JP7240888B2 - Component mounter - Google Patents

Description

The technology disclosed in this specification relates to a component mounting apparatus.

Patent Literature 1 discloses a component mounting apparatus. This component mounting apparatus mounts components on a substrate.

JP 2010-016145 A

The component mounting apparatus described above is provided with a case that accommodates the heat-generating unit. Exothermic units generate heat and need to be cooled. Conventionally, the case is provided with an exhaust fan for cooling the exothermic unit. When the exhaust fan operates, air flows from the outside of the case into the inside to cool the heat-generating unit, and the heated air cooled by the heat-generating unit is exhausted to the outside of the case. When the air is sucked from the outside of the case into the inside of the case by the exhaust fan, dust and dirt may enter together with the air. This specification provides a technique for cooling a heat-generating unit without dust, dirt, or the like entering the case.

This specification discloses a component mounting apparatus that mounts components on a substrate. A component mounting apparatus includes a case, a heat-generating unit arranged inside the case, a cooling device arranged outside the case and supplying cooling air to the inside of the case, and a cooling device inside the case. and a first cooling passage disposed to guide cooling air supplied from the cooling device to the interior of the case to the heat generating unit.

In the component mounting apparatus described above, a cooling device is arranged outside the case. A first cooling passage is provided inside the case, and cooling air is supplied from the cooling device to the inside of the case via the first cooling passage. Therefore, since cooling air is directly supplied from the cooling device to the inside of the case, outside air is less likely to be taken into the inside of the case through the gaps in the case. In other words, the exothermic unit can be cooled without dust, dust, etc. entering the case.

FIG. 2 is a perspective view showing the configuration of the component mounter 10; 4 is a schematic diagram showing the internal structure of the component mounting module 10a. FIG. FIG. 2 is a schematic diagram showing the configuration inside the cooling device 20 and the electrical component case 12 ;

In an embodiment of the present technology, the component mounting apparatus may further include a component mounting section that mounts components on the board. Furthermore, the exothermic unit may be a controller that controls the component mounting section and may include at least one exothermic electronic component.

In one embodiment of the present technology, the case may include a vent that communicates a space inside the case with a space outside the case. In this case, when the cooling device operates, the air supplied from the cooling device to the interior of the case may be discharged to the outside of the case through the vent.

In one embodiment of the present technology, a cooling device includes an air inlet that draws in outside air, a cooling unit that cools the air sucked from the air inlet, and a blower that sends out the cooling air cooled by the cooling unit. However, the intake port may be provided with a filter. According to such a configuration, when the cooling device operates, air flows from the intake port to the blow port via the filter. As a result, the cooling device blows clean air into the case through the filter, so that it is possible to prevent external dirt and dust from entering the case.

In an embodiment of the present technology, the case may not be provided with an exhaust fan for exhausting the air inside the case to the outside of the case.

In one embodiment of the present technology, a component mounting apparatus includes a temperature sensor disposed inside a case for detecting the temperature inside the case, and a cooling device for adjusting the operating load of the cooling device based on the detection data of the temperature sensor. A device control unit may be further provided. According to such a configuration, since the operating load of the cooling device is controlled based on the temperature data detected by the temperature sensor, the inside of the case can be efficiently cooled. Also, energy consumption can be reduced because the load on the cooling device is adjusted according to the temperature.

In one embodiment of the present technology, the component mounting apparatus may further include a base to which the case can be attached. In addition, the cooling device is disposed within the base, and inside the base, the cooling device and the first cooling passage are connected, and the cooling air from the cooling device is supplied to the first cooling passage. A second cooling passage may be provided.

In one embodiment of the present technology, the component mounting apparatus may further include an attachment sensor that detects that the case is attached to the base. In this case, the cooling device may be configured to operate only when the attachment sensor detects that the case is attached to the base.

A component mounter 10 of an embodiment will be described with reference to FIGS. 1 to 3. FIG. The component mounter 10 is an example of a component mounter according to the technology disclosed in this specification, and is a device that mounts a component 2 on a board 4 . The component mounter 10 is also called a surface mounter or a chip mounter. The component mounter 10 is usually installed together with a solder printer, other component mounters, and board inspection machines to form a series of mounting lines. As shown in FIGS. 1 and 2, the component mounter 10 includes a base 10b and a component mounting module 10a installed on the base 10b.

