier tape is drawn out from a reel, In a component supply device that peels off the top cover tape from the electronic component transporter and transports the electronic component transporter from which the top cover tape has been peeled off, includes ions with respect to the electronic component transporter before the top cover tape is peeled off. A device for blowing air is disclosed.

JP 2011-54807 A

  In such a component supply device, it is necessary to output a relatively large current to the motor in order to secure a motor torque required for component transport (tape feeding), and the motor and the control board are likely to generate heat. On the other hand, in recent years, the thickness of the component supply device has been reduced, and it is general that a large number of component supply devices are arranged side by side for one component mounter. For this reason, in the component supply device, there is little escape of heat from a heat source such as a motor or a control board, and the temperature of the device increases.

  An object of the present invention is to efficiently cool a plurality of component supply devices arranged and held on a holding table of a component mounter.

  The present invention employs the following means to achieve the above-mentioned main object.

The cooling method of the component supply device of the present invention includes:
A method for cooling a component supply device in a component mounter that picks up a component supplied from a component supply device and mounts the component on a mounting target,
A heat transfer step of transmitting heat generated by the component supply device to a holding table that holds a plurality of the component supply devices side by side,
A cooling step of cooling the holding table,
The gist is to have

  In the cooling method of the component supply device according to the present invention, the heat generated in the component supply device in the heat transfer process is transmitted to the holding table that arranges and holds the plurality of component supply devices, and the holding table is cooled in the cooling process. Accordingly, the plurality of component supply devices arranged side by side on the holding table can be efficiently cooled, and the temperature of the devices can be appropriately managed.

  In the cooling method of the component supply device according to the aspect of the invention, in the cooling step, the flow of air is generated on a surface of the holding table opposite to a surface holding the component supply device, so that heat with the air is generated. The holder may be cooled by replacement. In the cooling method of the component supply device according to the aspect of the present invention, the holding table may be cooled by generating a flow of air from inside the component mounting machine to outside the component mounting machine. By doing so, it is possible to suppress the accumulation of heat in the mounting machine. In these cases, fins for heat radiation may be provided on the surface of the holding table opposite (the back side) to the surface holding the component supply device. In this case, the cooling of the holding table can be further promoted.

  Alternatively, in the cooling method of the component supply device of the present invention, the cooling step includes a circulation path that circulates a refrigerant through the holding table, and cools the holding table by heat exchange with the refrigerant that circulates in the circulation path. It can also be.

  Further, in the cooling method of the component supply device of the present invention, the holding table has a bottom support portion that supports a bottom surface of the component supply device, and the cooling step cools the bottom support portion. You can also.

FIG. 1 is a configuration diagram illustrating an outline of a configuration of a component mounter as one embodiment to which the present invention is applied; FIG. 2 is a configuration diagram illustrating a schematic configuration of a component supply device according to an embodiment. FIG. 2 is a configuration diagram illustrating a schematic configuration of a cooling device 60 according to the embodiment. It is a block diagram showing the outline of the composition of cooling device 160 of a modification.

  An embodiment for carrying out the present invention will be described using an embodiment.

  FIG. 1 is a configuration diagram schematically showing a configuration of a component mounting machine 10 as one embodiment to which the present invention is applied, and FIG. 2 is a configuration diagram schematically showing a configuration of a component supply device 20 of the embodiment. FIG. 3 is a configuration diagram schematically illustrating a configuration of a cooling device 60 according to the embodiment. 1 is the X-axis direction, the front (front) and rear (rear) directions are the Y-axis direction, and the up-down direction is the Z-axis direction.

  As shown in FIG. 1, the component mounter 10 includes a base 11 and a main body frame 12 supported by the base 11, as shown in FIG. As shown in FIG. 1, the component mounter 10 includes a support table 14 provided at a lower portion of the main body frame 12, a board transfer device 30 for transferring a substrate, and components mounted detachably on the support table 14. Supply device 20 for supplying the components, a head 50 for adsorbing the components supplied by the component supply device 20 to the suction nozzle 52 and mounting the components on the substrate transported by the substrate transport device 30, and moving the head 50 in the XY directions. An XY robot 40 for cooling, a cooling device 60 for cooling the component supply device 20 (see FIG. 3), and a control device (not shown) for controlling the entire mounting machine are provided. In addition, the component mounter 10 also captures a mark camera 46 for capturing a substrate positioning reference mark provided on the substrate provided on the head 50 and a suction attitude of the component sucked on the suction nozzle 52. A part camera 48 for performing the operation is also provided.