Although FIG. 1 shows a state in which one component mounting module 10a is installed on the base 10b, a plurality of component mounting modules 10a can be installed on the base 10b. As shown in FIG. 3, the base 10b is equipped with a mounting sensor 19 and devices (for example, a cooling device 20) and components common to the plurality of component mounting modules 10a. The cooling device 20 cools control-system electrical component units 60 (described later) that are respectively installed in the plurality of component mounting modules 10a. The mounting sensor 19 is provided on the rear side of the base 10b corresponding to each of the plurality of component mounting modules 10a, and detects that the component mounting module 10a is mounted on the base 10b. The component mounting module 10a includes a board transfer section 30, a component mounting section 40, a component supply section 50, an operation panel 70, and a control system electrical component unit 60 that controls these devices 30, 40, 50, and 70. , a body cover 11 and a clamping device 18 . The main body cover 11 partially covers the board transfer section 30 , the component mounting section 40 , and the component supply section 50 . The body cover 11 is provided with an electrical component case 12 that houses the control system electrical component unit 60 . The electrical component case 12 is arranged below the substrate transfer section 30 and the component mounting section 40 . The clamp device 18 is provided on the lower surface of the electrical component case 12 and fixes the component mounting module 10a to the base 10b. A specific configuration of the clamping device 18 is not particularly limited, but for example, a clamping mechanism driven by an actuator can be adopted. In the component mounting module 10a, the board transfer section 30, the component mounting section 40, and the operation panel 70 are arranged in the upper portion, and the control system electrical component unit 60 is arranged in the lower portion. The component supply section 50 is arranged over the upper portion and the lower portion of the component mounting module 10a.

The mounter 10 includes a first cooling passage 16a and a second cooling passage 16b. The first cooling passage 16 a and the second cooling passage 16 b guide the cooling air of the cooling device 20 to the control system electrical component unit 60 . Here, the first cooling passage 16a is arranged inside the component mounting module 10a, and the second cooling passage 16b is arranged inside the base 10b. The second cooling passage 16b connects the cooling device 20 and the first cooling passage 16a. The first cooling passage 16 a extends from the second cooling passage 16 b toward the control system electrical component unit 60 .

The number of component-mounting modules 10a arranged on the base 10b is not particularly limited, but a plurality of component-mounting modules 10a can be mounted on the base 10b side by side in the X direction, and can be attached to and detached from the base 10b. It is The component mounter 10 is provided with a plurality of first cooling passages 16a and second cooling passages 16b corresponding to the number of component mounting modules 10a.

The board transfer section 30 is a device that carries the board 4 into the component mounting section 40 , positions the board 4 in the component mounting section 40 , and carries out the board 4 from the component mounting section 40 . The substrate conveying unit 30 includes, for example, a pair of belt conveyors 32, a supporting device (not shown) attached to the belt conveyors 32 and supporting the substrate 4 from below, and a driving device 34 for driving the belt conveyors 32. be The board 4 is positioned at a mounting position within the component mounter 10, and when the component 2 is mounted at the mounting position, the board 4 is conveyed from the mounting position to the outside of the component mounter 10. FIG. As described above, the mounting line including the component mounters 10 extends in the X direction. A pair of belt conveyors 32 extends along the X direction and conveys the substrate 4 in the X direction.

The component supply unit 50 is a device that supplies components 2 to be mounted on the board 4 . The component supply section 50 includes a feeder holding section 54 and a plurality of component feeders 52 . A plurality of component feeders 52 can be attached to and detached from the feeder holding portion 54 . A component feeder 52 accommodates a plurality of components 2 . The component feeder 52 is detachably attached to the feeder holding section 54 and supplies the component 2 to the component mounting section 40 . A specific configuration of the component feeder 52 is not particularly limited. Each component feeder 52 is, for example, a tape-type feeder that accommodates a plurality of components 2 on a winding tape, a tray-type feeder that accommodates a plurality of components 2 on a tray, or a plurality of components 2 randomly placed in a container. It can be any bulk feeder that contains it.

The component mounting section 40 is a device that mounts the component 2 supplied from the component supply section 50 on the board 4 carried in from the board transfer section 30 . The component mounting section 40 includes a moving device 42 , a moving base 44 and a mounting head 46 . The moving device 42 is a device that moves the mounting head 46 with respect to the substrate 4 and is driven by the control system electrical component unit 60 . The moving device 42 has an XY robot mechanism that drives the moving base 44 in the X and Y directions. The moving device 42 includes a guide rail for guiding the moving base 44, a moving mechanism for moving the moving base 44 along the guide rail, a motor for driving the moving mechanism, and the like. The mounting head 46 is attached to the moving base 44 and moved above between the pair of belt conveyors 32 and the component feeder 52 by the moving device 42 .