  As shown in FIG. 1, in the present embodiment, the substrate transfer device 30 is configured as a dual-lane transfer device provided with two substrate transfer paths, and is arranged in the front-rear direction (Y-axis direction) on the support base 14. It is installed in the center. The substrate transport device 30 includes a belt conveyor device 32, and transports the substrate from left to right in FIG. 1 (substrate transport direction) by driving the belt conveyor device 32. At the center of the substrate transfer device 30 in the substrate transfer direction (X-axis direction), a backup plate 34 that can be moved up and down by an elevating device (not shown) is provided. When transported, the substrate is backed up from the back side by raising the backup plate 34.

  As shown in FIG. 1, the XY robot 40 includes a pair of left and right Y-axis guide rails 43 provided on an upper portion of the main body frame 12 along the front-rear direction (Y-axis direction). A long Y-axis slider 44 that can move along the Y-axis guide rail 43 in a state of being bridged over the X-axis, and an X provided on the lower surface of the Y-axis slider 44 along the left-right direction (X-axis direction). The vehicle includes an axis guide rail 41 and an X-axis slider 42 movable along the X-axis guide rail 41. The head 50 is attached to the X-axis slider 42, and the control device can move the head 50 to an arbitrary position on the XY plane by controlling the drive of the XY robot 40.

  The component supply devices 20 are positioned on the support base 14 by inserting the pins 23 into pin holes (not shown) formed on the support base 14, and are arranged in plural on the support base 14 so as to be arranged in the left-right direction (X-axis direction). You. The component supply device 20 is a tape feeder that feeds a carrier tape containing components at a predetermined pitch to a component supply position where the head 50 (the suction nozzle 52) can pick up the carrier tape. The carrier tape is composed of a bottom tape in which cavities (recesses) are formed at a predetermined pitch in the longitudinal direction, and a top film attached to the upper surface of the bottom tape in a state where components are stored in each cavity. A sprocket hole (not shown) with which a sprocket tooth 25a described later is engaged is formed at a predetermined pitch on a side edge thereof.

  As shown in FIG. 2, the component supply device 20 includes a substantially rectangular case 21, a tape reel 22 around which a carrier tape is wound, A tape feeding mechanism 24 for feeding the component to the supply position, a peeling unit (not shown) provided before the component supply position to peel off the top film from the bottom tape to expose the component (a state in which the component can be picked up), and the case 21 And a control board 28 that is housed in the device and controls the entire apparatus. The top film peeled by the peeling portion is guided downward by a guide groove (not shown) formed on the outer periphery of the case 21 and is collected by the dust box 72 installed on the base 11. The bottom tape that has been sent out by the tape feeding mechanism 24 and has its components taken out at the component supply position is guided by the tape cutting mechanism 70 to be finely cut, and then collected in the dust box 72 below.

  The tape feed mechanism 24 is provided on a sprocket 25 having sprocket teeth formed on the outer periphery, a drive motor 26 (for example, a stepping motor), a gear 24 a provided on a rotation shaft of the sprocket 25, and a rotation shaft of the drive motor 26. And a transmission gear 24c for connecting the transmission gear 24b to the transmission gear 24b. The tape feed mechanism 24 feeds the carrier tape at a pitch by engaging sprocket teeth with sprocket holes formed in the carrier tape and intermittently rotating the sprocket 25 by driving a drive motor 26.

  The control board 28 is configured as a microprocessor including a CPU, a ROM, a RAM, and the like, receives a detection signal from the optical sensor 27 that detects the rotational position of the sprocket 25, and is driven by a built-in motor driver (drive circuit). A signal is generated and output to the drive motor 26. Further, the control board 28 is communicably connected to a control device of the component mounter 10 via a connector 29, and exchanges control signals and data with each other. Note that the connector 29 is configured as a power supply connector that receives power from the component mounter 10 and supplies the power to the tape feeding mechanism 24 (drive motor 26) and various parts such as the control board 28.