The mounting head 46 has a suction nozzle 48 that suctions the component 2 . The suction nozzle 48 is detachably attached to the mounting head 46 . The suction nozzle 48 is configured to be movable in the Z direction (vertical direction in the drawing) by an actuator (not shown) housed in the mounting head 46 . As described above, the suction nozzle 48 can move in the Z direction. In addition, the movement base 44 moves in the X direction and the Y direction (hereinafter referred to as the XY direction), so that the suction nozzle 48 moves in the XY direction. You can also move. Therefore, by moving the suction nozzle 48 in various directions, the component 2 can be sucked by the suction nozzle 48 and the component 2 sucked by the suction nozzle 48 can be mounted on the board 4 . Therefore, in order to mount the component 2 on the substrate 4 by the mounting head 46, first, the suction nozzle 48 is positioned in the XY direction with respect to the component 2 supplied from the component feeder 52, and the suction surface (lower surface) of the suction nozzle 48 is positioned. ) is brought into contact with the suction nozzle 48 . When the suction surface of the suction nozzle 48 contacts the component 2, the suction nozzle 48 sucks the component 2 and moves the suction nozzle 48 upward. Next, the moving device 42 positions the component 2 sucked by the suction nozzle 48 with respect to the substrate 4 . At this time, the position and orientation of the component 2 in the XY directions are adjusted so that the component 2 is positioned at a preset position on the substrate 4 . Next, the component 2 is attached to the substrate 4 by moving the suction nozzle 48 downward until the component 2 contacts the substrate 4 .

The operation panel 70 is an input device for receiving instructions from the operator and also a display device for displaying various information to the operator.

As shown in FIGS. 1 and 3, an electrical component case 12 is provided below the rear end of the main body cover 11, and the main body cover 11 is configured to be mountable on the base 10b. The electrical component case 12 is formed integrally with the body cover 11 . However, the electrical component case 12 may be provided as a component separate from the body cover 11 . The electrical component case 12 accommodates the control system electrical component unit 60 . A plurality of openings 12 a and vent holes 14 are provided on the side surface of the electrical component case 12 . The plurality of openings 12a are provided on the side surface of the electrical component case 12 extending along the Y direction. The plurality of openings 12a serve as work spaces for maintenance of the control system electrical component unit 60 and the like. A bracket 12b that covers the opening 12a is detachably attached to the opening 12a. The bracket 12b protects the control system electrical component unit 60 from dust, dirt, etc. outside the electrical component case 12. As shown in FIG. A vent hole 14 is provided on the side surface of the electrical component case 12 extending along the X direction and at the rear end of the mounter 10 . The air vent 14 communicates between the space inside the electrical component case 12 and the space outside the electrical component case 12 . An opening is provided at the front end of the main body cover 11, and a component supply section 50 is arranged. However, in FIG. 3, the main body cover 11 is illustrated with the component supply unit 50 omitted.

The control system electrical component unit 60 is communicably connected to the board transfer section 30 , the component mounting section 40 , the component supply section 50 and the operation panel 70 . The control system electrical component unit 60 of this embodiment is configured using heat-generating electronic components, and includes a control device 62 , a power distribution device 64 and a servo amplifier 66 . The control device 62 is configured using a computer having a CPU, ROM, and RAM. The control device 62 drives each device 30, 40, 50, 70, for example, by executing a pre-installed program. The servo amplifier 66 controls, for example, the number of rotations of the motors of the board transfer section 30 and the component mounting section 40 based on a control signal from the control device 62 . Accordingly, a relatively large current among the electronic components provided in the control system electrical component unit 60 flows through the servo amplifier 66 . Therefore, the temperature of the servo amplifier 66 tends to rise. The power distribution device 64 distributes the power supplied to the component mounter 10 to the devices 30, 40, 50, 62, 64, and 70, for example.

As described above, the cooling device 20 is arranged inside the base 10 b and cools the control system electrical component unit 60 . The cooling device 20 includes a cooling device body 22 , a cooling section 26 , a cooling device control section 28 and a temperature sensor 27 . The cooling device main body 22 is provided with an intake port 24a and an air blowing port 24b. The intake port 24 a sucks air from the outside of the mounter 10 and takes it into the cooling device main body 22 . A filter 25 is detachably provided at the intake port 24a. The filter 25 removes dirt, dust, and the like contained in the air sucked from the intake port 24a. The cooling unit 26 cools the air taken into the cooling device main body 22 from the intake port 24a. The air blowing port 24 b sends out the cooling air cooled by the cooling unit 26 to the outside of the cooling device main body 22 . Cooling passages 16a and 16b are connected to the blower port 24b. Therefore, the cooling air sent out from the air blowing port 24b passes through the second cooling passage 16b and the first cooling passage 16a in this order, and cools the control system electrical component unit 60. As shown in FIG. The temperature sensor 27 is arranged inside the electrical component case 12 . In this embodiment, the temperature sensor 27 is provided near the servo amplifier 66, which tends to generate heat. A temperature sensor 27 detects the temperature inside the electrical component case 12 . The cooling device control unit 28 is communicably (wired or wirelessly) connected to the temperature sensor 27 and can acquire the temperature detected by the temperature sensor 27 . The cooling device control unit 28 adjusts the operating load of the cooling device 20 based on the temperature detected by the temperature sensor 27 . Specifically, when the temperature detected by the temperature sensor 27 is high, the cooling device control unit 28 increases the amount of cooling air blown by the cooling device 20 . When the temperature detected by the temperature sensor 27 is low, the amount of cooling air blown by the cooling device 20 is reduced, or the operation of the cooling device 20 is stopped. Further, the cooling device 20 is configured to operate only when the mounting sensor 19 detects that the component mounting module 10a is mounted on the base 10b. That is, the cooling device control unit 28 is communicably (wired or wirelessly) connected to the mounting sensor 19 . The mounting sensor 19 outputs a signal to the cooling device control section 28 when it detects that the component mounting module 10a is fixed on the base 10b. The cooling device control unit 28 puts the cooling device 20 into an operable state based on the signal from the mounting sensor 19 . Therefore, the cooling device 20 does not operate unless a signal from the mounting sensor 19 is input to the cooling device control section 28 .

In the mounter 10 of this embodiment, a cooling device 20 is arranged outside the electrical component case 12 (in this embodiment, inside the base 10b) to cool the control system electrical component unit 60. FIG. A first cooling passage 16a is provided inside the electrical component case 12, and cooling air is supplied from the cooling device 20 to the inside of the electrical component case 12 via the first cooling passage 16a. Therefore, since the cooling air is directly supplied from the cooling device 20 to the inside of the electrical component case 12 , external air is less likely to enter the electrical component case 12 through the gaps in the electrical component case 12 . That is, the control-system electrical component unit 60 can be cooled without dust or dirt entering the electrical component case 12 . The cooling air supplied from the cooling device 20 to the inside of the electrical component case 12 cools the control system electrical component unit 60, and then is exhausted to the outside of the electrical component case 12 through the opening 12a of the electrical component case 12 and the air vent 14. be.

In this embodiment, the control system electrical component unit 60 can be cooled by the cooling device 20 described above. Therefore, it is not always necessary to provide the exhaust fan which is equipped in the conventional mounter 10 . Therefore, it is possible to eliminate the possibility that air excessively flows into the electrical component case 12 from the outside by the exhaust fan, and that dirt and dust enter the electrical component case 12 from the outside.

In this embodiment, the electrical component case 12 has an opening 12 a and a vent 14 . Therefore, when the cooling device 20 operates, the cooling air supplied from the cooling device 20 to the inside of the electrical component case 12 is discharged to the outside of the electrical component case 12 through the opening 12a and the air vent 14 . However, since the cooling air is also discharged through the gaps in the electrical component case 12, the opening 12a and the vent 14 may not necessarily be provided in the electrical component case 12. FIG.

In this embodiment, the cooling device 20 has an intake port 24a, a cooling section 26, and an air blowing port 24b through which the cooling air cooled by the cooling section 26 is delivered. A filter 25 is provided at the intake port 24a. According to such a configuration, when the cooling device 20 operates, cooling air flows from the intake port 24a through the filter 25 to the blowing port 24b. As a result, the cooling device 20 blows clean air into the electrical component case 12 through the filter 25 , so external dirt and dust can be prevented from entering the electrical component case 12 .

In this embodiment, a temperature sensor 27 is arranged inside the electrical component case 12 . Cooling device 20 adjusts the operating load of cooling device 20 based on the temperature detected by temperature sensor 27 . Since the operating load of the cooling device 20 is controlled based on the temperature data detected by the temperature sensor 27, the inside of the electrical component case 12 can be efficiently cooled. Also, energy consumption can be reduced because the load of the cooling device 20 is adjusted according to the detected temperature. In this embodiment, the temperature sensor 27 and the cooling device controller 28 are connected so as to be directly communicable, but the present invention is not limited to this. For example, the temperature sensor 27 and the cooling device control unit 28 may be communicably connected (wired and/or wirelessly) via the control device 62 .