  In this embodiment, the case 21 is formed of a material having high thermal conductivity such as aluminum or an aluminum alloy, and transmits heat generated by a heat source such as the drive motor 26 and the control board 28 (motor driver) to the support 14. Functions as a heat transfer member.

  Devices such as the drive motor 26 and the control board 28 of the component supply device 20 are heat sources that generate heat as they are driven. These heat sources are arranged at positions closer to the surface (bottom surface) of the support base 14 that comes into contact with the feeder installation surface as the amount of generated heat increases. In the present embodiment, the control board 28 having a built-in motor driver generates a larger amount of heat than the drive motor 26, and is therefore arranged at a position closer to the bottom of the case 21 than the drive motor 26, as shown in FIG. This allows the heat generated in the control board 28 to be efficiently released to the support base 14. Of course, when the drive motor 26 generates more heat than the control board 28, the drive motor 26 may be arranged at a position closer to the bottom surface of the case 21 than the control board 28.

  The cooling device 60 includes a plurality of radiating fins 62 formed on a surface on the back side of the feeder installation surface of the support base 14, and a cooling fan 64 for generating a flow of air around the plurality of radiating fins 62. The cooling fan 64 is installed such that the direction of air flow (the blowing direction) is from inside the component mounting machine 10 to outside the component mounting machine 10. For this reason, the air warmed by the heat exchange in the radiation fins 62 is discharged outside the machine.

  Here, the component supply device 20 needs to apply a relatively large current to the drive motor 26 in order to secure the torque required for tape feeding. Therefore, the drive motor 26 and the control board 28 (motor driver) that controls the drive motor 26 serve as heat sources. On the other hand, as shown in FIG. 1, a plurality of component supply devices 20 are usually installed in a state of being aligned with the support base 14. Easy to rise. For this reason, for example, the drive of the drive motor 26 is restricted, and it may become impossible to supply components normally. Further, for example, a temperature rise around the support base 14 and a decrease in ambient humidity cause static electricity to be generated on the carrier tape. In some cases, the suction nozzle 52 may not be able to normally take out the component (a suction shift or a suction error may occur). Therefore, in this embodiment, the heat from the heat source of the component supply device 20 is transmitted to the support 14 via the case 21, and an air flow is generated in the support 14 to cool the support 14 by heat exchange with air. By doing so, the component supply device 20 is cooled to suppress the occurrence of the above-described problem.

  According to the component mounter 10 of the embodiment described above, the case 21 of the component supply device 20 is formed of a material having high thermal conductivity in a case where a plurality of component supply devices 20 can be arranged and installed on the upper surface of the support base 14. Further, a cooling fan 62 for generating an air flow is provided on a surface of the support base 14 on the back side of the feeder installation surface. Thereby, the heat generated by the heat source (the drive motor 26, the control board 28, and the like) of the component supply device 20 is transmitted to the support 14 via the case 21 (a heat transfer process). The heat transmitted to the support 14 is radiated from the support 14 (cooling step). As a result, the component supply device 20 can be efficiently cooled.

  Further, according to the component mounter 10 of the present embodiment, since the radiating fins 62 are formed on the surface of the support base 14 on the back side of the feeder installation surface, the heat radiation from the support base 14 can be promoted, and the cooling performance can be improved. Can be further enhanced.

  Furthermore, according to the component mounter 10 of the embodiment, since the cooling fan 64 is installed so that the direction of air flow (the blowing direction) is from inside the machine to outside the machine, heat from the support base 14 (radiation fins 62) can be obtained. The air warmed by the replacement can be discharged to the outside of the machine, and the rise in temperature inside the machine can be suppressed.

  Furthermore, according to the component mounter 10 of the embodiment, the heat source (the drive motor 26, the control board 28, etc.) of the component supply device 20 which generates a large amount of heat (the control board 28) is connected to the feeder installation surface of the support base 14. Since it is arranged at a position close to the surface (the bottom surface of the case 21) that comes in contact with the heat source, the heat of the heat source can be efficiently radiated to the support base 14.

  In the present embodiment, the radiation fins 62 are formed on the back surface of the support base 14, but the present invention is not limited to this, and the radiation fins 62 may not be formed.