In this embodiment, a second cooling passage 16b is provided in the base 10b, and a first cooling passage 16a is provided in each of the plurality of component mounting modules 10a. Therefore, one cooling device 20 can cool each control system electrical component unit 60 of a plurality of component mounting modules 10a arranged on the base 10b. However, in the technology disclosed in this specification, a plurality of cooling devices 20 may be arranged in the base 10b, and cooling air may be supplied from these cooling devices 20 to the corresponding component mounting modules 10a.

Further, as illustrated in FIG. 3, the first cooling passage 16a branches into three passages and extends toward the control device 62, the power distribution device 64, and the servo amplifier 66, respectively. However, the number of passages from which the first cooling passage 16a branches is not limited to three, and may be two or more. The first cooling passage 16a can be branched according to the number of heat-generating electronic components that need to be cooled.

(correspondence relationship)
As described above, the "component mounter 10" of this embodiment is an example of the "component mounter" in the technique disclosed in this specification. Similarly, the "base 10b", the "control system electrical component unit 60", and the "electrical component case 12" are examples of the "base", the "heat generating unit", and the "case" in the technology disclosed in this specification, respectively. is.

Although several specific examples have been described in detail above, these are merely examples and do not limit the scope of the claims. The technology described in the claims includes various modifications and changes of the specific examples illustrated above. The technical elements described in this specification or drawings exhibit technical usefulness alone or in various combinations.

2: Component 4: Board 10: Component Mounting Machine 10a: Component Mounting Module 10b: Base 11: Body Cover 12: Electrical Component Case 12a: Opening 12b: Bracket 14: Air Vent 16a: First Cooling Passage 16b: Second Cooling Passage 18: Clamp device 19: Mounting sensor 20: Cooling device 22: Cooling device main body 24a: Intake port 24b: Blower port 25: Filter 26: Cooling unit 27: Temperature sensor 28: Cooling device control unit 30: Substrate conveying unit 32: Belt Conveyor 34: Drive device 40: Component mounting section 42: Moving device 44: Moving base 46: Mounting head 48: Suction nozzle 50: Component supply section 52: Component feeder 54: Feeder holding section 60: Control system electrical component unit 62: Control Device 64: Power distribution device 66: Servo amplifier 70: Operation panel

Claims (7)

A component mounting apparatus for mounting components on a substrate ,
a case ;
a heat-generating unit disposed inside the case ;
a cooling device disposed outside the case for supplying cooling air to the inside of the case ;
a first cooling passage disposed inside the case for guiding cooling air supplied from the cooling device to the inside of the case to the exothermic unit ;
The cooling device has an intake port for sucking external air, a cooling unit for cooling the air sucked from the intake port, and an air blow port for sending out the cooling air cooled by the cooling unit, and the intake port. is provided with a filter,
Component mounting equipment. A component mounting apparatus for mounting components on a substrate,
a case;
a heat-generating unit disposed inside the case;
a cooling device disposed outside the case for supplying cooling air to the inside of the case;
a first cooling passage disposed inside the case for guiding cooling air supplied from the cooling device to the inside of the case to the exothermic unit;
a base to which the case can be attached,
The cooling device is disposed within the base,
A second cooling passage that connects the cooling device and the first cooling passage and supplies cooling air from the cooling device to the first cooling passage is provided inside the base.
Component mounting equipment. further comprising a mounting sensor that detects that the case is attached to the base;
The cooling device is configured to operate only when the attachment sensor detects that the case is attached to the base .
The component mounting apparatus according to claim 2 . further comprising a component mounting unit that mounts the component on the substrate ;
4. The component mounting apparatus according to any one of claims 1 to 3 , wherein said exothermic unit is a control device that controls said component mounting section , and includes at least one exothermic electronic component . The case has a vent that communicates between a space inside the case and a space outside the case ,
5. The air supplied from the cooling device to the inside of the case is discharged to the outside of the case from the vent when the cooling device operates. The component mounting device according to the item . 6. The component mounting apparatus according to claim 1, wherein said case is not provided with an exhaust fan for exhausting air inside said case to the outside of said case . a temperature sensor disposed inside the case for detecting the temperature inside the case ;
a cooling device control unit that adjusts the operating load of the cooling device based on the detection data of the temperature sensor ;
The component mounting apparatus according to any one of claims 1 to 6 .

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