  In the present embodiment, the cooling device 60 is configured using the cooling fan 64, but is not limited thereto. The support 14 may be cooled by circulating cooling water (refrigerant) through the support 14. FIG. 4 shows a cooling device 160 according to a modification. The cooling device 160 according to the modification includes a circulation path 162 provided on the support base 14, a pump 164 for circulating cooling water (refrigerant) in the circulation path 162, and a heat of cooling water (refrigerant) circulating in the circulation path 162. And a radiator 166 for radiating heat. Thus, the component supply device 20 can be effectively cooled by cooling the support base 14.

  In the present embodiment, the case 21 is made to function as a heat transfer member that transfers the heat of the heat source to the support 14. However, the present invention is not limited to this, and the case 21 may be made of a material having a high thermal conductivity (such as copper or a copper alloy). The formed heat transfer member, heat transfer gel, and the like may be separately arranged in a heat source.

  In the present embodiment, the present invention is applied to the cooling of the component supply device 20 as a tape feeder disposed on the support base 14. However, the present invention is not limited to this. The present invention may be applied to any component supply device including a heat source (a motor, a solenoid, a control board, etc.) such as a bulk feeder that accommodates these electronic components in a row and supplies them in a row. . When units other than the feeder (for example, a flux application unit for applying a flux to a component, a nozzle cleaning unit for cleaning the suction nozzle 52, and the like) are installed on the support base 14, the present invention is applied to cooling of these units. It is also possible.

  Here, the correspondence between the main elements of the present embodiment and the main elements of the invention described in the section for solving the problems will be described. That is, the component supply device 20 (tape feeder) corresponds to a “component supply device”, the support table 14 corresponds to a “holding table”, and is generated by a heat source (such as the drive motor 26 and the control board 28) of the component supply device 20. The step of transmitting the generated heat to the support 14 via the case 21 corresponds to a “heat transfer step”, and the step of radiating the heat transmitted to the support 14 from the support 14 corresponds to a “cooling step”.

  It should be noted that the present invention is not limited to the above-described embodiments at all, and it goes without saying that the present invention can be implemented in various modes as long as it belongs to the technical scope of the present invention.

  INDUSTRIAL APPLICABILITY The present invention can be used in the manufacturing industry of component mounters and the like.

  Reference Signs List 10 component mounter, 11 base, 12 body frame, 14 support, 20 component supply device, 21 case, 22 tape reel, 23 pin, 24 tape feed mechanism, 24a, 24b gear, 24c transmission gear, 25 sprocket, 26 Drive motor, 27 optical sensor, 28 control board, 29 connector, 30 board transfer device, 32 belt conveyor device, 34 backup plate, 40 XY robot, 41 X-axis guide rail, 42 X-axis slider, 43 Y-axis guide rail, 44 Y-axis slider, 46 mark camera, 48 parts camera, 50 head, 51 suction nozzle, 60, 162 cooling device, 62 radiating fin, 64 cooling fan, 70 tape cutting mechanism, 72 dust box, 162 circulation path, 164 pump, 166 radiator .

Claims (5)

A method for cooling a component supply device in a component mounter that picks up a component supplied from a component supply device and mounts the component on a mounting target,
A heat transfer step of transmitting heat generated by the component supply device to a holding table that holds a plurality of the component supply devices side by side,
A cooling step of cooling the holding table,
Have a,
The component supply device includes a case that accommodates a heat source,
The method of cooling a component supply device, wherein the case functions as a heat transfer member that transfers heat generated by the heat source to the holding table in the heat transfer step . The method for cooling a component supply device according to claim 1,
The cooling step cools the holding table by exchanging heat with the air by generating a flow of air on a surface of the holding table opposite to a surface holding the component supply device. Method of cooling the parts supply device. A method for cooling a component supply device according to claim 2,
Said cooling step, it said that the flight of the mounter produces a flow of air toward the outside, the cooling method of the component supplying device, characterized by cooling the holding table. The method for cooling a component supply device according to claim 1,
The cooling method of the component supply device, wherein the cooling step includes a circulation path that circulates a refrigerant through the holding table, and cools the holding table by heat exchange with a refrigerant that circulates through the circulation path. A method for cooling a component supply device according to any one of claims 1 to 4,
The holding table has a bottom support portion that supports a bottom surface of the component supply device,
The method of cooling a component supply device, wherein the cooling step cools the bottom support.

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